Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.

Abstract: Disclosed is a headrest device for a vehicle. The headrest device may include a stationary headrest portion coupled to a seatback of the vehicle and formed to extend upwards. The stationary headrest portion may be located at a rear of a head of an occupant. The headrest device may include a movable headrest portion coupled to the stationary headrest portion so as to be slidable in a vertical direction, the movable headrest portion may be located in front of the stationary headrest portion. The headrest device may include an actuator including a first side coupled to the fixed part, and a second side coupled to the movable headrest portion. The actuator may be configured to cause the movable headrest portion to slide in the vertical direction.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: Disclosed is a cushion tip-up type seat for a vehicle. The cushion tip-up type seat for a vehicle is configured to perform a tip-up function of a cushion part, and to move a seat leftward and rightward to adjust an interval between left and right seats, whereby left and right spacing between occupants seated in the seats is sufficiently secured and the convenience of the occupants is improved.

Abstract: In some implementations, the anode includes a current collector, a first anode mixture layer formed on at least one surface of the current collector, and a second anode mixture layer formed on the first anode mixture layer. The first anode mixture layer and the second anode mixture layer include a carbon-based active material, respectively. The first anode mixture layer includes a first binder, a first silicon-based active material, and a first conductive material. The second anode mixture layer includes a second binder, a second silicon-based active material, and a second conductive material. Contents of the first conductive material and the second conductive material are different from each other with respect to the total combined weight of the first anode mixture layer and the second anode mixture layer. Types of the first silicon-based active material and the second silicon-based active material are different from each other.

Abstract: The semiconductor package according to the present invention comprises: an integrated substrate; a bottom chip stack, which is mounted on the integrated substrate, has multiple memory semiconductor dies stacked chip-on-chip, and takes charge of a part of the whole memory capacity; at least one top chip stack, which is mounted on the bottom package, has multiple memory semiconductor dies mounted therein, and takes charge of the rest of the whole memory capacity; an integration wire for electrically connecting the bottom chip stack and the top chip stack(s); and an integration protection member for sealing the integration wire.

Abstract: A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.

Abstract: The semiconductor package according to the present invention comprises: an integrated substrate; a bottom chip stack, which is mounted on the integrated substrate, has multiple memory semiconductor dies stacked chip-on-chip, and takes charge of a part of the whole memory capacity; at least one top chip stack, which is mounted on the bottom package, has multiple memory semiconductor dies mounted therein, and takes charge of the rest of the whole memory capacity; an integration wire for electrically connecting the bottom chip stack and the top chip stack(s); and an integration protection member for sealing the integration wire.

Abstract: A wearable smart device of the present invention comprises: a main body on which a basic module is mounted; a band on which at least one auxiliary module is mounted, which is selectively attached and detached to the main body made of a polymer material or a rubber material to be bent; a connector electrically connecting the main body and the band; and a coupler physically connecting the main body and the band. According to a configuration of the present invention, the present invention is possible in realizing a high-capacity and high-performance smart device.

Abstract: A VoIP gateway system connected through an extension subscriber circuit of a private branch exchange is provided, which includes a switching unit connected to extension terminals of the extension subscriber circuit of the private branch exchange, the switching unit finding an idle extension line of extension lines of the extension subscriber circuits to perform automatic connection; a voice CODEC connected to the switching unit, to perform modulation and demodulation between a voice signal and a digital signal; a LAN connection part connected to the voice CODEC; and a controller connected with the switching unit, voice CODEC and LAN connection part, for providing control signals for outgoing- and incoming-call operations.