Abstract: Provided is a coffee vending machine including: a plurality of capsule stacking parts arranged in a lattice form to stack capsules therein in a first direction, a capsule feeding unit disposed at the centers of the bottoms of the capsule stacking parts to feed the capsules quantitatively, a coffee brewing part for seating the capsule fed from the capsule feeding unit, feeding water to the capsule, and brewing coffee to be provided for a consumer, and a cup discharging part for discharging a cup in which the coffee is contained to the outside. The coffee brewing part allows the capsule to be seated onto a seating groove when first and second portion seating parts are adjacent thereto or contacted with each other and allows the capsule to be freely fallen through a space formed between the first and second portion seating parts when they are spaced apart from each other.

Abstract: Provided is a coffee vending machine including: a plurality of capsule stacking parts arranged in a lattice form to stack capsules therein in a first direction, a capsule feeding unit disposed at the centers of the bottoms of the capsule stacking parts to feed the capsules quantitatively, a coffee brewing part for seating the capsule fed from the capsule feeding unit, feeding water to the capsule, and brewing coffee to be provided for a consumer, and a cup discharging part for discharging a cup in which the coffee is contained to the outside. The coffee brewing part allows the capsule to be seated onto a seating groove when first and second portion seating parts are adjacent thereto or contacted with each other and allows the capsule to be freely fallen through a space formed between the first and second portion seating parts when they are spaced apart from each other.

Abstract: The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more particularly, to such a semiconductor package having an electromagnetic interference (EMI)-shielding function, a manufacturing method thereof and a jig for use in a plasma sputtering, in which a nickel alloy is coated on the surface of a semiconductor package by a sputtering method so as to shield electromagnetic interference (EMI) generated from the semiconductor package.

Abstract: The present invention relates to relates to a semiconductor package having a function of shielding electromagnetic interference (EMI), a manufacturing method thereof and a jig, and more particularly, to such a semiconductor package having an electromagnetic interference (EMI)-shielding function, a manufacturing method thereof and a jig for use in a plasma sputtering, in which a nickel alloy is coated on the surface of a semiconductor package by a sputtering method so as to shield electromagnetic interference (EMI) generated from the semiconductor package.