Abstract: A transport system includes: a transport module extending in the first direction; a plurality of processing modules connected to the transport module; and a transport device provided inside the transport module and configured to transport a transport target to the plurality of processing modules. The transport device includes: a moving mechanism configured to move the transport target along the first direction; a lower slider provided above the moving mechanism in a vertical direction and capable of moving the transport target in a second direction different from the first direction; and an upper slider provided above the lower slide part in the vertical direction and capable of moving the transport target in the second direction.

Abstract: A transfer system includes a transfer module extending along a first direction, a plurality of processing modules connected to the transfer module and provided along a direction in which the transfer module extends, and a loader module connected to the transfer module and extending along a second direction orthogonal to the first direction. The loader module includes a main housing having a load port configured to load a transfer target into the loader module, and a sub-housing formed separately from the main housing and smaller than the main housing and connected to the transfer module in the second direction of the main housing. The second direction is a direction parallel to a carrier conveyance line for conveying a carrier configured to accommodate the transfer target.

Abstract: There is an inspection system including multiple inspection units configured to inspect substrates, wherein each of the inspection units includes: a tester configured to inspect a substrate; a moving part configured to hold and move the substrate relative to the tester; and a frame structure configured to accommodate the tester and the moving part, wherein the frame structure of one inspection unit includes: a first frame to be connected to a frame structure of another inspection unit; and a second frame that accommodates at least the moving part and is configured to move relative to the first frame to extract the moving part from the first frame.

Abstract: A trolley includes a trolley body which in turn includes a wheel that is freely movable on a floor, and a first support that supports a component of a substrate processing apparatus that slides in a lateral direction and is pulled out to an outside of the substrate processing apparatus. The trolley also includes a second support that is connected to the trolley body so as to be freely movable between a first position where a width of the trolley in the lateral direction is a first length and a second position where the width in the lateral direction is a second length longer than the first length, and configured to support the component at the second position together with the first support.

Abstract: There is an inspection system including multiple inspection units configured to inspect substrates, wherein each of the inspection units includes: a tester configured to inspect a substrate; a moving part configured to hold and move the substrate relative to the tester; and a frame structure configured to accommodate the tester and the moving part, wherein the frame structure of one inspection unit includes: a first frame to be connected to a frame structure of another inspection unit; and a second frame that accommodates at least the moving part and is configured to move relative to the first frame to extract the moving part from the first frame.

Abstract: An inspection apparatus includes: inspection chamber rows in each of which inspection chambers are arranged, the inspection chamber rows arranged in multiple stages and each of the inspection chambers being configured to accommodate therein a tester configured to inspect an inspection object on a chuck top; a refrigerant supplier configured to supply a refrigerant gas; and a controller. The refrigerant supplier includes: a refrigerant gas pipe connecting the chuck tops in each inspection chamber row to allow the refrigerant gas to pass therethrough; and a first heat exchanger disposed in the refrigerant gas pipe between the chuck tops to exchange heat with the refrigerant gas discharged from the chuck tops. Each of the chuck tops includes a heater configured to heat the inspection object and a temperature sensor. The controller is configured to control the heater based on a temperature detected by the temperature sensor.

Abstract: There is provided an insertion/extraction mechanism for having one or multiple block members being inserted into or extracted from a frame member forming an intermediate connection member that is disposed between a first member having multiple first members and a second member having multiple second terminals and electrically connects the first terminals and the second terminals, the block member having multiple connection terminals for electrically connecting the first terminals and the second terminals. The insertion/extraction mechanism comprises a first engaging unit and a second engaging unit that are engaged with a first engaged portion and a second engaged portion of the block member, respectively, thereby holding the block member.

Abstract: A method for releasing contact between probes and a substrate is provided. In a state where the probes are pressed against the substrate to be in contact with the substrate, a pressure is reduced in an inspection space that is surrounded by a substrate support having thereon the substrate, a tubular member attracting and holding the substrate support through a seal member, and a frame to which a probe card is fixed. The method includes raising an alignment mechanism to a predetermined position to be close to the substrate support, subsequently stopping the pressure reduction of the inspection space and supporting the substrate support by the alignment mechanism located at the predetermined position while preventing release of the contact, subsequently lowering the alignment mechanism supporting the substrate support to release the contact, and subsequently stopping the attracting and holding of the substrate support by the tubular member.

Abstract: A testing system includes: an inspection module including a plurality of levels of inspection chambers in each of which a tester part having a tester configured to perform an electrical inspection of an inspection object and a probe card is accommodated; an aligner module configured to align the inspection object with the tester part; an alignment area in which the aligner module is accommodated; and a loader part configured to load the inspection object into the alignment area and unload the inspection object out of the aligner module, wherein the inspection module is located adjacent to the alignment area.

Abstract: A testing apparatus includes multiple testing units arrayed in a first axial direction in plan view, the multiple testing units being configured to respectively press probes against electronic devices on chucks to test the electronic devices, multiple gas circulating units respectively disposed in areas each corresponding to one or more testing units among the multiple testing units, the multiple gas circulating units respectively including first fans configured to circulate a gas in the areas along a second axial direction in plan view, multiple temperature detecting units configured to respectively detect temperatures of the chucks, and a controller configured to control drive of the first fans of the multiple gas circulating units based on the detected temperatures of the chucks.

Abstract: There is provided a chuck top for use in an inspection apparatus which inspects a plurality of inspection target devices formed on a wafer. The chuck top is configured to be held by a frame during an inspection of the plurality of inspection target devices while holding the wafer, the chuck top being configured to be attachable to and detachable from an aligner. The chuck top includes a main body, and a drop prevention mechanism provided in the main body and including a movable drop prevention hook configured to prevent the chuck top from being dropped when the chuck top is detached from the frame.

