Patents by Inventor Jun-Chang Ding

Jun-Chang Ding has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package, packaging substrate, and methods for fabricating the same
    Patent number: 11600571
    Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: March 7, 2023
    Assignee: Siliconware Precision Industries Co., Ltd
    Inventors: Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
  • ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATING THE SAME
    Publication number: 20210104465
    Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.
    Type: Application
    Filed: December 17, 2020
    Publication date: April 8, 2021
    Inventors: Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
  • Electronic package, packaging substrate, and methods for fabricating the same
    Patent number: 10903167
    Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.
    Type: Grant
    Filed: February 26, 2019
    Date of Patent: January 26, 2021
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu
  • ELECTRONIC PACKAGE, PACKAGING SUBSTRATE, AND METHODS FOR FABRICATING THE SAME
    Publication number: 20200203277
    Abstract: An electronic package, a packaging substrate, and methods for fabricating the same are disposed. The electronic package includes a circuit structure having a first side and a second side opposing the first side, an electronic component disposed on the first side of the circuit structure, an encapsulation layer formed on the first side of the circuit structure and encapsulating the electronic component, a metal structure disposed on the second side of the circuit structure, and a plurality of conductive elements disposed on the metal structure. The plurality of conductive elements are disposed on the metal structure, rather than disposed on the circuit structure directly. Therefore, the bonding between the conductive elements and the circuit structure is improved, to avoid the plurality of conductive elements from being peeled.
    Type: Application
    Filed: February 26, 2019
    Publication date: June 25, 2020
    Inventors: Jun-Chang Ding, Hong-Da Chang, Hsi-Chang Hsu