Patents by Inventor Jun GODA

Jun GODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9680075
    Abstract: A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: June 13, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Toru Hirano, Masanori Suzuki, Hideaki Hyuga, Ryoji Imai, Jun Goda
  • Patent number: 9437581
    Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: September 6, 2016
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
  • Patent number: 9187002
    Abstract: A connector main body of a connector accommodates a contact unit, a power cut-off unit that has an electric conductor unit, and open and close a power feeding path between an electrically driven vehicle and an electric power apparatus by bringing into contact or opening electric conductor unit, and an abnormality detection unit that detects an abnormality that occurs on power feeding path, or receives an abnormality signal from outside, an abnormality transmission unit that, when abnormality detection unit detects abnormality or receives abnormality signal, mechanically opens electric conductor unit, and a handle that mechanically brings into contact or opens electric conductor unit in a state in which abnormality detection unit does not detect abnormality and does not receive abnormality signal. Abnormality detection unit detects at least one of a short-circuit current and an overload current that occur on power feeding path as abnormality.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: November 17, 2015
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takuya Kagawa, Tetsuji Shibata, Jun Goda, Haeree Lee
  • Publication number: 20150263549
    Abstract: This connector for electrical connection for electrically driven vehicle includes: a contact portion configured to electrically connect an electric cable, electrically connected with one of an electrically driven vehicle or a power apparatus, with the other; and a main body. Main body houses therein the contact portion, a power cutoff portion and a first abnormality detector. Power cutoff portion is configured to switch opening/closing of a feed line between the electrically driven vehicle and the power apparatus. First abnormality detector is configured to detect an abnormality that occurs in the feed line, or externally receive an abnormal signal. Power cutoff portion is configured to open the feed line, when first abnormality detector detects the abnormality or receives the abnormal signal. First abnormality detector is configured to detect, as the abnormality, at least one of a short-circuit current in the feed line or an overload current in the feed line.
    Type: Application
    Filed: September 19, 2013
    Publication date: September 17, 2015
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Haeree Lee, Takuya Kagawa, Tetsuji Shibata, Jun Goda
  • Publication number: 20150108510
    Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
    Type: Application
    Filed: May 24, 2013
    Publication date: April 23, 2015
    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
  • Publication number: 20150048402
    Abstract: A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.
    Type: Application
    Filed: August 30, 2013
    Publication date: February 19, 2015
    Applicant: PANASONIC CORPORATION
    Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Toru Hirano, Masanori Suzuki, Hideaki Hyuga, Ryoji Imai, Jun Goda
  • Publication number: 20140091759
    Abstract: A connector main body of a connector accommodates a contact unit, a power cut-off unit that has an electric conductor unit, and open and close a power feeding path between an electrically driven vehicle and an electric power apparatus by bringing into contact or opening electric conductor unit, and an abnormality detection unit that detects an abnormality that occurs on power feeding path, or receives an abnormality signal from outside, an abnormality transmission unit that, when abnormality detection unit detects abnormality or receives abnormality signal, mechanically opens electric conductor unit, and a handle that mechanically brings into contact or opens electric conductor unit in a state in which abnormality detection unit does not detect abnormality and does not receive abnormality signal. Abnormality detection unit detects at least one of a short-circuit current and an overload current that occur on power feeding path as abnormality.
    Type: Application
    Filed: September 18, 2013
    Publication date: April 3, 2014
    Applicant: PANASONIC CORPORATION
    Inventors: Takuya KAGAWA, Tetsuji SHIBATA, Jun GODA, Haeree LEE