Patents by Inventor Jun Chiba

Jun Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110058979
    Abstract: [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved. [Solution Means] Au alloy bonding wires comprising: 5-100 wt ppm Mg, 5-20 wt ppm In, 5-20 wt ppm Al, 5-20 wt ppm Yb, and residual Au of 99.995 wt % purity or higher, and adding 5-20 wt ppm Ca, and for these alloys adding at least one element among 5-20 wt ppm La, 5-20 wt ppm Lu, 5-100 wt ppm Sn, 5-100 wt ppm Sr to the alloy, and/or, moreover, adding 0.01-1.2 wt % Pd to these alloys. Bonding wire, which contains these trace additive elements do not cause a disturbance by accumulated contamination, because of contamination, which formed at ball formation by micro discharge and at the first bonding on the tip of the capillary, transferring to the wire at second bonding.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 10, 2011
    Applicant: TANAKA DENSHI KOGYO K. K.
    Inventors: Hiroshi Murai, Jun Chiba, Fujio Amada
  • Publication number: 20100171222
    Abstract: [Issues to be Solved] Providing enhanced bonding reliability of Au alloy bonding wire with low electrical resistivity to Al electrode of semiconductor device, and its application of semiconductor device is bonded with Al electrode pad by the same wire. [Solution Means] Au alloy bonding wire comprising: 0.02-0.3 mass % Ag, total amount of 10-200 mass ppm at least one element of Ge and/or Si, and/or total amount of 10-200 mass ppm at least one element of Al and/or Cu, with residual of Au. Moreover, Al and/or Al alloy pad bonded with the above Au alloy bonding wire.
    Type: Application
    Filed: March 26, 2008
    Publication date: July 8, 2010
    Applicant: TANAKA DENSHI KOGYO K.K.
    Inventors: Hiroshi Murai, Jun Chiba, Fujio Amada
  • Publication number: 20090324581
    Abstract: To provide a novel compound which has S1P receptor agonistic activity, exhibits excellent immunosuppressing effect, gives less adverse side effects, and can be orally administered. The invention provides a compound represented by general formula (I) (wherein A is a single bond, —O—, or —CH2—; R1 represents a hydrogen atom or a C1-C6 alkyl group, and V represents any one group selected from among the following groups (1) to (3): (1) -G1-, (2) -G2-N(R2)-G3-, and (3) a group represented by formula 2, wherein each of Z1 and Z2 represents a hydrogen atom or a C1-C6 alkyl group, Z3 represents a hydrogen or the like, Q represents —CH2—O— or the like, and Y represents a group represented by formula 3, a salt thereof, or a solvate thereof.
    Type: Application
    Filed: May 9, 2007
    Publication date: December 31, 2009
    Applicant: Daiichi Sankyo company Limited
    Inventors: Nobuo Machinaga, Toshiharu Yoshino, Jun Chiba, Jun Watanabe, Takashi Suzuki, Youichi Kimura
  • Publication number: 20090233901
    Abstract: There is provided a VLA-4 inhibitory drug having good oral absorbability and exhibiting sufficient anti-inflammatory effects when administered orally.
    Type: Application
    Filed: December 13, 2006
    Publication date: September 17, 2009
    Applicant: Daiichi Sankyo Company, Limited
    Inventors: Nobuo Machinaga, Shin Iimura, Yoshiyuki Yoneda, Jun Chiba, Fumihito Muro, Hideko Hoh, Atsushi Nakayama
  • Publication number: 20080050267
    Abstract: Provided is a thin Au alloy bonding wire having desired strength, good bondability and stability over time, and improved circularity of a squashed ball and sphericity of a melted ball. The Au alloy bonding wire contains, in an Au alloy matrix containing 0.05 to 2 mass % in total of at least one selected from Pd and Pt of high purity in Au of high purity, as trace elements, 10 to 100 ppm by mass of Mg, 5 to 100 ppm by mass of Ce, and 5 to 100 ppm by mass of each of at least one selected from Be, Y, Gd, La, Eu and Si, the total content of Be, Y, Gd, La, Eu and Si being 5 to 100 ppm by mass, or as trace elements, Mg, Be, and at least one selected from Y, La, Eu and Si, or as trace elements, 10 to 100 ppm by mass of Mg, 5 to 30 ppm by mass of Si, 5 to 30 ppm by mass of Be, and 5 to 30 ppm by mass of at least one selected from Ca, Ce and Sn.
    Type: Application
    Filed: September 28, 2005
    Publication date: February 28, 2008
    Inventors: Hiroshi Murai, Jun Chiba, Satoshi Teshima
  • Publication number: 20080013032
    Abstract: An object of the present invention is to provide a liquid crystal device wherein provisions are made to reduce the occurrence of light leakage and discrimination. The liquid crystal device comprises a pair of opposing substrates, a liquid crystal provided between the pair of opposing substrates, and spacers for maintaining a gap between the pair of opposing substrates, wherein the spacers include a mixture of coated spacers, each coated with an alignment material for giving liquid crystal molecules forming the liquid crystal a tendency to align in a particular direction around the surface of the spacer, and uncoated spacers not coated with an alignment material.
