Abstract: An LED lamp (100) includes a lamp enclosure (10), a heat sink (51) and two LED modules (30). The lamp enclosure has a recess (15) and an opening (156). The heat sink is received in the recess of the lamp enclosure. The LED modules are attached to a bottom of the heat sink and oriented downwardly and outwardly towards an internal surface (1110) of the lamp enclosure. Light emitted by the LED module is firstly directed to the internal surface and other internal surfaces (130, 1130), and then reflected from the internal surfaces to an outside of the LED lamp through the opening.

Abstract: An LED lamp (100) includes a lamp enclosure (10) and two LED modules (30). The lamp enclosure has a concave housing (11). The housing includes an elongated bottom plate (111) and two lateral plates (115) extending upwardly from two opposite lengthwise sides of the bottom plate respectively. An opening (156) is defined at a top side of the lamp enclosure. The LED modules each are mounted at a joint between the bottom plate and a corresponding of the lateral plates in such a manner that at least a portion of lights emitted by the LED modules is firstly directed to and reflected by an internal surface of the bottom plate, and then directed to an outside through the opening.

Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

Abstract: A heat dissipation device includes a heat sink and a cooling fan arranged thereon. The cooling fan includes a motor-stator and an impeller mounted around the motor-stator. The motor-stator is arranged on a middle of the heat sink. The heat sink includes a base and a plurality of fins extending upwardly from the base. The heat sink defines a plurality of notches incising the fins. The notches are angled towards the middle of the heat sink immediately under the motor-stator of the cooling fan.

Abstract: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.

Abstract: A mounting device (10) for mounting a heat sink (20) to a printed circuit board (40) on which a heat generating electronic component (30) is disposed, includes a mounting frame (100), two clasping legs (104) and four resilient arms (105). The mounting frame includes two first mounting arms (101) and two second mounting arms (102) disposed above the first mounting arms. The first mounting arms abut on the circuit board. The clasping legs connect with the second mounting arms and are inserted through the printed circuit board to be attached to the printed circuit board. The resilient arms connect with the second mounting arms and exert a downward resilient force on the heat sink toward the heat generating electronic component.

Abstract: A mounting device (10) for mounting a heat sink (40) onto a printed circuit board (60) with a heat generating electronic component (50) mounted thereon. The mounting device includes a mounting frame (101) and two resilient clips (102) attached to the mounting frame. The mounting frame includes two first mounting arms (1011) and two second mounting arms (1012) disposed above the first mounting arms. The first mounting arms are configured for being attached to the printed circuit board. The resilient clips are configured for being sandwiched between the second mounting arms of the mounting frame and the heat sink. The resilient clips each include two resilient arms (1023) configured for providing a resilient force which urges the heat sink toward the heat generating electronic component.

Abstract: The present invention relates to methods and compositions for modulating calcium channels. In particular, the present invention provides methods and compositions for modulating (e.g., disrupting) Cav1.3a calcium channels for research and therapeutic methods (e.g., treating dopaminergic diseases and conditions).

Abstract: One embodiment of the present invention provides a system that activates a muscle to produce a functional movement in a subject through electrical stimulation. During operation, the system first obtains a non isometric model which defines a functional movement associated with the muscle in response to electrical stimulation of the muscle. Next, the system uses the non isometric model to compute an electrical stimulation which produces a desired functional movement in the subject. The system then applies the computed electrical stimulation to the muscle to produce the desired functional movement in the subject.

Abstract: A thermal mass flow measuring apparatus comprises a sheath having an interior surface and a protective exterior surface. A liquid material having a thermal conductivity greater than about 12 w/(m·° C.) is disposed within the sheath in contact with the interior surface of the sheath. A sensor element, such as a thin-film thermoresistive element or a wire-wound thermoresistive element is at least partially submerged in the liquid material. The liquid material, which is preferably liquid metal, decreases the overall thermal resistance between the outer surface of the sheath and the sensor element.

Abstract: of a communication network. A message sender can attach a user-selected profile to a publicly-broadcasted message. A message viewer can read the publicly-broadcasted message only if the viewer's profile matches the sender's profile attached to the message. When a sender profile and viewer profile match, a communication channel is established between the sender and viewer. The sender's and viewer's profiles are registered on an open directory to which all parties, even parties unknown to each other, have access. The open directory structure is used in creating a header file, also referred to herein as a “stamp,” that is attached to messages or requests generated by the users. The selection of categories to be included in the header file is a procedure that is independent from the creation of the message. The header file can be combined dynamically at the point of sending the message by a message sender or at the point of searching messages by a message viewer.

