Patents by Inventor Jun Gul Hwang

Jun Gul Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 11127692
    Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: September 21, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gun Lee, Jun Gul Hwang, Ji Eun Woo, Sung Keun Park
  • SEMICONDUCTOR PACKAGE
    Publication number: 20200168562
    Abstract: A semiconductor package includes a semiconductor chip, and a connection structure disposed on at least one side of the semiconductor chip, and including an insulating layer and a redistribution layer electrically connected to the semiconductor chip, wherein the redistribution layer includes a plurality of conductive patterns, and at least two of the plurality of conductive patterns have different degrees of surface roughness, and a conductive pattern having a higher surface roughness has a width wider than a width of a conductive pattern having a lower surface roughness.
    Type: Application
    Filed: April 24, 2019
    Publication date: May 28, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gun Lee, Jun Gul Hwang, Ji Eun Woo, Sung Keun Park