Abstract: A manufacturing method of an image pickup apparatus for endoscope includes manufacturing an optical member in which a plurality of optical devices are stacked, and an image pickup member including an image pickup device having a light receiving surface, measuring a position of an image-forming plane on which an object image, light of which is focused by the optical member, is formed, and fixing the optical member and the image pickup member in a state where an interval is adjusted so that a measured position of the image-forming plane becomes a position of the light receiving surface by performing curing processing on a transparent resin disposed to fill an optical path between the optical member and the image pickup member.

Abstract: A method of manufacturing a lens unit includes: producing a stacked wafer including a plurality of optical wafers that include at least one optical wafer in which a light shielding layer is disposed and having a first principal surface and a second principal surface; forming grooves in a grid pattern on the first principal surface or the second principal surface of the stacked wafer using a dicing blade, in which the grooves have a depth at which the light shielding layer is cut; and dividing the stacked wafer into a plurality of lens units by performing stealth dicing using a filamentation laser along the grooves.

Abstract: An image pickup apparatus for endoscope includes: an image pickup member provided with a plurality of image pickup side faces; a first optical member provided with first side faces; a first bonding layer bonding together the image pickup member and the first optical member; a second optical member provided with second side faces; and a second bonding layer bonding together the second optical member and the first optical member, in which a plurality of first side faces include first near side faces closer to an optical axis than are the second side faces and the image pickup side faces, and the image pickup apparatus for endoscope further includes a sealing resin covering the first near side faces, at least part of the first bonding layer, and the second bonding layer.

Abstract: A stacked lens includes: a first optical device; a second optical device disposed on an optical axis of the first optical device; and an adhesive layer bonding the first optical device and the second optical device and including a projection projecting outside a side surface of the first optical device and a side surface of the second optical device.

Abstract: An endoscope includes an optical laminate and an image sensor. The optical laminate includes a first optical member that is a glass lens where an optical window is formed in a planar substrate, including a recessed portion or a protruding portion around the optical window, and a second optical member having a flat surface facing the substrate of the first optical member, and including a protrusion made of resin for being fitted with the recessed portion or the protruding portion. The flat surface of the second optical member is a surface of a glass substrate on the first optical member side. A resin lens of the second optical member is arranged on a surface on an opposite side of the flat surface. A flat portion excluding the optical window and the recessed portion or the protruding portion is in contact with the flat surface of the second optical member.

Abstract: An image pickup apparatus for endoscope includes: an image pickup member provided with a plurality of image pickup side faces; a first optical member provided with first side faces; a first bonding layer bonding together the image pickup member and the first optical member; a second optical member provided with second side faces; and a second bonding layer bonding together the second optical member and the first optical member, in which a plurality of first side faces include first near side faces closer to an optical axis than are the second side faces and the image pickup side faces, and the image pickup apparatus for endoscope further includes a sealing resin covering the first near side faces, at least part of the first bonding layer, and the second bonding layer.

Abstract: A manufacturing method of an image pickup apparatus for endoscope includes manufacturing an optical member in which a plurality of optical devices are stacked, and an image pickup member including an image pickup device having a light receiving surface, measuring a position of an image-forming plane on which an object image, light of which is focused by the optical member, is formed, and fixing the optical member and the image pickup member in a state where an interval is adjusted so that a measured position of the image-forming plane becomes a position of the light receiving surface by performing curing processing on a transparent resin disposed to fill an optical path between the optical member and the image pickup member.

Abstract: An image pickup apparatus includes: an image pickup device with a light receiving portion being formed on a light receiving face; cover glass bonded to the light receiving face; and a wiring board bonded to a back face of the image pickup device; wherein an alignment mark is present on each of two orthogonal side faces, the alignment mark being at a predetermined relative position relative to the light receiving portion.

