Patents by Inventor Julius Ming Ling Tsai

Julius Ming Ling Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF ENCAPSULATING A MICRO-ELECTROMECHANICAL (MEMS) DEVICE
    Publication number: 20140147955
    Abstract: A method for encapsulating a micro-electromechanical (MEMS) device, the method comprising: providing a sacrificial layer arrangement over the MEMS device; providing a first encapsulation layer over the sacrificial layer arrangement, the first encapsulation layer defining at least one aperture; providing a second encapsulation layer over the at least one aperture, the second encapsulation layer being provided to allow removal of the sacrificial layer arrangement around the second encapsulation layer; and removing the sacrificial layer arrangement through the at least one aperture to allow the second encapsulation layer to cover the at least one aperture thereby encapsulating the MEMS device.
    Type: Application
    Filed: November 29, 2013
    Publication date: May 29, 2014
    Applicant: Agency for Science, Technology and Research
    Inventors: Jae-Wung Lee, Jaibir Sharma, Navab Singh, Julius Ming Ling Tsai