Abstract: One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

Abstract: A light emitting device package according to an embodiment comprises: a light emitting device comprising a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second lead frames disposed to be spaced apart from each other; first and second solder portions disposed on the first and second lead frames, respectively; and first and second pads disposed between the first and second solder portions and the first and second conductive semiconductor layers, respectively, wherein at least one of the first or second pad comprises at least one of a rounding portion and a chamfer portion, wherein the first pad comprises a first-first edge and a first-second edge being positioned farther than the first-first edge from the center of the light emitting device, wherein the second pad comprises a second-first edge and a second-second edge being positioned farther than the second-first edge from the center of the light emitting devic

Abstract: A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the

Abstract: Exemplary embodiments relate to a light-emitting element capable of facilitating current spreading and improving a driving voltage by increasing a connection area between a first electrode and a first semiconductor layer.

Abstract: One embodiment relates to a light emitting device which is free from electrostatic discharge by using an electrostatic discharge suppressing pattern including a resin having particles conductive and dispersed therein, the light emitting device comprising: a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; a first electrode connected with the first conductive semiconductor layer; a second electrode connected with the second conductive semiconductor layer; and an electrostatic discharge suppressing pattern, which is overlapped with the first electrode and the second electrode, and of which first particles are dispersed in the resin so as to cover a gap between the first electrode and the second electrode.

Abstract: A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the

Abstract: A light emitting device package according to an embodiment comprises: a light emitting device comprising a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; first and second lead frames disposed to be spaced apart from each other; first and second solder portions disposed on the first and second lead frames, respectively; and first and second pads disposed between the first and second solder portions and the first and second conductive semiconductor layers, respectively, wherein at least one of the first or second pad comprises at least one of a rounding portion and a chamfer portion, wherein the first pad comprises a first-first edge and a first-second edge being positioned farther than the first-first edge from the center of the light emitting device, wherein the second pad comprises a second-first edge and a second-second edge being positioned farther than the second-first edge from the center of the light emitting devic

Abstract: Disclosed herein is a light emitting device package including first lead frame and second lead frame mounted on a package body, a light emitting device electrically connected to the first lead frame and second lead frame, to emit light of a first wavelength range, and an encapsulant surrounding the light emitting device, the encapsulant comprising phosphors to be excited by the light of the first wavelength range, thereby emitting light of a second wavelength range, and a resin having a refractive index of 1.1 to 1.3.