Abstract: Providing a fixing structure for parts of optical element by which fixing of parts of optical element with high accuracy can be achieved after positional adjustment in axes with an arrangement the positional adjustment in axes of parts of optical element is easily achieved before the fixing of the parts of optical element. The fixing structure comprises lens 3 having an edge surface which is a side surface surrounding a light beam passing surface; an intermediate holding member 5 having a first attaching surface 5a which is facing to the side surface and having a second attaching surface 5b which has a different angle from said first attaching surface 5a; and a housing 2 having an attaching surface 2c which is facing to the second attaching surface 5b; the housing 2 and the lens 3 which has been adjusted the positional relation to the housing 2 are adhered and fixed through the intermediate holding member 5.

Abstract: Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.

Abstract: Disclosed is a solid state image sensing device. The solid state image sensing device comprises a semiconductor chip for image sensing which has at least one of photoelectric conversion element line; and a package into which the semiconductor chip is received. The package is composed of an insulating package body which has the semiconductor chip mounted on a flat inner bottom surface of a concave portion; a transparent cover glass to be fixed on an upper surface of an outer frame of the concave portion for sealing the concave portion; and a lead frame which is brought out to the outside of the package body. The solid state image sensing device has a reference plane for attaching onto an image input apparatus is arranged on the package. The reference plane for attaching is made parallel to the inner bottom surface of the concave portion on which the semiconductor chip is mounted.

Abstract: In a solid-state imaging device and its production method according to the present invention, a solid-state image sensor has an effective light-receiving region on a circuit formation surface provided in a face-down condition. A transparent substrate has a conductor pattern provided thereon to confront the circuit formation surface of the image sensor. A transparent adhesive agent is provided between the image sensor and the substrate and formed into a thin layer, the adhesive agent covering the light-receiving region of the image sensor. A plurality of bumps are provided on one of the image sensor and the substrate to interconnect the image sensor and the conductor pattern of the substrate.

Abstract: Providing a fining structure for parts of optical element by which fiing of parts of optical element with high accuracy can be achieved aer positional adjustment in axes with an arrangement the positional adjustment in axes of parts of optical element is easily achieved before the fixingg of the pars of optical element. The fing structure comprises lens 3 having an edge surface which is a side surface surrounding a light beam passing surface; an intermediate holding member 5 having a first attaching surface 5a which is facing to the side surface and having a second attaching surface 5b which has a different angle from said first attaching surface 5a; and a housing 2 having an attaching surface 2c which is faciag to the second attaching surface 5b; the housing 2 and the lens 3 which has been adjusted the positional relation to the housing 2 are adhered and hfxed through the intermediate holding member 5.

Abstract: An automatic wiring machine of a corona discharge device with a wire wound around a spool by displacement of a head, comprises a head for wiring along a wiring pattern of the corona discharge device set on a palette and holding the wire, a tension device for applying a required tension to the supplied wire when the head carries out wiring, a welding machine for welding an arranged wire onto the corona discharge device and fixing the wire and a cutting device for cutting an unnecessary portion of the wire.