Abstract: A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.

Abstract: A process of forming an overmolded lead frame assembly for a pressure sensing application includes clamping both sides of a lead frame to performing a primary overmolding operation to prevent resin flash on wire bonding areas on the lead frame. The process also includes performing the primary overmolding operation to form a primary mold that covers selected portions of the lead frame on first and second sides of the lead frame assembly. The primary mold forms an electronics cavity on the first side of the lead frame assembly to enable subsequent wire-bonding of a microelectromechanical system (MEMS) pressure sensing element to the wire bonding areas. The process further includes performing a secondary overmolding operation to form a secondary mold on the second side of the lead frame assembly. The secondary mold covers an exposed portion of the lead frame beneath the wire bonding areas.

Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.

Abstract: A combined pressure and temperature sensing device includes a sensor port geometry that provides improved contact between a fluid media being measured and a thermistor cavity of the sensor port. The increased contact area provides improved response time and accuracy compared to previously known integrated pressure-temperature sensors. A temperature sensor element is offset from a pressure sensor element relative to a central axis of the temperature-pressure sensor body/package to facilitate substantially increasing a pressures sensor cavity volume without increasing the overall sensor port diameter. A wire-bondable thermistor support portion facilitates high volume automated production line. The temperature sensing element may be resistance welded to the thermistor support portion in a parallel manufacturing process.