Patents by Inventor Jun-Cheng Liao

Jun-Cheng Liao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device
    Patent number: 10201086
    Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: February 5, 2019
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Lu-Yi Chen, Cheng-Hsiang Liu, Chang-Lun Lu, Jun-Cheng Liao, Cheng-Yi Chen
  • ELECTRONIC DEVICE
    Publication number: 20180042112
    Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.
    Type: Application
    Filed: October 17, 2016
    Publication date: February 8, 2018
    Inventors: Lu-Yi Chen, Cheng-Hsiang Liu, Chang-Lun Lu, Jun-Cheng Liao, Cheng-Yi Chen