Abstract: A processor-fault reproduction method includes: determining a heating time of a processor taken using a heating program which heats the processor to a fault occurrence temperature when a fault occurs from a current temperature based on first information regarding the current temperature of the processor, second information regarding a power consumption value and a temperature of the processor before the fault occurs and a refrigerant temperature of a cooling medium to cool the processor, third information regarding the fault occurrence temperature, and fourth information regarding a power consumption value of the processor during execution of the heating program; determining an execution time by adding a fault reproduction time taken by a fault reproducing program which reproduces a state of the processor when the fault occurs to the heating time; and reporting the execution time to a job scheduler with a request to execute the heating and fault reproducing programs.

Abstract: Information processing equipment includes: arithmetic processing units configured to execute jobs, respectively; a supply channel through which a coolant flows, the coolant absorbing heat generated by the arithmetic processing units; a circulating device configured to circulate the coolant in the supply channel through an outlet to output the coolant; and a job allocation device configured to allocate a job, when allocating the jobs to the arithmetic processing units, to a job non-execution arithmetic processing unit, if any, that is the arithmetic processing unit executing no job among the arithmetic processing units, the job non-execution arithmetic processing unit being positioned closer to the outlet side on the supply channel.

Abstract: A processor-fault reproduction method includes: determining a heating time of a processor taken using a heating program which heats the processor to a fault occurrence temperature when a fault occurs from a current temperature based on first information regarding the current temperature of the processor, second information regarding a power consumption value and a temperature of the processor before the fault occurs and a refrigerant temperature of a cooling medium to cool the processor, third information regarding the fault occurrence temperature, and fourth information regarding a power consumption value of the processor during execution of the heating program; determining an execution time by adding a fault reproduction time taken by a fault reproducing program which reproduces a state of the processor when the fault occurs to the heating time; and reporting the execution time to a job scheduler with a request to execute the heating and fault reproducing programs.

Abstract: An electronic apparatus includes: a flowpath through which a liquid flows; a heat-generating body that is cooled by the liquid; a liquid temperature measuring device that measures a temperature of the liquid; a temperature measuring device that measures a temperature of the heat-generating body; a heat generation amount measuring device that measures a heat generation amount of the heat-generating body; a storage apparatus that stores information representing a relationship between a temperature of the liquid, a temperature of the heat-generating body, a heat generation amount of the heat-generating body, and a flow rate of the liquid; and a processing apparatus that calculates the flow rate of liquid from the temperature of the liquid measured by the liquid temperature measuring device, the temperature of the heat-generating body measured by the temperature measuring device, and the heat generation amount of the heat-generating body based on information inside the storage apparatus.

Abstract: A heat receiving apparatus includes a heat receiver including: a case that is provided at its inside with a flow path through which a refrigerant flows, and that conducts heat from a heat-generating part arranged outside the case; and a valve that is capable of changing a cross sectional area of a part of the flow path in a state where the refrigerant flows through the flow path.

Abstract: A system that cools an electric component by a cooling medium cooled by a heat exchanger, the system includes a pipe through which a cooling medium to cool the electronic component flows; a metal member configured to be coupled with an outer surface of the pipe; a Peltier device configured to cool the metal member to a temperature lower than a temperature of the outer surface of the pipe; a detector that detects dew condensation of outer air occurring on the metal member; and a processor that lowers the temperature of the cooling medium, and stops lowering a temperature of cooling medium when the occurrence of dew condensation of outer air on the metal member is detected.

Abstract: An information processing device includes arithmetic processing devices, a cooling device, and a job assignment device. Each of the arithmetic processing devices is configured to perform a job. The cooling device is connected to the arithmetic processing devices. The cooling device includes a circulation unit, a cooling unit, and an adjustment unit. The circulation unit is configured to circulate refrigerant through a supply route. The refrigerant absorbs heat generated by the arithmetic processing devices. The cooling unit is configured to cool the refrigerant circulated by the circulation unit. The adjustment unit is configured to adjust, in response to a temperature of the refrigerant, a cooling capacity of the cooling unit to cool the refrigerant. The job assignment device includes a processor configured to control, on the basis of cooling capacity information indicating the cooling capacity, job charging to the arithmetic processing devices.

Abstract: Information processing equipment includes: arithmetic processing units configured to execute jobs, respectively; a supply channel through which a coolant flows, the coolant absorbing heat generated by the arithmetic processing units; a circulating device configured to circulate the coolant in the supply channel through an outlet to output the coolant; and a job allocation device configured to allocate a job, when allocating the jobs to the arithmetic processing units, to a job non-execution arithmetic processing unit, if any, that is the arithmetic processing unit executing no job among the arithmetic processing units, the job non-execution arithmetic processing unit being positioned closer to the outlet side on the supply channel.

Abstract: A heat receiving apparatus includes a heat receiver including: a case that is provided at its inside with a flow path through which a refrigerant flows, and that conducts heat from a heat-generating part arranged outside the case; and a valve that is capable of changing a cross sectional area of a part of the flow path in a state where the refrigerant flows through the flow path.

Abstract: An electronic apparatus includes: a flowpath through which a liquid flows; a heat-generating body that is cooled by the liquid; a liquid temperature measuring device that measures a temperature of the liquid; a temperature measuring device that measures a temperature of the heat-generating body; a heat generation amount measuring device that measures a heat generation amount of the heat-generating body; a storage apparatus that stores information representing a relationship between a temperature of the liquid, a temperature of the heat-generating body, a heat generation amount of the heat-generating body, and a flow rate of the liquid; and a processing apparatus that calculates the flow rate of liquid from the temperature of the liquid measured by the liquid temperature measuring device, the temperature of the heat-generating body measured by the temperature measuring device, and the heat generation amount of the heat-generating body based on information inside the storage apparatus.

Abstract: A system that cools an electric component by a cooling medium cooled by a heat exchanger, the system includes a pipe through which a cooling medium to cool the electronic component flows; a metal member configured to be coupled with an outer surface of the pipe; a Peltier device configured to cool the metal member to a temperature lower than a temperature of the outer surface of the pipe; a detector that detects dew condensation of outer air occurring on the metal member; and a processor that lowers the temperature of the cooling medium, and stops lowering a temperature of cooling medium when the occurrence of dew condensation of outer air on the metal member is detected.