Abstract: There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer, and attaching a heat spreader to the second surface of the interconnection structure layer to overlap with a portion of the first semiconductor device.

Abstract: There may be provided a method of manufacturing a semiconductor package. The method may include disposing a first semiconductor device and through mold ball connectors (TMBCs) on a first surface of an interconnection structure layer, forming a molding layer on the first surface of the interconnection structure layer to expose a portion of each of the TMBCs, attaching outer connectors to the exposed portions of the TMBCs, mounting a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer, and attaching a heat spreader to the second surface of the interconnection structure layer to overlap with a portion of the first semiconductor device.

Abstract: Provided is a method and system for generating a network bandwidth adaptive content, the method including: measuring bandwidth information of a transmission channel formed between a content server and a reception terminal; generating a target content by converting a source content to be transmitted to the reception terminal, at a transmission bitrate that is determined based on the bandwidth information; transmitting the generated target content to the reception terminal; and storing information on the target content in a dynamic adaptive streaming over hypertext transfer protocol (HTTP) (DASH) media presentation description (MPD) file.

Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.

Abstract: A semiconductor package includes first bump pads on a first surface of an interconnection structure layer, elevated pads thicker than the first bump pads on the first surface of the interconnection structure layer, a first semiconductor device connected on the first bump pads, through mold ball connectors connected on the elevated pads, respectively, a molding layer disposed covering the first surface of the interconnection structure layer to expose a portion of each of the through mold ball connectors, outer connectors respectively attached to the through mold ball connectors, and a second semiconductor device on a second surface of the interconnection structure layer opposite to the molding layer.

Abstract: A semiconductor memory device includes a ZQ calibration unit configured to generate a pull-up VOH code according to a first target VOH proportional to a power supply voltage and an output driver configured to generate a data signal having a VOH proportional to the power supply voltage based on the pull-up VOH code, wherein VOH means “output high level voltage.

Abstract: A method and apparatus for an adaptive Hypertext Transfer Protocol (HTTP) streaming service using metadata of content are provided. The metadata of the content may be efficiently divided for a purpose of use of a terminal based on general media information or specific media information, and may be transmitted to the terminal. A group may include one or more representations of content. The metadata may include a group element, and the group element may provide a summary of attributes of one or more representations included in the group.

Abstract: A three dimensional electrode structure having a first layer of interdigitated stripes of material oriented in a first direction, and a second layer of interdigitated stripes of material oriented in a second direction residing on the first layer of interdigitated stripes of material. A method of manufacturing a three dimensional electrode structure includes depositing a first layer of interdigitated stripes of an active material and an intermediate material on a substrate in a first direction, and depositing a second layer of interdigitated stripes of the active material and the intermediate material on the first layer in a second direction orthogonal to the first direction.

Abstract: In a method of manufacturing a bimetallic catalyst for reductively decomposing nitrate nitrogen, a powder including a trivalent iron oxide, a powder including a trivalent iron oxyhydroxide powder or a combination thereof is mixed in an aqueous solution. A copper precursor and a palladium precursor are mixed in the aqueous solution to form a precursor mixture. The precursor mixture is dried. The dried precursor mixture is fired at a temperature from about 300° C. to about 450° C. to form a fired product. The fired product is reduced by a reducing agent. A hydrochloric acid solution is mixed in the aqueous solution, or mixed with the copper precursor or the palladium precursor.

Abstract: A method of manufacturing a flexible display device includes forming a base substrate on a first sacrificial layer formed on a first supporting substrate, forming a display device array on the base substrate, forming a second sacrificial layer on a second supporting substrate, forming a touch array on the second sacrificial layer, adhering the first supporting substrate onto the second supporting substrate using an adhesive, irradiating laser energy onto the first sacrificial layer to remove the first sacrificial layer and separate the first supporting substrate from the base substrate, and irradiating laser energy onto the second sacrificial layer to separate interfaces of the second supporting substrate and the second sacrificial layer from each other, such that the second sacrificial layer is fixed on the touch array, The second sacrificial layer includes at least one of oxidized molybdenum, lead zirconate titanate, gallium nitride, and an amorphous silicon based inorganic material.

