Abstract: A focussing method and system transmits a light for measuring a focus to a semiconductor wafer at a fixed incident angle having high reflectance and detects a light reflected at a surface of a photoresist layer on the semiconductor wafer. The light is transmitted at an incident angle such that the amount of light reflected from the surface of the photoresist layer is larger than the amount of light which penetrates the surface thereof. The reflected light is detected, and the position of the semiconductor wafer is controlled in response to the amount of light detected. The focussing system has a source part, a detection part, and a control part. The source part creates the light and then transmits the light to the surface of the photoresist layer. The detection part detects the amount of reflected light and generates a detection signal corresponding thereto. The control part controls the position of the semiconductor wafer in response to the detection signal generated at the detection part.

Abstract: An apparatus for baking resists on semiconductor wafers, which is capable of preventing cold air from entering the interior of the baking chamber while a baking process is carried out, by controlling the temperature of ambient air surrounding the baking chamber to equal the internal temperature of the baking chamber. This control is achieved by providing a hot air supply unit and nozzles. The hot air supply unit generates hot air heated to a desired temperature and supplies the generated hot air to the nozzles. The nozzles are connected to the hot air supply unit and arranged near the baking chamber. The nozzles inject the hot air onto the outer surface of the baking chamber. The nozzles may be arranged around the entrance of the baking chamber where a wafer to be baked is loaded. In this case, the nozzles inject heated air onto opposite surfaces of the wafer being loaded or unloaded. The baking apparatus may have a configuration including a cooling chamber, a feeding chamber and a baking chamber.