Abstract: A dental flosser is moveable between a stored, non-use position where the flosser is substantially planar, and an engaged or in-use position where a portion of the flosser is angled relative to the handle to aid in reaching back teeth. The dental flosser preferably includes a holder (which may be a U-shaped holder) that is movable between the non-use and in-use position; a handle; a living hinge between the holder and the handle, and a locking arm designed to secure the holder in the in-use position.

Abstract: The present invention relates to methods and compositions for modulating calcium channels. In particular, the present invention provides methods and compositions for modulating (e.g., disrupting) Cav1.3a calcium channels for research and therapeutic methods (e.g., treating dopaminergic diseases and conditions).

Abstract: A video compression scheme enables the user to select one of many video compression formats, including the widely-used standard video formats such as MPEG-1, MPEG-2, MPEG-4 and H.263. In one embodiment, the scheme is implemented as a hardware-software combination, with the hardware portion, preferably implemented as an ASIC chip, performing the core compression and the software portion dealing with the detailed formatting. In another embodiment, a 32-bit aligned transitional data format is used.

Abstract: A video compression scheme enables the user to select one of many video compression formats, including the widely-used standard video formats such as MPEG-1, MPEG-2, MPEG-4 and H.263. In one embodiment, the scheme is implemented as a hardware-software combination, with the hardware portion, preferably implemented as an ASIC chip, performing the core compression and the software portion dealing with the detailed formatting. In another embodiment, a 32-bit aligned transitional data format is used.

Abstract: A method and apparatus for making a probe head that has reduced voltage droop and improved transient response. One embodiment a cable providing a plurality of signal conductors and a plurality of power conductors including a first power conductor and a second power conductor, a probe head wired to the cable, a plurality of electrical contacts including a first electrical contact and a second electrical contact, wherein each one of the plurality of electrical contacts is fixed to the probe head and wherein the first power conductor is connected to the first electrical contact, and a first regulatory device physically residing in the probe head and wired between the second power conductor and the first electrical contact. In some embodiments, the first regulatory device includes an active transient control device that senses an output voltage and sources or sinks an appropriate supplemental amount of current to improve transient response.

Abstract: A dental flosser is moveable between a stored, non-use position where the flosser is substantially planar, and an engaged or in-use position where a portion of the flosser is angled relative to the handle to aid in reaching back teeth. The dental flosser preferably includes a holder (which may be a U-shaped holder) that is movable between the non-use and in-use position; a handle; a living hinge between the holder and the handle, and a locking arm designed to secure the holder in the in-use position.

Abstract: A method and apparatus for making a probe head that has reduced voltage droop and improved transient response. One embodiment a cable providing a plurality of signal conductors and a plurality of power conductors including a first power conductor and a second power conductor, a probe head wired to the cable, a plurality of electrical contacts including a first electrical contact and a second electrical contact, wherein each one of the plurality of electrical contacts is fixed to the probe head and wherein the first power conductor is connected to the first electrical contact, and a first regulatory device physically residing in the probe head and wired between the second power conductor and the first electrical contact. In some embodiments, the first regulatory device includes an active transient control device that senses an output voltage and sources or sinks an appropriate supplemental amount of current to improve transient response.

Abstract: A probe burn resistant interface apparatus and method for testing an electronic device use a probe made of a shape memory alloy which upon overheating of the probe during functionality testing of an electronic device contracts the probe to disengage the probe from a contact electrically connected to the electronic device and stop current flow through the probe. Upon cooling of the probe, engagement of the probe with the contact is reestablished. The probe in an example embodiment is a wire which has a core made of a shape memory alloy and a layer of a highly elastic metal, for example copper, on an outer surface of the core to aid return of the probe from its contracted state to its initial state upon cooling an overheated probe for reestablishing electrical connection of the probe with the electronic device being tested.

Abstract: A probe burn resistant interface apparatus and method for testing an electronic device use a probe made of a shape memory alloy which upon overheating of the probe during functionality testing of an electronic device contracts the probe to disengage the probe from a contact electrically connected to the electronic device and stop current flow through the probe. Upon cooling of the probe, engagement of the probe with the contact is reestablished. The probe in an example embodiment is a wire which has a core made of a shape memory alloy and a layer of a highly elastic metal, for example copper, on an outer surface of the core to aid return of the probe from its contracted state to its initial state upon cooling an overheated probe for reestablishing electrical connection of the probe with the electronic device being tested.