Abstract: Provides a method for adjusting a thermal field of silicon carbide single crystal growth, and steps comprise: (A) screening a silicon carbide source, and filling into a bottom of a graphite crucible; (B) placing a guide inside the graphite crucible; (C) placing a rigid heat conductive material on the guide, so that a gap between the guide and a crucible wall of the graphite crucible is reduced; (D) fixing a seed crystal on a top of the graphite crucible; (E) placing the graphite crucible equipped with the silicon carbide source and the seed crystal in an induction high-temperature furnace used by physical vapor transport method; (F) performing a silicon carbide crystal growth process; and (G) obtaining a silicon carbide single crystal.

Abstract: Provided is a method of enhancing silicon carbide monocrystalline growth yield, including the steps of: (A) filling a bottom of a graphite crucible with a silicon carbide raw material selected; (B) performing configuration modification on a graphite seed crystal platform; (C) fastening a silicon carbide seed crystal to the modified graphite seed crystal platform with a graphite clamping accessory; (D) placing the graphite crucible containing the silicon carbide raw material and the silicon carbide seed crystal in an inductive high-temperature furnace; (E) performing silicon carbide crystal growth process by physical vapor transport; and (F) obtaining silicon carbide monocrystalline crystals. The geometric configuration of the surface of the graphite seed crystal platform is modified to eradicate development of peripheral grain boundary.

Abstract: A method of growing on-axis silicon carbide single crystal includes the steps of (A) sieving a silicon carbide source material by size, and only the part that has a size larger than 1 cm is adopted for use as a sieved silicon carbide source material; (B) filling the sieved silicon carbide source material in the bottom of a graphite crucible; (C) positioning an on-axis silicon carbide on a top of the graphite crucible to serve as a seed crystal; (D) placing the graphite crucible having the sieved silicon carbide source material and the seed crystal received therein in an induction furnace for the physical vapor transport process; (E) starting a silicon carbide crystal growth process; and (F) obtaining a silicon carbide single crystal.

Abstract: A method for the formation of tantalum carbides on a graphite substrate includes the steps of: (a) adding an organic tantalum compound, a chelating agent, a pre-polymer to an organic solvent to form a tantalum polymeric solution; (b) subjecting a graphite substrate with the tantalum polymeric solution to a curing process to form a polymeric tantalum film on the graphite substrate; and (c) subjecting the polymeric tantalum film on the graphite substrate in an oven to a pyrolytic reaction in the presence of a protective gas to obtain a protective tantalum carbide on the graphite substrate.

Abstract: A method for fabricating an ultra-thin graphite film on a silicon carbide substrate includes the steps of: (A) providing a polyamic acid solution and a siloxane-containing coupling agent for polymerizing under an inert gas atmosphere to form a siloxane-coupling-group-containing polyamic acid solution; (B) performing a curing process after applying the siloxane-coupling-group-containing polyamic acid solution to a silicon carbide substrate; (C) placing the silicon carbide substrate in a graphite crucible before placing the graphite crucible in a reaction furnace to perform a carbonization process under an inert gas atmosphere; (D) subjecting the silicon carbide substrate to a graphitization process to obtain a graphite film, thereby make it possible to fabricate an ultra-thin graphite film of high-quality on the surface of silicon carbide in a lower graphitization temperature range.

Abstract: A method for the formation of tantalum carbides on a graphite substrate includes the steps of: (a) adding an organic tantalum compound, a chelating agent, a pre-polymer to an organic solvent to form a tantalum polymeric solution; (b) subjecting a graphite substrate with the tantalum polymeric solution to a curing process to form a polymeric tantalum film on the graphite substrate; and (c) subjecting the polymeric tantalum film on the graphite substrate in an oven to a pyrolytic reaction in the presence of a protective gas to obtain a protective tantalum carbide on the graphite substrate.

Abstract: A method for fabricating an ultra-thin graphite film on a silicon carbide substrate includes the steps of: (A) providing a polyamic acid solution and a siloxane-containing coupling agent for polymerizing under an inert gas atmosphere to form a siloxane-coupling-group-containing polyamic acid solution; (B) performing a curing process after applying the siloxane-coupling-group-containing polyamic acid solution to a silicon carbide substrate; (C) placing the silicon carbide substrate in a graphite crucible before placing the graphite crucible in a reaction furnace to perform a carbonization process under an inert gas atmosphere; (D) subjecting the silicon carbide substrate to a graphitization process to obtain a graphite film, thereby make it possible to fabricate an ultra-thin graphite film of high-quality on the surface of silicon carbide in a lower graphitization temperature range.

Abstract: A method of producing a high-purity carbide mold includes the steps of (A) providing a template; (B) putting the template at a deposition region in a growth chamber; (C) putting a carbide raw material in the growth chamber; (D) providing a heating field; (E) introducing a gas; (F) depositing the carbide raw material; and (G) removing the template. The method is able to produce a mold from a high-purity carbide with a purity of 93% or above and therefore is effective in solving known problems with carbide molds, that is, low hardness and low purity.

Abstract: An electrical connector assembly includes plural wafers and the corresponding shielding plates are alternately stacked with one another. Each wafer includes a conductive housing defining plural slots therein, and plural terminal modules received in the corresponding slots, respectively. Each of the terminal modules includes a pair of differential contacts and an insulative holder retaining the pair of differential contacts. A plurality of cable assemblies correspond to the corresponding wafers. Each cable assemblies includes a plurality of cables each including a pair of differential wires respectively connected to the pair of differential contacts, respectively.