Abstract: A semiconductor device for controlling a power-up sequence is provided. The semiconductor device includes a plurality of chips. Each of the chips includes a power-up sequence controller configured to differently control generation sequences of internal source voltages. The power-up sequence controller changes the generation sequences of the internal source voltages in response to a power stabilization signal which is generated according to an external source voltage applied thereto in powering up the semiconductor device. Accordingly, a power-up current which is generated according to the internal source voltages being generated has a peak current distribution where a peak current may be equally distributed.

Abstract: A buffer circuit includes a first differential amplifier, second differential amplifier, third differential amplifier, and mixer. The first differential amplifier generates a positive differential signal and a negative differential signal based on an input signal and a reference voltage signal. The second differential amplifier generates a first signal based on the positive differential signal and the negative differential signal. The third differential amplifier generates a second signal having a different phase from the first signal based on the positive differential signal and the negative differential signal. The mixer outputs a signal, generated by mixing the first signal and the second signal, as an output signal.

Abstract: Disclosed herein is an apparatus and method for providing a broadcast service. The apparatus for providing a broadcast service includes a segment and metadata creation unit for creating a media segment file and profile information for a broadcast streaming service, a transfer processing unit for performing packetization and configuring a transport session in order to transfer audio/video and data objects, which correspond to the media segment file, and a broadcast transmission unit for formatting a media stream, received from the transfer processing unit, according to a broadcast signal format by multiplexing the media stream based on a layer, for creating a broadcast transmission frame that includes signaling information, and for transmitting the broadcast transmission frame via a broadcast network.

Abstract: A microcellular foaming nanocomposite includes an elastomeric polymer; a nanofiller; at least two of amphiphilic dispersing agents; a chemical blowing agent; an activator for chemical blowing agent; and a crosslinking agent. The present arrangement also relates to a preparation method of a microcellular foamed nanocomposite.

Abstract: A multi-view image transmitter and receiver, and a method of multiplexing a multi-view image. The multi-view image transmitter includes an image obtainer configured to obtain multi-view images that consist of source images of different views; a multiplexer configured to determine a multiplexing scheme according to multi-view image information that contains the number of views of the obtained multi-view images, and multiplex the source images with the determined multiplexing scheme; an encoder configured to encode a multiplexed image obtained by multiplexing the source images; and a transmitter configured to transmit the encoded multiplexed image.

Abstract: Provided is a method for preparing a nanoemulsion, including mixing an oil phase part (A) containing a ceramide or derivative thereof, cholesterol, non-ionic surfactant, phospholipid and a polyol, a perfume part (B) containing a perfume ingredient, non-ionic surfactant and an alcohol, and an aqueous phase part (C) containing the other water-soluble active ingredients. When a nanoemulsion is obtained by the method, it is possible to reduce processing time and cost since a non-ionic surfactant is used without a high-pressure emulsification process, and the obtained nanoemulsion is more stable against a change in temperature than the other solubilized formulations.

Abstract: A method for preparing macroporous polymethyl methacrylate (PMMA) particles includes the steps of: (a) dissolving a polymethyl methacrylate polymer and Pluronic polymer into an organic solvent; (b) introducing the mixed solution of step (a) to an aqueous solution containing a surfactant to carry out emulsion polymerization; (c) heating the resultant product of step (b) to allow evaporation of the organic solvent; and (d) washing and drying the porous polymethyl methacrylate particles remaining after the evaporation.

Abstract: A three dimensional electrode structure having a first layer of interdigitated stripes of material oriented in a first direction, and a second layer of interdigitated stripes of material oriented in a second direction residing on the first layer of interdigitated stripes of material. A method of manufacturing a three dimensional electrode structure includes depositing a first layer of interdigitated stripes of an active material and an intermediate material on a substrate in a first direction, and depositing a second layer of interdigitated stripes of the active material and the intermediate material on the first layer in a second direction orthogonal to the first direction.

Abstract: A semiconductor memory device includes a ZQ calibration unit configured to generate a pull-up VOH code according to a first target VOH proportional to a power supply voltage and an output driver configured to generate a data signal having a VOH proportional to the power supply voltage based on the pull-up VOH code, wherein VOH means “output high level voltage.

Abstract: A semiconductor package includes an extendible molding member, a chip embedded in the molding member to have a warped shape, and connectors disposed in the molding member. First surfaces of the connectors are exposed at a surface of the molding member, and second surfaces of the connectors are coupled to the chip.