Abstract: A light emitting device includes a light emitting rod in which a porous first type semiconductor layer, an active layer, and a second type semiconductor layer are sequentially arranged, and a wavelength conversion cluster is embedded in the porous first type semiconductor layer and configured to convert a first light generated in the active layer into a second light having a different wavelength.

Abstract: Provided is a continuous stirred tank reactor for an aldol condensation reaction and an apparatus for an aldol condensation reaction including the same, which prevent a decrease in a conversion rate due to dead zone occurrence even in the case of an increase of an installation scale, have a high output, have a significantly increased reaction surface area during the reaction, suppress layer separation between an aqueous phase and an organic phase, and have a significantly decreased average particle diameter of organic layer particles dispersed in the aqueous phase and a significantly decreased deviation thereof. In addition, a content of the catalyst used per unit yield may be significantly decreased as compared with the conventional reactor and apparatus, and costs required for wastewater treatment may be significantly reduced as compared with the conventional reactor and apparatus.

Abstract: Provided is an apparatus for an aldol condensation reaction having high productivity at low cost. Specifically, the apparatus for an aldol condensation reaction according to the present invention has an effect of having high productivity by preventing a drop in a conversion rate due to an increase in a residence time when increasing a facility scale, allows conditions of raising a concentration of a catalyst and a temperature, and has an effect of minimizing a content of the catalyst used at the same yield as compared with a conventional apparatus. In addition, costs required for increasing a facility scale may be minimized without adding a device such as a pump separately, and an amount of harmful wastewater produced may be minimized.

Abstract: A single crystal semiconductor includes a strain compensation layer; an amorphous substrate disposed on the strain compensation layer; a lattice matching layer disposed on the amorphous substrate and including two or more single crystal layers; and a single crystal semiconductor layer disposed on the lattice matching layer, the lattice matching layer including a direction control film disposed on the amorphous substrate and including a single crystal structure, and a buffer layer including a material different from that of the direction control film, the buffer layer being disposed on the direction control film and including a single crystal structure.

Abstract: A foldable electronic device includes a first and second housings foldably coupled through a hinge, a flexible display supported by the first and second housings, a first speaker disposed in the first housing and a second speaker disposed in the second housing. The electronic device determines first and second states in which the first and second housings unfolded or folded. The electronic device controls sound frequency characteristics of the first and second speakers to have first sound frequency characteristics with the electronic device being in the first state. The electronic device controls sound frequency characteristics of the first speaker to have second sound frequency characteristics with the electronic device being in the second state. The electronic device may also control sound frequency characteristics of the second speaker to have third sound output frequency characteristics with the electronic device being in the second state.

Abstract: A single crystal semiconductor structure includes: an amorphous substrate; a single crystal semiconductor layer provided on the amorphous substrate; and a thin orienting film provided between the amorphous substrate and the single crystal semiconductor layer, wherein the thin orienting film is a single crystal thin film, and the thin orienting film has a non-zero thickness that is equal to or less than 10 times a critical thickness hc.

Abstract: Provided is a method of preparing sulfonated aryl phosphine, the method capable of preparing sulfonated aryl phosphine with high purity and high yield by efficiently removing sulfur trioxide generated during preparing sulfonated aryl phosphine using an extractant.

Abstract: An electronic device includes a housing, an antenna structure disposed in an inner space of the housing, a wireless communication circuit disposed in the inner space, and a first bracket. The antenna structure includes a substrate having a first substrate surface facing in a first direction and a second substrate surface facing in a second direction opposite to the first substrate surface, and a plurality of chip antennas sequentially arranged on the first substrate surface in a third direction perpendicular to the first direction. Each of the plurality of chip antennas includes an antenna element and is separated in the third direction from remaining chip antennas by separation spaces. The first bracket includes first and second protrusions that protrude in the second direction to correspond to the first substrate surface of the substrate. The protrusions are aligned, in the third direction, with the separation spaces.

Abstract: An electronic device is disclosed, including: a plurality of electrical components, a substrate including a circuit electrically connected to the electrical component, wherein a through hole is formed penetrating the substrate in a thickness direction from an upper surface of the substrate, a cable, a head part coupled to an end portion of the cable, and a socket part including a contact pin of which at least a portion thereof is disposed inside the through hole and extends laterally with respect to a lower surface of the substrate, so as to be electrically connected to the substrate, and coupled to the head part in a direction of the upper surface of the substrate.

Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.

Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.

Abstract: An electronic device including antennas is provided.

Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.

Abstract: Disclosed is an electronic device including a window plate comprising a transparent region and an opaque region surrounding the transparent region, a display disposed below the transparent region of the window plate, a housing comprising a first face corresponding to a rear face of the display and a second face corresponding to a side face of the display, the housing surrounding the rear face and the side face of the display, a plurality of antennas disposed between the opaque region of the window plate and the first face of the housing, and a wireless communication module electrically coupled to the plurality of antennas and supporting ultra-wideband communication by using the plurality of antennas, wherein the plurality of antennas comprises a first antenna disposed along a first edge region corresponding to an edge of the first face of the housing, and a second antenna disposed along a second edge region corresponding to the edge of the first face of the housing and perpendicular to the first edge region.

Abstract: An electronic device and method are disclosed. The electronic device includes a display an extended screen area that is exposed or stowed, according to a change in a state of the display of the electronic device, communication circuitry configured to transceive a signal to or using an angle-of-arrival (AOA) antenna disposed within the extended screen area, a memory, and a processor. The processor implements the method, including: determining a position of the electronic device relative to an external electronic device, using the communication circuitry, executing a sharing operation with the external electronic device, identifying whether the display of the electronic device is disposed in a first state or a second state, based on detecting that the display is disposed in the first state, perform a first positioning operation for the external electronic device, and displaying a sharing interface according to the first positioning operation on the display.

Abstract: An electronic device including antennas is provided.

Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.

Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.

Abstract: According to one embodiment of the present specification, an NFC device can comprise: a loop antenna disposed on a first surface of a substrate and transmitting and receiving a wireless signal, wherein an antenna area defined by the outer perimeter or the inner perimeter of the loop antenna is positioned within a first area on the first surface; at least one input interface disposed on the first surface of the substrate, wherein the input interface is positioned within a second area on the first surface, and the first area and the second area are different from each other; and a processor connected to the loop antenna and the input interface. when a user input for the input interface is detected in a communication mode in which the processor can communicate with the external NFC device, the processor can transmit, to an external NFC device through the loop antenna, an RF response signal including control information for executing a function corresponding to the input interface.

Abstract: An electronic device includes a housing including a front plate forming a first surface, a back plate forming a second surface, and a side member forming a side surface surrounding a space between the first and second surfaces; a sound output device disposed in the housing; an electrical component disposed in the housing and having a variable thickness; and a vibration damping member disposed on at least part of the electrical component or formed between the electrical component and the back plate. The vibration damping member is disposed in a variable space having a thickness varying depending on a thickness variation of the electrical component. The vibration damping member has a height varying in a thickness direction of the variable space to correspond to the thickness of the variable space and divides the variable space into a plurality of sub-spaces when the variable space has a specified thickness or more.