    Type: Application
    Filed: March 29, 2005
    Publication date: January 17, 2008
    Inventors: Hiroshi Tsukada, Makoto Kurihara, Jun Chiba
  • Publication number: 20070232601
    Abstract: An object of the present invention is to provide a compound which selectively inhibits binding of a ligand and ?4?1 integrin (VLA-4), a process for producing the compound, and a medicament containing the compound. A compound represented by the formula (I) etc. or a salt thereof, a process for producing the compound or a salt thereof, a medicament containing the compound or a salt thereof, as well as a preventive and/or a therapeutic agent for a disease caused by cell adhesion, for example, inflammatory reaction, autoimmune disease, cancer metastasis, bronchial asthma, nasal obstruction, diabetes, arthritis, psoriasis, multiple sclerosis, inflammatory bowel disease and rejection reaction at transplantation, containing the compound or a salt thereof as a primary component. [wherein Y1 represents a divalent aryl group etc., V1 represents an aryl group etc., and R11 to R14 represent H, OH or a halogen atom etc.
    Type: Application
    Filed: June 14, 2005
    Publication date: October 4, 2007
    Inventors: Yoshiyuki Yoneda, Atsushi Nakayama, Nobuo Machinaga, Jun Chiba, Fumihito Muro
  • Publication number: 20070054909
    Abstract: Compounds that selectively inhibit the binding of ligands to ?4?1 integrin (VLA-4) and methods for their preparation are disclosed. In one embodiment, compounds of the invention are represented by Formula I: As selective inhibitors of VLA-4 mediated cell adhesion, compounds of the present invention are useful in the treatment of conditions associated with such adhesion, including, but not limited to, such conditions as inflammatory and autoimmune responses, diabetes, asthma, psoriasis, inflammatory bowel disease, transplantation rejection, and tumor metastasis. Also disclosed are methods of inhibiting VLA-4 mediated cell adhesion and methods of treating conditions associated with LA-4 mediated cell adhesion.
    Type: Application
    Filed: November 8, 2006
    Publication date: March 8, 2007
    Applicants: Daiichi Pharmaceutical Co., Ltd., Pharmacopeia Drug Discovery, Inc.
    Inventors: John Baldwin, Edward McDonald, Kevin Moriarty, Christopher Sarko, Nobuo Machinaga, Atsushi Nakayama, Jun Chiba, Shin Iimura, Yoshiyuki Yoneda
  • Patent number: 7179819
    Abstract: Compounds that selectively inhibit the binding of ligands to ?4?1 integrin (VLA-4) and methods for their preparation are disclosed. In one embodiment, compounds of the invention are represented by Formula I: As selective inhibitors of VLA-4 mediated cell adhesion, compounds of the present invention are useful in the treatment of conditions associated with such adhesion, including, but not limited to, such conditions as inflammatory and autoimmune responses, diabetes, asthma, psoriasis, inflammatory bowel disease, transplantation rejection, and tumor metastasis. Also disclosed are methods of inhibiting VLA-4 mediated cell adhesion and methods of treating conditions associated with LA-4 mediated cell adhesion.
    Type: Grant
    Filed: February 26, 2004
    Date of Patent: February 20, 2007
    Assignees: Daiichi Pharmaceutical Co., Ltd., Pharmacopeia Drug Discovery, Inc.
    Inventors: John J. Baldwin, Edward McDonald, Kevin Joseph Moriarty, Christopher Ronald Sarko, Nobuo Machinaga, Atsushi Nakayama, Jun Chiba, Iimura Shin, Yoshiyuki Yoneda
  • Patent number: 7157487
    Abstract: The present invention relates to a compound represented by the following formula (I): (wherein, W represents WA-A1-WB- (in which, WA is substituted or unsubstituted aryl, etc., A1 is —NR1—, single bond, —C(O)—, etc., and WB is substituted or unsubstituted arylene, etc.), R is single bond, —NH—, —OCH2—, alkenylene, etc., X is —C(O)—, —CH2—, etc., and M is, for example, the following formula: (in which, R11, R12 and R13 each independently represents hydrogen, hydroxyl, amino, halogen, etc., R14 is hydrogen or lower alkyl, Y represents —CH2—O—, etc., Z is substituted or unsubstituted arylene, etc., A2 is single bond, etc, and R10 is hydroxyl or lower alkoxy)), or salt thereof; and a medicament containing the same.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: January 2, 2007
    Assignee: Daiichi Pharmaceutical Co., Ltd.