Abstract: An image pickup apparatus for an endoscope includes: an image pickup device including a row of external electrodes provided on an end portion of a light receiving surface; and a wiring board including end portion electrodes ultrasonically bonded to the external electrodes, in which a plurality of grooves are formed in a back face of the image pickup device, and the plurality of grooves are inclined relative to a vibration direction of ultrasonic vibration during the ultrasonic bonding.

Abstract: A method for manufacturing an endoscope image pickup module includes a process of creating a transparent plate with support plates in which the support plates are disposed on side faces of cover glass, a first resin disposing process of disposing uncured first resin in a light receiving section of an image pickup device, a process of fixing a jig to the support plates, a positioning process of arranging the transparent plate with support plates on the image pickup device so that the cover glass covers the light receiving section but does not cover connection electrodes, a process of radiating UV light from above a first principal surface of the cover glass and curing the first resin and a process of separating the support plates from the transparent plate with support plates.

Abstract: A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

Abstract: An image pickup apparatus includes: an image pickup device with a light receiving portion being formed on a light receiving face; cover glass bonded to the light receiving face; and a wiring board bonded to a back face of the image pickup device; wherein an alignment mark is present on each of two orthogonal side faces, the alignment mark being at a predetermined relative position relative to the light receiving portion.

Abstract: An image pickup module includes an image pickup device including a light receiving section and an external electrode on a light receiving surface on which an image pickup optical system including an optical axis forms an object image, and a cover glass including a first main surface and a second main surface, the second main surface being made to adhere to the light receiving surface via resin, and covering the light receiving section and not covering the external electrode, in which in the cover glass, the second main surface is smaller than the first main surface, and the resin sticks out into a space formed by extending the first main surface in a direction toward the second main surface on the optical axis, to form a fillet between the image pickup device and the cover glass.

Abstract: An endoscope includes an image pickup module placed in a distal end portion, the image pickup module including an image pickup device to which a cover glass is bonded, a positioning bump placed on the image pickup device, and a recessed portion formed in the cover glass, an upper portion of the positioning bump being inserted into the recessed portion, and a relative position in three axial directions of the image pickup device and the cover glass being defined by an abutment position of the positioning bump and the recessed portion.

Abstract: A method for manufacturing an endoscope image pickup module includes a process of creating a transparent plate with support plates in which the support plates are disposed on side faces of cover glass, a first resin disposing process of disposing uncured first resin in a light receiving section of an image pickup device, a process of fixing a jig to the support plates, a positioning process of arranging the transparent plate with support plates on the image pickup device so that the cover glass covers the light receiving section but does not cover connection electrodes, a process of radiating UV light from above a first principal surface of the cover glass and curing the first resin and a process of separating the support plates from the transparent plate with support plates.

Abstract: An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.

Abstract: An image pickup apparatus for an endoscope includes: an image pickup device including a row of external electrodes provided on an end portion of a light receiving surface; and a wiring board including end portion electrodes ultrasonically bonded to the external electrodes, in which a plurality of grooves are formed in a back face of the image pickup device, and the plurality of grooves are inclined relative to a vibration direction of ultrasonic vibration during the ultrasonic bonding.

Abstract: A method of manufacturing a wiring board includes a stacking process in which N (N is an integer equal to or greater than 2) wiring layers, end portions of which include linear conductor patterns, are stacked, with the end portions superimposed, via substrates (insulating layers) provided among the wiring layers and a laminated plate is manufactured and a removing process in which the insulating layers around the end portions of the conductor patterns of the laminated plate are removed to machine the end portions into N flying leads projecting from an end face.

Abstract: An image pickup apparatus is configured with an image pickup device on which a plurality of bumps are arranged in line on an outer circumferential portion of a light receiving surface; and a flexible wiring board including a plurality of inner leads each of which is configured with a distal end portion, a bending portion and a rear end portion, the distal end portion being compression-bonded to a bump, and the rear end portion being arranged parallel to a side face of the image pickup device with the bending portion interposed between the distal end portion and the rear end portion. A height of a light receiving portion side of the bumps is lower than a height of a side face side; and each of the inner leads is plastically transformed according to a shape of a top face of the bumps.