Patents by Inventor Jun Fujinawa
Jun Fujinawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8986795Abstract: When manufacturing a functional film to be formed by using a plasma CVD method while transporting an elongated substrate in a longitudinal direction, an object is to provide a manufacturing method which can prevent a product or the inside of a film forming system from being contaminated during the exposure to air after the film forming is stopped, and can improve productivity and a product quality. The object is achieved by introducing a gas for the exposure to the air into the film forming system after hindering a surface of a film forming electrode from coming into contact with the air inside the film forming system.Type: GrantFiled: August 28, 2013Date of Patent: March 24, 2015Assignee: FUJIFILM CorporationInventor: Jun Fujinawa
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Patent number: 8980374Abstract: A functional film having a particular organic film and a particular inorganic film is produced. The functional film is consistently produced and exhibits the intended performance. The functional film production method includes forming an organic film on a surface of a substrate, handling the substrate having the organic film formed thereon so that no member comes in contact with an organic film surface in vacuum until formation of an inorganic film, and forming the inorganic film by vacuum deposition on the organic film surface.Type: GrantFiled: January 30, 2009Date of Patent: March 17, 2015Assignee: FUJIFILM CorporationInventors: Masami Nakagame, Hiroyuki Nishida, Norihiro Kadota, Jun Fujinawa, Daisuke Onodera
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Publication number: 20150050478Abstract: A gas barrier film including a substrate of which the surface is formed of an organic material; an inorganic film which is formed on the substrate and contains silicon nitride; and a mixed layer which is formed in an interface between the substrate and the inorganic film, and contains components derived from the organic material and the inorganic film, wherein a compositional ratio N/Si between nitrogen and silicon contained in the inorganic film is 1.00 to 1.35, the inorganic film has a film density of 2.1 g/cm3 to 2.4 g/cm3 and a film thickness of 10 nm to 60 nm, and the mixed layer has a thickness of 5 nm to 40 nm.Type: ApplicationFiled: September 26, 2014Publication date: February 19, 2015Applicant: FUJIFILM CORPORATIONInventors: Yoshihiko MOCHIZUKI, Jun FUJINAWA
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Publication number: 20130344257Abstract: When manufacturing a functional film to be formed by using a plasma CVD method while transporting an elongated substrate in a longitudinal direction, an object is to provide a manufacturing method which can prevent a product or the inside of a film forming system from being contaminated during the exposure to air after the film forming is stopped, and can improve productivity and a product quality. The object is achieved by introducing a gas for the exposure to the air into the film forming system after hindering a surface of a film forming electrode from coming into contact with the air inside the film forming system.Type: ApplicationFiled: August 28, 2013Publication date: December 26, 2013Applicant: FUJIFILM CorporationInventor: Jun FUJINAWA
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Patent number: 8592004Abstract: A film deposition method deposits a film on a surface of a substrate in strip form traveling on a peripheral surface of a cylindrical drum in at least one film deposition compartment around the peripheral surface of the drum. The method disposes previously a differential compartment between one film deposition compartment and a compartment including a wrapping space containing at least one of a first position at which the substrate starts to travel on the drum and a second position at which the substrate separates from the drum, the differential compartments communicating with the compartment including the wrapping space and the film deposition compartment, sets a first pressure of the wrapping space lower than a second pressure of the at least one film deposition compartment and performs film deposition in the film deposition compartment with electric power supplied to the drum.Type: GrantFiled: September 13, 2010Date of Patent: November 26, 2013Assignee: Fujifilm CorporationInventors: Tatsuya Fujinami, Shinsuke Takahashi, Jun Fujinawa, Kouji Tonohara
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Patent number: 8540837Abstract: A method for manufacturing a functional film includes steps of: feeding a support continuously from a first film roll, forming a coating film on the support, providing a laminate film on a surface of the coating film, and taking up the support to a second film roll; and loading the second film roll made by the aforementioned step in a vacuum film-forming apparatus, feeding the support provided with the laminate film continuously from the film roll, peeling off the laminate film, forming an inorganic film on the coating film on the support, and taking up the support to a third film roll.Type: GrantFiled: February 25, 2010Date of Patent: September 24, 2013Assignee: FUJIFILM CorporationInventors: Eijirou Iwase, Jun Fujinawa, Toyoaki Hieda, Toshiyuki Katagiri, Hiroshi Arakatsu
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Patent number: 8133533Abstract: The method for producing a functional film includes a step of forming an organic film on a surface of a substrate and a step of forming an inorganic film by vacuum deposition on a surface of the organic film to produce the functional film. Prior to forming the inorganic film, a member contacts the surface of the organic film in a vacuum chamber at portions where the organic film does not exhibit its functions.Type: GrantFiled: January 30, 2009Date of Patent: March 13, 2012Assignee: Fujifilm CorporationInventors: Masami Nakagame, Hiroyuki Nishida, Norihiro Kadota, Jun Fujinawa
