Patents by Inventor Jun Cheng Ooi

Jun Cheng Ooi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240017986
    Abstract: A MEMS device comprises a first membrane structure having a reinforcement region formed from one piece of the first membrane structure, wherein the reinforcement region has a larger layer thickness than an adjoining region of the first membrane structure. The MEMS device includes an electrode structure, wherein the electrode structure is vertically spaced apart from the first membrane structure.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 18, 2024
    Inventors: Stefan Barzen, Alexander Frey, Matthias Friedrich Herrmann, Jun Cheng Ooi, Hans-Jörg Timme