Patents by Inventor Jumpei SAWADA

Jumpei SAWADA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230055157
    Abstract: A method for manufacturing a thin sheet-like bonding member, including applying a paste including first particles including a first metal, second particles including a second metal having a lower melting point than the first metal, and a solvent to a surface of a base material made of a substance that does not react with the second metal; heating the paste at a temperature lower than a melting point of the first metal and higher than the melting point of the second metal to form a thin sheet-like bonding member on the surface of the base material; and peeling the thin sheet-like bonding member from the base material to obtain the thin sheet-like bonding member.
    Type: Application
    Filed: February 15, 2021
    Publication date: February 23, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Issei OTANI, Hiroaki TATSUMI, Jumpei SAWADA
  • Publication number: 20230020778
    Abstract: The control method of a ship is used for the ship. The ship is equipped with a plurality of power sources including a first power source and a second power source, and has a plurality of propulsion modes in which a power source used for propulsion of a hull is different between the plurality of power sources. The control method of the ship includes adjusting an output value related to a propulsive force of a hull to a value corresponding to an operation amount of an operation acceptor and changing a correspondence relation between the operation amount and the output value in accordance with a propulsion mode.
    Type: Application
    Filed: July 8, 2022
    Publication date: January 19, 2023
    Applicant: Yanmar Holdings Co., Ltd.
    Inventors: Tomohiro SAWANO, Toru HONJO, Kenji OGATA, Atsushi YOSHIDA, Yosuke SHIMIZU, Gakuji TAMURA, Yuki KAJIKAWA, Jumpei SAWADA