Abstract: An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.

Abstract: An active optical assembly includes a paddle card, an optical-electrical module including an opto-electronic communication device electrically connected with the paddle card, a heat sink ring mounted to the paddle card, an optical cable subassembly inserted into the heat sink ring and optically coupling with the optical-electrical module, and a heat sink cover mounted to the heat sink ring. The heat sink cover, the heat sink ring, and the paddle card cooperate to enclose the optical-electrical module so as to transfer heat generated by the opto-electronic communication device to the heat sink ring and the heat sink cover for dissipation.

Abstract: An AOC assembly comprising two printed circuit boards (PCB) (63), a board holder (61) and two heat conducting covers (64) with integrated head spreader. Each of the two PC boards has a lower edge (632) extending in a longitudinal direction with circuit pads on opposite sides of PCB thereof. The board holder has two opposite vertical datum faces with two of said PC boards respectively positioned thereon. The two heat conducting covers oppositely fixed to the holder in a transverse direction perpendicular to the PC boards. When assembled, the integrated heat spreader of heat conducting shell would dissipate heat from the active electronic components on the PCB.

Abstract: An optical connector for optically coupling light between an optical fiber and an opto-electronic device (OED) includes a lens body having a first lens array, a second lens array, and a reflecting surface on the optical path between the first lens array and the second lens array for reflecting the light between the optical fiber and the OED; and a seat separated from the lens body and located under the lens body for receiving the lens body therein. The seat includes an alignment feature as a datum for aligning the OED and an alignment structure for aligning the lens body, and wherein there is a predetermined position relationship between the alignment feature and the alignment structure so that the lens body aligns with the OED when the lens body is assembled in the seat.

Abstract: A mezzanine connector assembly adapted to connecting a top PCB and a bottom PCB. The mezzanine connector assembly includes a floatable upper connector and a lower connector. The upper connector has an electrical connecting device and an optical connecting device. The electrical connecting device includes a conductor having a floatable upper end and a fixed lower end, the optical connecting device having an optical waveguide with one end connected to the upper PCB and a lower end fixed to the housing by a ferrule. The lower connector has a housing, a turning lens received in the housing, and an electrical contact connected to the bottom PCB for mating with the lower end of the conductor of the upper connector, the turning lens defining an upward opening to receive the ferrule of the upper connector, a forward opening for receiving an optical plug.

Abstract: An object of the present invention is to provide a new modular SLC (Surface Laminar Circuit) interconnect system for replacing the traditional ceramic substrate implanted with 56 Duece modules, the interconnect system includes an organizer for accurately positioning the connector assemblies, and a plurality of fully populated connector housings defining a pitch same as that defined by the Duece modules. Each connector housing defines two receiving slots to receive two SLC modules which are further commonly held by a heat sink above. Each SLC module is equipped with a plurality of micro-controllers, a plurality of OE glass lenses, a plurality of IC chips, and a molded lens and fiber able assembly.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: A deposing apparatus includes a crucible having a deposition area formed inside the crucible; a heat sink partially embedded in the crucible and capable of transferring heat from the deposition area; a heat-insulator fixedly surrounding without covering the deposing area; and a thermal reflector securely mounted on a free surface of the heat-insulator without covering the deposition area and having a reflecting face with a slope extending from a side wall of the crucible to the deposition area. The heat-insulator has a relatively low thermal conductivity relative to those of the crucible, the heat sink and the thermal reflector. The thermal reflector reflects thermal radiation in the chamber and communicates with the heat-insulator and the chamber via the pores in the thermal reflector.

Abstract: An optical-electrical connector (100) having an end for mating with an electrical connector and an opposite end coupling with an optical medium, includes a thermal conductive shell (10), a printed circuit board assembly (20) received in the thermal conductive shell, and an optical-electrical module (50). The printed circuit board assembly includes a printed circuit board (21) including a thermal conductive layer (214) thermal conductively connected with the metal shell. The optical-electrical module is mounted on the printed circuit board and is in contact with the thermal conductive layer, heat produced by the optical-electrical module being transmitted to the thermal conductive shell by the thermal conductive layer.

Abstract: An electrical connector assembly (600) comprising a shielding housing (20) and a socket (40), and a buckle (60) assembled to the shielding housing. The shielding housing has a horizontal passage (22) and an entrance (220) backwardly communicating the passage and forwardly opening for receiving a plug (80). The socket is used for mating with a front end of a plug inserted therein. The buckle has a front latch (62) movable between an open position where a plug inside the shielding housing is permitted to be pulled out and a closed position where the front latch blocks the entrance of the shielding housing so that a plug inside the shielding housing is blocked from being pulled out.

Abstract: A high speed card edge connector (20, 30) includes an insulative housing (21, 31), and a number of first, second, third, and fourth contacts (221-224) received in the insulative housing and arranged in a number of first columns (25) and a number of second columns (26). Each of the first columns includes one first, one second, and one third contacts. Each of the second columns includes one first, one fourth, and one third contacts. Each of the first to the fourth contacts includes a mounting portion (22b). The mounting portions of the second and the fourth contacts are designed as penetration type termination, and the mounting portions of the first and the third contacts are designed as surface mounted type termination. The mounting portions of the second and the fourth contacts are arranged in different rows.