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Patent number: 8092600Abstract: The plasma apparatus includes a conveying unit for conveying a substrate in a conveying direction while being situated at a processing position, an elongated electric field forming unit for forming an induction electric field by a coil, opposed to the processing position, a power supply for supplying high frequency power to the coil, an elongated gas introducing unit and a separating unit for separating a region where the forming unit is arranged and a region where the introducing unit is arranged from each other in an airtight fashion, having an elongated dielectric window arranged between the processing position and the forming unit. The forming unit, the introducing unit and the dielectric window are arranged in such a way that there longitudinal directions are matched with a width direction of the substrate being conveyed, and orthogonal to the conveying direction.Type: GrantFiled: November 1, 2007Date of Patent: January 10, 2012Assignee: Fujifilm CorporationInventors: Jun Fujinawa, Norihiro Kadota
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Patent number: 8039373Abstract: A pattern film forming method includes a step of producing a transfer sheet in which a thin film is formed on a surface of a sheet-shaped material and a step of pressing the thin film against a pattern film formation surface of the substrate with a pressing member having convex portions corresponding to the pattern film from a reverse surface of the transfer sheet opposite to the thin film or a reverse surface of the substrate opposite to the pattern film formation surface to transfer the thin film to the substrate. A pattern film forming apparatus includes a sheet supply device, a pressing device and a substrate transport device. A high-definition pattern film having a desired pattern and a sharp edge can be formed with high productivity.Type: GrantFiled: May 16, 2007Date of Patent: October 18, 2011Assignee: FUJIFILM CorporationInventors: Jun Fujinawa, Junji Nakada, Norio Shibata, Takashi Kataoka
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Publication number: 20110064890Abstract: A film deposition method deposits a film on a surface of a substrate in strip form traveling on a peripheral surface of a cylindrical drum in at least one film deposition compartment around the peripheral surface of the drum. The method disposes previously a differential compartment between one film deposition compartment and a compartment including a wrapping space containing at least one of a first position at which the substrate starts to travel on the drum and a second position at which the substrate separates from the drum, the differential compartments communicating with the compartment including the wrapping space and the film deposition compartment, sets a first pressure of the wrapping space lower than a second pressure of the at least one film deposition compartment and performs film deposition in the film deposition compartment with electric power supplied to the drum.Type: ApplicationFiled: September 13, 2010Publication date: March 17, 2011Applicant: FUJIFILM CORPORATIONInventors: Tatsuya FUJINAMI, Shinsuke TAKAHASHI, Jun FUJINAWA, Kouji TONOHARA
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Publication number: 20110041765Abstract: The film deposition device includes a CVD film forming room disposed on a travel path of a substrate and having a function of performing the film deposition on a substrate by CVD, a treatment room disposed upstream or downstream of the CVD film forming room on the travel path and having a function of performing a predetermined treatment on the substrate, and a differential room disposed between and communicating with the CVD film forming room and the treatment room. The differential room includes a evacuation unit, a gas introducing unit for introducing at least one of a gas to be supplied to both of the CVD film forming room and the treatment room, and an inert gas, and a controller which controls the evacuation unit and the gas introducing unit to keep the differential room at a higher pressure than the CVD film forming room and the treatment room.Type: ApplicationFiled: August 24, 2010Publication date: February 24, 2011Applicant: FUJIFILM CORPORATIONInventors: Tatsuya FUJINAMI, Shinsuke TAKAHASHI, Kouji TONOHARA, Jun FUJINAWA
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Publication number: 20100297473Abstract: A method for manufacturing a functional film, includes the steps of: continuously feeding a support from a first film roll, forming, on the support, a coating film having a degree of hardness of 3B or more, and winding up the support into a second film roll at a tension of 30 N/m or more; and loading the second film roll which has been wound up in the prior step in a vacuum film forming apparatus, continuously feeding the support from the second film roll, forming an inorganic film on the coating film formed on the support, and winding up the support into a third film roll.Type: ApplicationFiled: May 18, 2010Publication date: November 25, 2010Applicant: FUJIFILM CORPORATIONInventors: Eijirou Iwase, Jun Fujinawa
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Publication number: 20100215986Abstract: A method for manufacturing a functional film includes steps of: feeding a support continuously from a first film roll, forming a coating film on the support, providing a laminate film on a surface of the coating film, and taking up the support to a second film roll; and loading the second film roll made by the aforementioned step in a vacuum film-forming apparatus, feeding the support provided with the laminate film continuously from the film roll, peeling off the laminate film, forming an inorganic film on the coating film on the support, and taking up the support to a third film roll.Type: ApplicationFiled: February 25, 2010Publication date: August 26, 2010Applicant: FUJIFILM CORPORATIONInventors: Eijirou IWASE, Jun FUJINAWA, Toyoaki HIEDA, Toshiyuki KATAGIRI, Hiroshi ARAKATSU
