Patents by Inventor Jun ASAZUMA

Jun ASAZUMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090101280
    Abstract: A method of producing a flexible single-sided polyimide copper-clad laminate having excellent flex properties. The method comprises: (A) forming a polyamic acid coating by applying a polyamic acid to the surface of a copper foil starting material, (B) forming a laminate by bonding a polyimide film to the polyamic acid coating, and (C) heat treating the laminate, wherein the copper foil starting material is a material for which, if the copper foil starting material is subjected to a heat treatment for 30 minutes at 200° C. in a non-oxidizing atmosphere and the intensity of the (200) plane determined by X-ray diffraction following this heat treatment is termed I, and if the intensity of the (200) plane determined by X-ray diffraction of a copper powder that has not been subjected to heat treatment is termed I0, I and I0 satisfy a relationship represented by a formula (I) shown below: I/I0>20 ??(I).
    Type: Application
    Filed: October 17, 2008
    Publication date: April 23, 2009
    Applicant: Shin-Etsu Chemical Co., Ltd.
    Inventors: Jun ASAZUMA, Masahiro USUKI, Tadashi AMANO