Patents by Inventor Jun-Hak PARK

Jun-Hak PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260146311
    Abstract: The present invention relates to a steel sheet and a method for manufacturing same and, more specifically, to a high-strength steel sheet having excellent corrosion resistance and a method for manufacturing same.
    Type: Application
    Filed: December 14, 2023
    Publication date: May 28, 2026
    Applicant: POSCO CO., LTD
    Inventors: Jun-Hak PARK, Han-Hwi KIM, Yun-Ik KWON, Jong-Won PARK
  • Patent number: 10458031
    Abstract: An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 ?m or less (except O ?m), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.
    Type: Grant
    Filed: March 25, 2015
    Date of Patent: October 29, 2019
    Assignee: POSCO
    Inventors: Gwan-Ho Jung, Jin-You Kim, Moo-Jin Kim, Jae-Kon Lee, Jun-Hak Park, Jae-Hwa Hong
  • Publication number: 20170342581
    Abstract: An aspect of the present invention provides an Fe—Ni alloy metal foil having excellent heat resilience, where the Fe—Ni alloy metal foil is prepared by an electroforming (EF) method and has a thickness of 100 ?m or less (except O ?m), wherein the Fe—Ni alloy metal foil comprises, by wt %, Ni: 34-46 %, a remainder of Fe and inevitable impurities, and wherein the Fe—Ni metal foil has a degree of heat resilience in an amount of 30 ppm or less.
    Type: Application
    Filed: March 25, 2015
    Publication date: November 30, 2017
    Inventors: Gwan-Ho JUNG, Jin-You KIM, Moo-Jin KIM, Jae-Kon LEE, Jun-Hak PARK, Jae-Hwa HONG