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Publication number: 20090196997Abstract: A functional film having a particular organic film and a particular inorganic film is produced. The functional film is consistently produced and exhibits the intended performance. The functional film production method includes forming an organic film on a surface of a substrate, handling the substrate having the organic film formed thereon so that no member comes in contact with an organic film surface in vacuum until formation of an inorganic film, and forming the inorganic film by vacuum deposition on the organic film surface.Type: ApplicationFiled: January 30, 2009Publication date: August 6, 2009Applicant: FUJIFILM CORPORATIONInventors: Masami NAKAGAME, Hiroyuki NISHIDA, Norihiro KADOTA, Jun FUJINAWA, Daisuke ONODERA
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Publication number: 20090196998Abstract: The method for producing a functional film includes a step of forming an organic film on a surface of a substrate and a step of forming an inorganic film by vacuum deposition on a surface of the organic film to produce the functional film. Prior to forming the inorganic film, a member contacts the surface of the organic film in a vacuum chamber at portions where the organic film does not exhibit its functions.Type: ApplicationFiled: January 30, 2009Publication date: August 6, 2009Applicant: FUJIFILM CORPORATIONInventors: Masami NAKAGAME, Hiroyuki Nishida, Norihiro Kadota, Jun Fujinawa
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Patent number: 7462927Abstract: A pattern film forming method includes a step of producing a transfer sheet in which a thin film is formed on a surface of a sheet-shaped material and a step of pressing the thin film against a pattern film formation surface of the substrate with a pressing member having convex portions corresponding to the pattern film from a reverse surface of the transfer sheet opposite to the thin film or a reverse surface of the substrate opposite to the pattern film formation surface to transfer the thin film to the substrate. A pattern film forming apparatus includes a sheet supply device, a pressing device and a substrate transport device. A high-definition pattern film having a desired pattern and a sharp edge can be formed with high productivity.Type: GrantFiled: January 14, 2005Date of Patent: December 9, 2008Assignee: FUJIFILM CorporationInventors: Jun Fujinawa, Junji Nakada, Norio Shibata, Takashi Kataoka
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Publication number: 20080102222Abstract: The plasma apparatus includes a conveying unit for conveying a substrate in a conveying direction while being situated at a processing position, an elongated electric field forming unit for forming an induction electric field by a coil, opposed to the processing position, a power supply for supplying high frequency power to the coil, an elongated gas introducing unit and a separating unit for separating a region where the forming unit is arranged and a region where the introducing unit is arranged from each other in an airtight fashion, having an elongated dielectric window arranged between the processing position and the forming unit. The forming unit, the introducing unit and the dielectric window are arranged in such a way that there longitudinal directions are matched with a width direction of the substrate being conveyed, and orthogonal to the conveying direction.Type: ApplicationFiled: November 1, 2007Publication date: May 1, 2008Applicant: FUJIFILM CorporationInventors: Jun Fujinawa, Norihiro Kadota
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Publication number: 20070224812Abstract: A pattern film forming method includes a step of producing a transfer sheet in which a thin film is formed on a surface of a sheet-shaped material and a step of pressing the thin film against a pattern film formation surface of the substrate with a pressing member having convex portions corresponding to the pattern film from a reverse surface of the transfer sheet opposite to the thin film or a reverse surface of the substrate opposite to the pattern film formation surface to transfer the thin film to the substrate. A pattern film forming apparatus includes a sheet supply device, a pressing device and a substrate transport device. A high-definition pattern film having a desired pattern and a sharp edge can be formed with high productivity.Type: ApplicationFiled: May 16, 2007Publication date: September 27, 2007Inventors: Jun Fujinawa, Junji Nakada, Norio Shibata, Takashi Kataoka
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Patent number: 7202007Abstract: This method forms a patterned film. The method prepares a transfer member having a transfer surface on which asperities are formed in accordance with a film pattern to be formed, performs stripping treatment on surfaces of at least ridges formed on the transfer surface of the transfer member, thereafter forms a thin film formed by a technology of vacuum film formation on the surfaces of the at least ridges formed on the transfer surface of the transfer member and transfers the thin film formed on the surfaces of at least ridges of the transfer member onto a substrate, thereby forming the patterned film on the substrate.Type: GrantFiled: June 9, 2003Date of Patent: April 10, 2007Assignee: Fujifilm CorporationInventors: Norio Shibata, Junji Nakada, Jun Fujinawa
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Patent number: 7033855Abstract: The optical component includes a substrate made of a resin material, a silicon oxide film formed on a surface of the substrate, and a multilayer light reflection preventing film formed on the silicon oxide film, and having at least one layer of a low-refractive-index material and at least one layer of a high-refractive-index material being alternately formed. The silicon oxide film is thick and/or formed by introducing oxygen during film forming by vacuum deposition so that a preset elasticity is imparted to the silicon oxide film. Other optical component includes a substrate made of a resin material and a plurality of films formed by vacuum deposition, and directions of internal stresses in each adjacent pair of the plurality of films are different from each other or a thickness of an impurity existing on a surface of the substrate is 0.2 nm or less.Type: GrantFiled: November 5, 2004Date of Patent: April 25, 2006Assignee: Fuji Photo Film Co., Ltd.Inventors: Jun Fujinawa, Junji Nakada