Abstract: A trolley includes a trolley body which in turn includes a wheel that is freely movable on a floor, and a first support that supports a component of a substrate processing apparatus that slides in a lateral direction and is pulled out to an outside of the substrate processing apparatus. The trolley also includes a second support that is connected to the trolley body so as to be freely movable between a first position where a width of the trolley in the lateral direction is a first length and a second position where the width in the lateral direction is a second length longer than the first length, and configured to support the component at the second position together with the first support.

Abstract: An inspection system configured to inspect a device within a substrate is provided. The inspection system includes an inspection module, an alignment module, a supporting device and a fixing device. The inspection module has multiple testers and multiple inspection chambers. The multiple testers are allowed to be accommodated in the multiple inspection chambers, respectively. The alignment module has an aligner. The aligner is placed in an alignment space. The aligner is configured to adjust a position of the substrate to be inspected with respect to one tester of the multiple testers, which is accommodated in the alignment space. The supporting device is configured to support the tester accommodated in the alignment space from below. The fixing device is configured to fix the tester accommodated in the alignment space in cooperation with the supporting device.

Abstract: An inspection device for inspecting an inspection target substrate includes a probe card, a tester, a plurality of conductive lines, and a resistor. The probe card has probes to be in contact with the inspection target substrate. The tester is configured to transmit and receive electric signals for an inspection to and from the inspection target substrate through the probes. The conductive lines electrically connect the probe card with the tester, and at least a part of the conductive lines is electrically connected to the probes. The resistor is formed at the probe card and serves as an electrical resistor. The tester is further configured to measure a resistance of the resistor based on the electric signals transmitted and received through the conductive lines.

Abstract: An inspection apparatus configured to inspect a target object includes a placing device configured to place the target object thereon; a heater provided in the placing device and configured to adjust a temperature of the placing device; and a position adjusting mechanism configured to hold the placing device on which the target object is placed, and configured to perform a position adjustment between the target object placed on the placing device and a terminal to be brought into contact with the target object when an inspection of an electrical characteristic is performed. The placing device is configured to be separated from the position adjusting mechanism when the inspection of the electrical characteristic is performed. A heat sink having prominences and depressions is provided at a portion of the placing device except a holding target portion thereof which is to be held by the position adjusting mechanism.

Abstract: There is provided a prober including inspection rooms. Each of the inspection rooms includes: a probe card having probes; a chuck top configured to mount a wafer; and a temperature adjuster configured to adjust a temperature of the chuck top. At least one of the probe card and the chuck top includes a gap adjustment member configured to maintain a constant gap between the probe card and the chuck top. The probe card is preheated by heat of the chuck top whose temperature is adjusted by the temperature adjuster, in a state in which the wafer is not mounted on the chuck top and in a state in which the probe card and the chuck top are connected with each other via the gap adjustment member.

Abstract: There is provided a prober provided with a plurality of inspection chambers. Each inspection chambers includes: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a cleaning wafer thereon; an aligner configured to drive the chuck top in a vertical direction when the probe card is cleaned using the cleaning wafer; a seal mechanism configured to allow a sealed space to be provided between the probe card holder and the chuck top; a pressure sensor configured to detect an internal pressure of the sealed space, which fluctuates with an operation of the chuck top driven by the aligner; and an electro-pneumatic regulator configured to control the internal pressure of the sealed space by performing an intake or exhaust operation with respect to the sealed space based on the internal pressure detected by the pressure sensor.

Abstract: A method for releasing contact between probes and a substrate is provided. In a state where the probes are pressed against the substrate to be in contact with the substrate, a pressure is reduced in an inspection space that is surrounded by a substrate support having thereon the substrate, a tubular member attracting and holding the substrate support through a seal member, and a frame to which a probe card is fixed. The method includes raising an alignment mechanism to a predetermined position to be close to the substrate support, subsequently stopping the pressure reduction of the inspection space and supporting the substrate support by the alignment mechanism located at the predetermined position while preventing release of the contact, subsequently lowering the alignment mechanism supporting the substrate support to release the contact, and subsequently stopping the attracting and holding of the substrate support by the tubular member.

Abstract: A prober includes a plurality of inspection chambers, each of the plurality of inspection chambers including: a probe card having a plurality of probes; a probe card holder configured to hold the probe card; a chuck top configured to place a wafer on the chuck top; a seal mechanism configured to form a sealed space between the probe card holder and the chuck top; a temperature adjustor configured to adjust a temperature of the chuck top; and a gas supplier configured to supply a dry gas to the sealed space, and wherein, in a state in which no wafer is placed on the chuck top, the sealed space is purged with the dry gas, and precooling of the probe card is performed by cold heat of the chuck top having a temperature adjusted by the temperature adjustor.

Abstract: An inspection apparatus includes: inspection chamber rows in each of which inspection chambers are arranged, the inspection chamber rows arranged in multiple stages and each of the inspection chambers being configured to accommodate therein a tester configured to inspect an inspection object on a chuck top; a refrigerant supplier configured to supply a refrigerant gas; and a controller. The refrigerant supplier includes: a refrigerant gas pipe connecting the chuck tops in each inspection chamber row to allow the refrigerant gas to pass therethrough; and a first heat exchanger disposed in the refrigerant gas pipe between the chuck tops to exchange heat with the refrigerant gas discharged from the chuck tops. Each of the chuck tops includes a heater configured to heat the inspection object and a temperature sensor. The controller is configured to control the heater based on a temperature detected by the temperature sensor.