Patents by Inventor Jumbo Chuang

Jumbo Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7271609
    Abstract: Described is a method for automatically generating a wafer prober file whereby testing parameters and die identities can be established for testing a complete semiconductor wafer and whereby acceptable or rejected dies can be identified and correlated later with where the good or bad dies are physically located on a wafer-under-test.
    Type: Grant
    Filed: May 16, 2005
    Date of Patent: September 18, 2007
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Kevin Liao, Edward Chen, Win Hung, Jumbo Chuang, Chang-Chi Hsu, Chia-Ping Liu, Chun-Chieh Hsiao
  • Publication number: 20060255824
    Abstract: Described is a method for automatically generating a wafer prober file whereby testing parameters and die identities can be established for testing a complete semiconductor wafer and whereby acceptable or rejected dies can be identified and correlated later with where the good or bad dies are physically located on a wafer-under-test.
    Type: Application
    Filed: May 16, 2005
    Publication date: November 16, 2006
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kevin Liao, Edward Chen, Win Hung, Jumbo Chuang, Chang-Chi Hsu, Chia-Ping Liu, Chun-Chieh Hsiao