Abstract: A vibration structure that includes a member having a vibrator that vibrates along a plane direction; a housing that holds the member; and a cushioning material connecting the housing to the member, in which a thickness of the cushioning material in a direction orthogonal to a plane direction of the housing is greater than a length of a gap between the member and the housing.

Abstract: An embodiment lens structure body includes a microlens portion of double-sided asymmetric aspherical shape having a refraction surface on an illuminant side and a refraction surface on an emission side so as to be opposed to the refraction surface, and marker portions formed so as to be joined to both ends of the microlens portion in a direction perpendicular to an optical axis.

Abstract: A device includes a first lens), a second lens, and an adjustment platform. The first lens is arranged between a first end surface and a second end surface, and enlarges the mode field diameter of light that is guided through a first optical waveguide and is emitted from the first end surface. The second lens is arranged between the first lens and a second end surface, and collects light that has passed through the first lens. The first lens is mounted on the adjustment platform. The distance between the optical axis of the first optical waveguide and the principal point of the first lens is adjusted on a plane orthogonal to the optical axis of the first optical waveguide using the adjustment platform.

Abstract: A vibration device that includes a support member, an actuator, and a sensor that detects a force applied to a vibrated member and displacement of the vibrated member in a left-right direction. The support member includes a fixing portion, a vibration portion, and an elastically deformable portion connecting the fixing portion and the vibration portion. The actuator is attached to the fixing portion and the vibration portion. The sensor is attached to the elastically deformable portion. The elastically deformable portion has a first elastic modulus in the left-right direction, a second elastic modulus in a front-rear direction, and a third elastic modulus in an up-down direction. The first elastic modulus is smaller than the second elastic modulus. The third elastic modulus is smaller than the second elastic modulus.

Abstract: An optical connection structure includes a waveguide substrate; a Si waveguide formed on one surface of the waveguide substrate 100 and having a first end surface; an optical fiber having a second end surface facing the first end surface; a terrace section extending further toward the optical fiber side from an end portion on the optical fiber side of the waveguide substrate; and a support member formed on the terrace section, and including, on a top surface in a view from the terrace section, a recess c configured to support a lens.

Abstract: A vibration structure that includes: a housing; a panel having a main surface; an inner frame physically connected to the panel and the housing, the inner frame including a first portion overlapping the housing as viewed in a normal direction of the main surface; an outer frame physically connected to the panel and the housing, the outer frame surrounding the inner frame as viewed in the normal direction, and the outer frame including a second portion overlapping the panel as viewed in the normal direction; and a vibration body that vibrates the panel, wherein (A) or (B): (A) the vibration body is attached to the panel or the inner frame; or (B) the vibration body is attached across the panel or the inner frame, and the housing or the outer frame.

Abstract: An optical fiber connection structure according to the present invention includes a fiber support member configured to support an optical fiber to be optically connected to an optical waveguide device, a stopper configured to restrict movement in an axial direction of the optical fiber supported by the fiber support member, and a lens disposed on an optical axis between an end surface of the optical waveguide device and the optical fiber.

Abstract: An analysis apparatus includes a setting device configured to set information on a structure of an optical connection structure, a solution device configured to solve a partial differential equation having, as an unknown, an electromagnetic field distributed in the optical connection structure based on the information on the structure of the optical connection structure to determine a distribution of the electromagnetic field, a data extraction device configured to extract, from the distribution of the electromagnetic field determined by the solution device, a mode distribution in a plane at a predetermined position of the optical connection structure and a time response of an electromagnetic field at a predetermined position of the optical connection structure, and a characteristics analysis device configured to analyze optical characteristics of the optical connection structure based on the mode distribution and the time response of the electromagnetic field extracted by the data extraction device.

Abstract: An embodiment optical body is provided in a propagation path of light between a Si waveguide and an optical fiber. The optical body changes a course of some of radiation mode light, which is emitted from the Si waveguide and propagates in a direction away from an optical axis thereof, to obtain waveguide mode light passing through itself. Thus, the amount of waveguide mode light incident on the optical fiber increases, and the coupling efficiency between the Si waveguide and the optical fiber is improved.

Abstract: A vibration device that includes: a fixing part having a flat plate shape; a vibration part having a flat plate shape, the vibration part being disposed around the fixing part as viewed in a normal direction of the fixing part; a coupling part that couples the vibration part and the fixing part and is constructed to elastically deform, the vibration part constructed to be displaced in an orthogonal direction orthogonal to the normal direction of the fixing part with respect to the fixing part; and a vibration film fixed to the vibration part and the fixing part, the vibration film constructed to vibrate the vibration part in the orthogonal direction with respect to the fixing part when an electric signal is applied to the vibration film.

