Patents by Inventor Jungi JEONG

Jungi JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250007166
    Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate than a 4G communication system such as LTE. An electronic device comprising an antenna module, according to an embodiment of the present disclosure, comprises: a communication module for communicating with an external electronic device; a first antenna module including a plurality of first antenna cells and first dummy cells surrounding the plurality of first antenna cells; and a controller for controlling the communication module and the first antenna module. Each of the plurality of first antenna cells may be configured to have a first size, and each of the first dummy cells may be configured to have a second size smaller than the first size.
    Type: Application
    Filed: November 14, 2022
    Publication date: January 2, 2025
    Inventors: Jungwoo SEO, Jungi JEONG, Taeksun KWON, Chanju PARK, Dongjin JUNG, Sanghyuk WI, Seungyoon LEE
  • Patent number: 12183977
    Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub.
    Type: Grant
    Filed: July 28, 2023
    Date of Patent: December 31, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungi Jeong, Chanju Park, Junhwa Oh, Sanghyuk Wi
  • Publication number: 20240421854
    Abstract: Provided is a 5G or 6G communication system for supporting higher data rates after the 4G communication system such as LTE. According to the disclosure, a base station (BS) including a near field reflecting intelligent surface (RIS) may include the near field RIS including at least one meta surface which reflects an RIS beam into a target area, a transceiver and a processor. The processor may be configured to identify an operation mode among a normal mode or an RIS mode based on whether a target area is included in a reflecting beam coverage, and control the transceiver to transmit the RIS beam onto the meta surface based on at least one of a type of the near field RIS, configuration information of the near field RIS or information about the target area, in response to the operation mode being identified as the RIS mode.
    Type: Application
    Filed: October 21, 2022
    Publication date: December 19, 2024
    Inventors: Jungi JEONG, Junhwa OH, Sanghyuk WI, Seungyoon LEE, Yuntae PARK
  • Publication number: 20240266744
    Abstract: A stacked patch antenna includes an upper ground plate including a first upper hole, a first feed pad provided on the upper ground plate, a first feed line extending from the first feed pad along a first direction, a lower antenna patch provided on the first feed pad, an upper antenna patch provided on the lower antenna patch, a first upper pad provided in the first upper hole, and a first upper stub protruding from a side surface of the first upper pad.
    Type: Application
    Filed: April 19, 2022
    Publication date: August 8, 2024
    Inventors: Taeksun KWON, Chanju PARK, Jungi JEONG, Jungwoo SEO, Seungyoon LEE, Dongjin JUNG
  • Publication number: 20240235009
    Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
    Type: Application
    Filed: April 28, 2022
    Publication date: July 11, 2024
    Inventors: Dongjin JUNG, Chanju PARK, Jungi JEONG, Taeksun KWON, Jungwoo SEO, Junhwa OH
  • Publication number: 20240195458
    Abstract: A 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). A reconfigurable intelligent surface (RIS) including a plurality of unit cells in a wireless communication system includes a first pattern included in a top layer of a unit cell included in the RIS, a second pattern included in a bottom layer of the unit cell included in the RIS, and at least one switch configured to electrically ground or short the first pattern and the second pattern in response to a command for determining whether the unit cell included in the RIS operates as a transmissive RIS or a reflective RIS.
    Type: Application
    Filed: December 12, 2023
    Publication date: June 13, 2024
    Inventors: Junhwa OH, Yuntae PARK, Sanghyuk WI, Jungi JEONG
  • Publication number: 20240136703
    Abstract: An antenna module, according to various embodiments, may comprise: a first layer including a first etching region, a first via pad disposed to be spaced apart from an edge of the first etching region, and a first via hole disposed on one surface of the first via pad; and a second layer stacked on one surface of the first layer, and including a second etching region, a plurality of second via pads disposed to be spaced apart from an edge of the second etching region, a plurality of second via holes disposed on one surface of the plurality of second via pads, and a plurality of second dividing lines electrically connecting the plurality of second via pads.
    Type: Application
    Filed: April 27, 2022
    Publication date: April 25, 2024
    Inventors: Dongjin JUNG, Chanju PARK, Jungi JEONG, Taeksun KWON, Jungwoo SEO, Junhwa OH
  • Publication number: 20240129752
    Abstract: The disclosure relates to a 5G or 6G communication system to support a higher data transmission rate. The disclosure relates to a reconfigurable intelligent surface (RIS) enabling a low phase error at various incidence angles/reflection angles and an apparatus including the same. The RIS comprises a unit cell pattern formed in a direction corresponding to a polarization direction, the unit cell configured to adjust a reflection phase; a switch operably connected to the unit cell pattern, the switch configured to adjust the reflection phase; and a dummy pattern positioned between unit cell patterns in case that a plurality of unit cells is arranged.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 18, 2024
    Inventors: Yuntae PARK, Junhwa OH, Sanghyuk WI, Jungi JEONG
  • Publication number: 20240120667
    Abstract: The present disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate beyond a 4G communication system such as LTE.
