Abstract: A semiconductor memory device includes a semiconductor substrate, a first insulating film provided above the semiconductor substrate, a first conductive film provided above the first insulating film, a plurality of first electrode films provided above the first conductive film and stacked to be separated from each other, a semiconductor member extending in a stacking direction of the plurality of first electrode films, and a charge storage member provided between the semiconductor member and one of the plurality of first electrode films. The first conductive film includes a main portion disposed at least below the plurality of first electrode films, and a fine line portion extending from the main portion toward an end surface side of the semiconductor substrate. A width of the fine line portion is narrower than a width of the main portion.

Abstract: In order to realize a movable mechanism capable of being configured more compactly and also capable of ensuring higher safety. A motor is provided. Also, an electrically active part is provided with an insulating structure so that insulating properties between the electrically active part and one or more conductors near the electrically active part satisfy a certain safety standard regarding medical electrical equipment.

Abstract: An e-book reader in which destruction of a driver circuit at the time when a flexible panel is handled is inhibited. In addition, an e-book reader having a simplified structure. A plurality of flexible display panels each including a display portion in which display control is performed by a scan line driver circuit and a signal line driver circuit, and a binding portion fastening the plurality of display panels together are included. The signal line driver circuit is provided inside the binding portion, and the scan line driver circuit is provided at the edge of the display panel in a direction perpendicular to the binding portion.

Abstract: A support unit for a medical camera head is described. The support unit is configured to rotate about an axis and including: an adapter configured to detachably mount a plurality of different medical scopes thereon; a light source supply system configured to supply light to the medical scope when mounted, the light source supply system being configured to pass through the axis; and an image sensor configured to capture an image from the medical scope, and wherein the axis is in the imaging direction of the image sensor.

Abstract: [Overview] [Problem to be Solved] To make it possible to appropriately rotate an endoscope. [Solution] There is provided an endoscope including: a main body including a coupler to which a cable is attached; a tubular section having a tubular form; a reflector having a reflection surface that reflects light introduced from the coupler to inside of the main body and introduces the light to inside of the tubular section; a first optical system that transmits the light introduced by the reflector to the inside of the tubular section to a front-end portion of the tubular section and irradiates a subject with the light from the front-end portion; and a second optical system that transmits reflected light of the subject from the front-end portion of the tubular section to the main body side. The coupler is provided to be rotatable in the main body around a central axis of the tubular section with respect to another portion. The cable being coupled to a light source.

Abstract: A constant temperature water supply apparatus includes a temperature adjustment unit that circulates cooling water and adjusts the temperature of a spindle unit of a processing apparatus and a processing water temperature adjustment unit. The temperature adjustment unit includes a pump that sends the cooling water to the spindle unit, a cooling water cooling unit, a first pipe that connects the pump and the cooling unit, a second pipe that connects the cooling unit and the spindle unit, and a third pipe that connects the spindle unit and the pump. The processing water temperature adjustment unit includes a processing water pipe that has one end connected to a water source and supplies processing water from the other end side to a processing tool and a heat exchange unit on the processing water pipe.

Abstract: The present invention aims to make it capable of holding organs more safely. Provided is a medical support arm apparatus, including: an arm unit (510) whose driving is controlled by force control; and a retractor, provided on a front end of the arm unit (510), that holds an organ of a patient during surgery.

Abstract: A square waveguide (1) has four ridges (6a, 6b, 7a, 7b). The cross section of the square waveguide (1) perpendicular to a waveguide axial direction is square. Inside the square waveguide (1), two rectangular waveguide terminals (4, 5) are formed by partitioning the inside along the waveguide axial direction. A septum phase plate (2) formed to get narrower stepwisely as its gets closer to a square waveguide terminal (3) opposite to the rectangular waveguide terminals (4, 5) is provided. A projecting portion (8) is provided on a part of a ridge (7b) formed on a ridge-side wall surface opposite to a wall surface, the septum phase plate (2) being joined to the wall surface in a part where the septum phase plate has largest width, the projecting portion (8) being larger than other parts of the ridge (7b) in a cross-sectional shape perpendicular to the waveguide axial direction.

Abstract: A wireless communication semiconductor device includes a circuit board, a semiconductor chip mounted on the circuit board, a thin film transistor provided on the circuit board, and an antenna provided on the circuit board. Even if a different unique ID is assigned to each of the wireless communication semiconductor devices, as compared with silicon-based wireless communication semiconductor devices, a manufacturing cost per device is sufficiently reduced, and the reduction in operation speed and reliability is sufficiently prevented.

Abstract: Improving safety against peeling-off of a semiconductor device from an article and omitting an adhesion work of the semiconductor device to the article are made possible. Provided is semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The one or more components are directly fixed on a surface of article. Provided is a manufacturing method of semiconductor device including one or more components selected from a group including semiconductor chip, thin film transistor, antenna, and wiring. The manufacturing method includes at least one of following step P1 and step Q1: step P1 of directly mounting the semiconductor chip on a surface of an article; and step Q1 of directly forming one or more components selected from a group including the thin film transistor, the antenna, and the wiring on the surface of the article by a printing method.