Abstract: An optical connection structure 1 includes a waveguide substrate; a Si waveguide formed on one surface of the waveguide substrate and having a first end surface; an optical fiber having a second end surface facing the first end surface; a terrace section extending further toward the optical fiber side from an end portion on the optical fiber side of the waveguide substrate; and a lens disposed on the terrace section, and arranged on an optical axis connecting the first end surface and the second end surface.

Abstract: A vibration structure that includes a piezoelectric film constructed to deform in a plane direction as a voltage is applied thereto, a frame-shaped member, a vibration portion surrounded by the frame-shaped member in a plan view of the vibration structure, a support portion connecting the vibration portion and the frame-shaped member, and supporting the vibration portion within the frame-shaped member such that the vibration portion vibrates in the plane direction when the piezoelectric film is deformed in the plane direction, a first connection member that connects the piezoelectric film to the vibration portion, and a second connection member that connects the piezoelectric film to the frame-shaped member. Of the connection members, the first connection member is disposed between the center of gravity of the vibration portion and the second connection member.

Abstract: A piezoelectric device that includes a film that has a first main surface and a second main surface, and has piezoelectricity; a first substrate; and a first connection member that connects the film to the first substrate. The first connection member is a thermosetting resin, and a curing temperature of the first connection member is lower than a temperature at which the film thermally contracts.

Abstract: A method for manufacturing a deformation detection sensor that includes: preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed; laminating the plurality of thermoplastic resin layers; after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.

Abstract: A method for manufacturing a deformation detection sensor that includes: preparing a plurality of thermoplastic resin layers, at least one of which has a main surface on which a conductive member is formed; laminating the plurality of thermoplastic resin layers; after lamination, integrally forming the plurality of thermoplastic resin layers by hot pressing to obtain a laminated body configured so that a transmission line is formed from a first portion of the conductive member and the laminated body; and attaching a piezoelectric film to the laminated body so that a piezoelectric element is formed from a second portion of the conductive member, the laminated body, and the piezoelectric film.

Abstract: A vibration structure that includes a film having a first electrode on a first main surface thereof, the first electrode defining a first connection region on the first main surface where the first electrode is not present, and the film is constructed to be deformed in a plane direction when a voltage is applied thereto; a frame-shaped member; a vibration portion surrounded by the frame-shaped member; a first connection member that connects the first main surface of the film to the frame-shaped member at the first connection region; a second connection member that connects the film to the vibration portion; and an extended electrode that is connected to the first electrode.

Abstract: A processing apparatus includes a control unit. The control unit is configured to acquire facility information containing an advertisement or publicity on a facility located along a travel route that a vehicle is scheduled to travel or a facility located within a predetermined range from the travel route, and, while the vehicle is traveling along the travel route, process an image of a first facility associated with the facility information or an image of a second facility present around the first facility based on the facility information and display the image of the first facility or the image of the second facility on a display provided in the vehicle.

Abstract: A substrate that includes a film-shaped member that has a first main surface and a second main surface; a first electrode that has a third main surface and a fourth main surface, the third main surface facing the second main surface of the film-shaped member, the first electrode having a first patterning region with a first part where the film-shaped member is exposed from the first electrode and a second part where the film-shaped member is not exposed from the first electrode; and an adhesive tape facing the fourth main surface of the first electrode and the second main surface of the film-shaped member such that the adhesive tape is disposed across the first part and the second part in the first patterning region.

Abstract: A vibration structure that includes a film constructed to deform in a plane direction as voltage is applied thereto, a frame-shaped member, a vibration portion surrounded by the frame-shaped member in a plan view of the vibration structure, a support portion connecting the vibration portion and the frame-shaped member and supporting the vibration portion within the frame-shaped member, a first connection member that connects the film and the frame-shaped member, and a second connection member that connects the film to the vibration portion such that the vibration portion vibrates in the plane direction when the film is deformed in the plane direction. The support portion is disposed at a position closer to a center of gravity of the vibration portion than an end portion of the vibration portion when viewed in the plan view.

Abstract: A deformation detection sensor that includes a conductive member, a plurality of thermoplastic resin layers, and a piezoelectric film. At least one of the thermoplastic resin layers has a main surface, and the conductive member is formed on the main surface thereof. The plurality of thermoplastic resin layers are laminated and integrally formed by hot pressing into a laminated body. A transmission line is formed form a first portion of the conductive member and the thermoplastic resin in the laminated body. The piezoelectric film is attached to the laminated body to form a piezoelectric element made of a second portion of the conductive member, the thermoplastic resin in the laminated body, and the piezoelectric film.