    Type: Application
    Filed: January 27, 2022
    Publication date: April 11, 2024
    Inventors: Junhwa OH, Chanju PARK, Jungi JEONG, Sanghyuk WI, Sungtae CHOI
  • Publication number: 20240120642
    Abstract: According to various embodiments disclosed in the present document, an antenna module and/or an electronic device including same may comprise: a communication circuit part; an antenna part stacked-up on or above the communication circuit part and comprising multiple antenna elements; and a network part disposed between the communication circuit part and the antenna part. The antenna part may comprise: at least one first subarray formed of a combination of some of the antenna elements; and at least one second subarray formed of a combination another of the antenna elements, and disposed to be point symmetric to the first subarray.
    Type: Application
    Filed: January 26, 2022
    Publication date: April 11, 2024
    Inventors: Chanju PARK, Junhwa OH, Sanghyuk WI, Jungi JEONG
  • Publication number: 20240007176
    Abstract: The present disclosure relates to a 5G communication system or a 6G communication system for supporting higher data rates beyond a 4G communication system such as long term evolution (LTE). A unit cell of a RIS includes a first conductive structure including a first element and a second element disposed under the first element; a second conductive structure including a third element and a fourth element disposed under the third element; and a switch circuit disposed between the first conductive structure and the second conductive structure. As a first RF signal from a first external device is incident on the unit cell, a second RF signal having a first resonance frequency is reflected based on electrical paths formed respectively in the first element and the third element, and a third RF signal having a second resonance frequency different from the first resonance frequency is reflected based on electrical paths formed respectively in the second element and the fourth element.
    Type: Application
    Filed: January 13, 2023
    Publication date: January 4, 2024
    Inventors: Jungi JEONG, Yuntae PARK, Junhwa OH, Seungyoon LEE, Sanghyuk WI
  • Publication number: 20230369778
    Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub.
    Type: Application
    Filed: July 28, 2023
    Publication date: November 16, 2023
    Inventors: Jungi JEONG, Chanju PARK, Junhwa OH, Sanghyuk WI
  • Patent number: 11742587
    Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: August 29, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jungi Jeong, Chanju Park, Junhwa Oh, Sanghyuk Wi
  • Publication number: 20230198161
    Abstract: An antenna module includes: a first antenna unit, a second antenna unit, and a third antenna unit, each of the first antenna unit, the second antenna unit, and the third antenna unit including a first antenna element and a second antenna element that are crossed diagonally with each other; a first signal distributor configured to distribute a first radio frequency (RF) signal to the first antenna element of each of the first antenna unit, the second antenna unit, and the third antenna unit; a second signal distributor configured to distribute a second RF signal to the second antenna element of each of the first antenna unit, the second antenna unit, and the third antenna unit; and first stub circuits connected to line tracks of the first signal distributor connected to the first antenna unit, the second antenna unit, and the third antenna unit.
    Type: Application
    Filed: January 27, 2023
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jungmin PARK, Hyunjin KIM, Seungtae KO, Yoongeon KIM, Bumhee LEE, Jungi JEONG
  • Publication number: 20230198138
    Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the present disclosure, an electronic device may include: a printed circuit board (PCB); an antenna; a radome; and a coupling structure, the antenna may be disposed to be positioned at a first height from a first surface of the PCB, the coupling structure may be physically connected with the radome, and the coupling structure may be disposed to have a second height lower than or equal to the first height, with respect to the first surface of the PCB.
    Type: Application
    Filed: February 14, 2023
    Publication date: June 22, 2023
    Inventors: Jungi JEONG, Seungtae KO, Jongmin LEE, Yoongeon KIM, Bumhee LEE, Youngju LEE, Seungho CHOI
  • Publication number: 20220352648
    Abstract: The disclosure relates to a communication technique for merging an IoT technology with a 5th Generation (5G) communication system for supporting a higher data transmission rate than a 4th Generation (4G) system, and a system therefor. The disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail, security- and safety-related services, and the like) on the basis of 5G communication technologies and IoT-related technologies. An electronic device is provided. The electronic device includes a board, a plurality of antenna arrays arranged on the board, and a plurality of floating radiator arrays arranged on the board to be spaced apart from the plurality of antenna arrays by a predetermined distance. The plurality of floating radiator arrays are electromagnetically coupled to the plurality of antenna arrays.
    Type: Application
    Filed: July 13, 2022
    Publication date: November 3, 2022
    Inventors: Jungi JEONG, Hyunjin KIM, Bumhee LEE, Seungtae KO, Youngju LEE
  • Publication number: 20220247087
    Abstract: The disclosure relates to a 5th generation (5G) or 6th generation (6G) communication system for supporting a higher data transfer rate beyond 4th generation (4G) communication such as long-term evolution (LTE). An antenna module is provided. The antenna module includes a communication circuit, an antenna unit comprising multiple antenna elements constituting a subarray, and a network unit disposed beneath the antenna unit in multiple layers, the network unit comprising at least one transmission line configured to be branched to positions of the multiple antenna elements, a via hole extending through the multi-layer, and a stub structure disposed on an area adjacent to the via hole. The open stub structure designed on a first layer forming a ground plane, among the multiple layers, may include a first via pad disposed to be adjacent to the via hole, a first open stub extending from the first via pad in a first direction, and a first slot part configured to surround the first via pad and the first open stub.
    Type: Application
    Filed: January 21, 2022
    Publication date: August 4, 2022
    Inventors: Jungi JEONG, Chanju PARK, Junhwa OH, Sanghyuk WI