Abstract: A semiconductor memory device includes a semiconductor substrate including a diode formed in an upper layer portion of the semiconductor substrate, a first insulating film provided above the semiconductor substrate, a first conductive film provided above the first insulating film and coupled to the diode, a stacked body provided above the first conductive film, an insulator and an electrode film being stacked alternately in the stacked body, a semiconductor member piercing the stacked body and being connected to the first conductive film, and a charge storage member provided between the electrode film and the semiconductor member.

Abstract: In one embodiment, a semiconductor device includes a first chip and a second chip. The first chip includes a first substrate, a control circuit provided on the first substrate, and a first pad provided above the control circuit and electrically connected to the control circuit. The second chip includes a second pad provided on the first pad, a plug provided above the second pad, extending in a first direction, and including a portion that decreases in diameter in a cross-section perpendicular to the first direction with increasing distance from the first substrate, and a bonding pad provided on the plug, intersecting with the first direction, and electrically connected to the second pad by the plug.

Abstract: The present disclosure provides a vibration power generation device capable of generating large electric power relative to an amount of displacement of a portion of a specimen. Vibration power generation device according to the present invention includes piezoelectric part and displacement enhancer. In response to displacement of a portion of specimen, displacement enhancer displaces a portion of piezoelectric part by a displacement amount greater than an amount of the displacement of the portion of specimen. When the portion of piezoelectric part is displaced, piezoelectric part generates electric power in accordance with an amount of the displacement of the portion of piezoelectric part.

Abstract: A semiconductor memory device includes a semiconductor substrate including a diode formed in an upper layer portion of the semiconductor substrate, a first insulating film provided above the semiconductor substrate, a first conductive film provided above the first insulating film and coupled to the diode, a stacked body provided above the first conductive film, an insulator and an electrode film being stacked alternately in the stacked body, a semiconductor member piercing the stacked body and being connected to the first conductive film, and a charge storage member provided between the electrode film and the semiconductor member.

Abstract: The present disclosure provides for the administration of ?-NMN, which increases the secretion of adiponectin. The present disclosure also provides an adiponectin secretion enhancer comprising ?-nicotinamide mononucleotide, a pharmaceutically acceptable salt thereof or a solvate thereof, and a dietary supplement containing the aforementioned secretion enhancer, which can be ingested in order to increase the secretion of adiponectin. Also disclosed are methods of treating insulin resistance-related diseases such as of metabolic syndrome, diabetes, hyperlipidemia, fatty liver disease, hypertension, obesity, and arteriosclerosis.

Abstract: A semiconductor memory device includes a semiconductor substrate, a first insulating film provided above the semiconductor substrate, a first conductive film provided above the first insulating film, a plurality of first electrode films provided above the first conductive film and stacked to be separated from each other, a semiconductor member extending in a stacking direction of the plurality of first electrode films, and a charge storage member provided between the semiconductor member and one of the plurality of first electrode films. The first conductive film includes a main portion disposed at least below the plurality of first electrode films, and a fine line portion extending from the main portion toward an end surface side of the semiconductor substrate. A width of the fine line portion is narrower than a width of the main portion.

Abstract: In an injection process, molten resin is successively injected from a first flow channel and a second flow channel connected with each other in order into a cavity of a metal mold. High-temperature resin existing in the first flow channel is injected in advance into the cavity as a part of a single shot of molten resin to later form a skin layer of a molded article. other low temperature resin near a flowable limit existing in the second flow channel is subsequently injected into the cavity as another part of the single shot of molten resin to later form a core layer of the molded article. A low temperature resin remaining in the first flow channel when injection is completed is warmed to be a high-temperature resin before the next cycle, thereby allowing successive molding of molded articles.

Abstract: Provision of a technology for controlling an arm to maintain hand-eye coordination is desirable in a case of using the arm for supporting an oblique-viewing endoscope. Provided is a medical support arm system including an articulated arm configured to support a scope that acquires an image of an observation target in an operation field, and a control unit configured to control the articulated arm on the basis of a relationship between a real link corresponding to a lens barrel axis of the scope and a virtual link corresponding to an optical axis of the scope.

Abstract: A semiconductor memory device includes a semiconductor substrate, a first insulating film provided above the semiconductor substrate, a first conductive film provided above the first insulating film, a plurality of first electrode films provided above the first conductive film and stacked to be separated from each other, a semiconductor member extending in a stacking direction of the plurality of first electrode films, and a charge storage member provided between the semiconductor member and one of the plurality of first electrode films. The first conductive film includes a main portion disposed at least below the plurality of first electrode films, and a fine line portion extending from the main portion toward an end surface side of the semiconductor substrate. A width of the fine line portion is narrower than a width of the main portion.

Abstract: Provided is a pressure roller for an image heating device that forms a nip part together with a heating member, the pressure roller including at least a mandrel, a first elastic layer, and a second elastic layer provided between the mandrel and the first elastic layer, wherein the first elastic layer has open-cell voids, is made of rubber, and has a thickness of at least 50 ?m and less than 500 ?m, and the second elastic layer is made of solid rubber.