    Inventors: Atsushi Nakayama, Nobuo Machinaga, Yoshiyuki Yoneda, Yuichi Sugimoto, Jun Chiba, Toshiyuki Watanabe, Shin Iimura
  • Publication number: 20040229858
    Abstract: Compounds that selectively inhibit the binding of ligands to &agr;4&bgr;1 integrin (VLA-4) and methods for their preparation are disclosed.
    Type: Application
    Filed: February 26, 2004
    Publication date: November 18, 2004
    Applicants: Daiichi Pharmaceutical Co., LTD., Pharmacopeia Drug Discovery, Inc.
    Inventors: John J. Baldwin, Edward McDonald, Kevin Joseph Moriarty, Christopher Ronald Sarko, Nobuo Machinaga, Atsushi Nakayama, Jun Chiba, Shin Iimura, Yoshiyuki Yoneda
  • Patent number: 6756378
    Abstract: Compounds that selectively inhibit the binding of ligands to &agr;4&bgr;1 integrin (VLA-4) and methods for their preparation are disclosed. In one embodiment, compounds of the invention are represented by Formula I: As selective inhibitors of VLA-4 mediated cell adhesion, compounds of the present invention are useful in the treatment of conditions associated with such adhesion, including, but not limited to, such conditions as inflammatory and autoimmune responses, diabetes, asthma, psoriasis, inflammatory bowel disease, transplantation rejection, and tumor metastasis. Also disclosed are pharmaceutical compositions, methods of inhibiting VLA-4 mediated cell adhesion and methods of treating conditions associated with LA-4 mediated cell adhesion, which involve compounds of Formula I.
    Type: Grant
    Filed: December 28, 2001
    Date of Patent: June 29, 2004
    Assignees: Pharmacopeia Drug Discovery, Inc., Daiichi Pharmaceutical Co., Ltd.
    Inventors: John J. Baldwin, Edward McDonald, Kevin Joseph Moriarty, Christopher Ronald Sarko, Nobuo Machinaga, Atsushi Nakayama, Jun Chiba, Shin Iimura, Yoshiyuki Yoneda
  • Publication number: 20040110945
    Abstract: The present invention relates to a compound represented by the following formula (I): 1
    Type: Application
    Filed: June 30, 2003
    Publication date: June 10, 2004
    Inventors: Atsushi Nakayama, Nobuo Machinaga, Yoshiyuki Yoneda, Yuichi Sugimoto, Jun Chiba, Toshiyuki Watanabe, Shin Iimura
  • Publication number: 20030078249
    Abstract: Compounds that selectively inhibit the binding of ligands to &agr;4&bgr;1 integrin (VLA-4) and methods for their preparation are disclosed.
    Type: Application
    Filed: December 28, 2001
    Publication date: April 24, 2003
    Applicant: Daiichi Pharmaceutical Co., LTD.
    Inventors: John J. Baldwin, Edward McDonald, Kevin Joseph Moriarty, Christopher Ronald Sarko, Nobuo Machinaga, Atsushi Nakayama, Jun Chiba, Shin Iimura, Yoshiyuki Yoneda
  • Patent number: 5940245
    Abstract: A door opening-and-closing mechanism of a recording/reproducing apparatus including a door axially supported at the back side of a front face plate so as to be capable of opening and closing an opening, and a lock member for preventing free rotational movement of the door. The lock member includes a supporting shaft rotatably supported at the back side of the front face plate, lock portions which engage and disengage the door, and a portion to be pushed that projects into the opening, which are formed into an integral structure. The portion to be pushed is pushed by a disk cartridge being inserted in order to disengage the lock portions and the door from each other.
    Type: Grant
    Filed: April 24, 1997
    Date of Patent: August 17, 1999
    Assignee: Alps Electric Co., Ltd.
    Inventors: Shinkichi Sasaki, Harutaka Sekiya, Jun Chiba
  • Patent number: 5896250
    Abstract: A head transport mechanism for reciprocating a carriage in a radial direction of a disc using a linear motor as a drive source is disclosed. In the head transport mechanism, cylindrical projections are formed on a support plate, threads are cut on the inner surfaces of the projections, and cutouts are formed in the distal ends of bottom yokes. The cutouts are brought into contact with the outer peripheral surfaces of the projections so as to locate the bottom yoke. In addition, protrusions protruding outward from superposed portions of the bottom yokes and top yokes in a longitudinal and/or lateral direction of the bottom yokes are formed in at least one end of each of the bottom yokes so that the top yokes can be assembled with the protrusions pressed when assembling the head transport mechanism.
    Type: Grant
    Filed: November 17, 1997
    Date of Patent: April 20, 1999
    Assignee: Alps Electric Co., Ltd.
    Inventors: Jun Chiba, Takashi Nakai