Abstract: A power module includes a first substrate formed by stacking a plurality of layers in a first axis direction, a semiconductor chip electrically connected to the first substrate, a printed circuit board connected to the semiconductor chip and comprising at least one step portion with a reduced thickness compared to the surrounding area in the first axis direction, and at least one metal block mounted on the at least one step portion in the first axis direction and electrically connected to the first substrate.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may establish, using a first subscription of the UE, a first communication connection associated with a first service. The UE may establish, using a second subscription of the UE, a second communication connection associated with a second service. The UE may operate in a dual subscriber identity module (SIM) dual active (DSDA) mode based at least in part on establishing the first communication connection and establishing the second communication connection. The UE may perform an action to maintain concurrent services, including the first service and the second service, while operating in the DSDA mode. Numerous other aspects are described.

Abstract: An anode for a secondary battery is provided, the anode for a secondary battery including: an anode current collector; a first anode mixture layer formed on at least one surface of the anode current collector, and including a first silicon-based active material and a first conductive material; and a second anode mixture layer formed on the first anode mixture layer, and including a second silicon-based active material and a second conductive material, wherein a content of the first silicon-based active material in the first anode mixture layer is lower than a content of the second silicon-based active material in the second anode mixture layer, and a Radial Breathing Mode (RBM) peak is observed in a Raman spectrum obtained from a surface of the second anode mixture layer.

Abstract: Disclosed is a battery pack including a battery cell stack, an internal connection member coupled to opposite ends of the battery cell stack from which the electrode leads protrude, and a pack frame configured to receive the battery cell stack and the internal connection member. A weld is formed at a part at which a first electrode lead and a second electrode lead protruding respectively from a first battery cell and a second battery cell of the battery cell stack, which neighbor each other, are bent in different directions and overlap each other. All battery cells constituting the battery cell stack are connected to each other in series in a zigzag fashion, and the internal connection member includes an insulation cover configured to isolate the electrode leads from the outside and a sensing member electrically connected to the weld.

Abstract: The present inventive concept relates to a thin film manufacturing method and a thin film. The thin film manufacturing method comprises: an adsorption step of adsorbing a high-k material on a substrate by spraying a source gas consisting of a high-k material; a deposition step of depositing a thin film consisting of the high-k material on the substrate by spraying a reaction gas that reacts with the source gas; and a crystallization step of crystallizing the high-k material using plasma.

Abstract: A substrate processing device. The device comprises: a first source supply unit; a second source supply unit; a first supply line for connecting the first source supply unit to a spraying unit; a second supply line for connecting the second source supply unit to the spraying unit; a mixing unit provided at the first supply line to be arranged between the first source supply unit and the spraying unit; a first connection line for connecting the second supply line to the first supply line and/or the mixing unit; and a first path change unit provided at a first connection point at which the first connection line is connected to the second supply line, wherein the first path change unit changes the flow path of a second source gas supplied from the second source supply unit.

Abstract: Provided herein may be a heat dissipation module including a first planar component, a partition wall coupled to the first planer component and defining a first path having one side closed by the first planar component, the first path forming a closed loop, and working fluid disposed in the first path. The heat dissipation module and an electronic device including the heat dissipation module in accordance with embodiments may be improved in heat dissipation efficiency.

Abstract: Disclosed herein are an apparatus for estimating a camera pose using multi-view images of a 2D array structure and a method using the same. The method performed by the apparatus includes acquiring multi-view images from a 2D array camera system, forming a 2D image link structure corresponding to the multi-view images in consideration of the geometric structure of the camera system, estimating an initial camera pose based on an adjacent image extracted from the 2D image link structure and a pair of corresponding feature points, and estimating a final camera pose by reconstructing a 3D structure based on the initial camera pose and performing correction so as to minimize a reprojection error of the reconstructed 3D structure.

Abstract: An insulating substrate provided between the semiconductor chip and a cooler in the dual-side cooled power module includes: an inner metal layer configured to face the semiconductor chip; an outer metal layer configured to face the cooler; and an insulating layer interposed between the inner metal layer and the outer metal layer, wherein at least one inner thermal spreader of a plurality of inner thermal spreader is inserted into the inner metal layer.

Abstract: An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to the embodiment may include a first reflective layer; an active layer disposed on the first reflective layer; an active region disposed on the active layer and having an aperture and an insulation region disposed around the aperture; and a second reflective layer disposed on the active region. The second reflective layer may include a core reflective layer disposed in a position vertically corresponding to the aperture. The embodiment may include a cladding insulation layer disposed around the core reflective layer. The horizontal cross-section of the aperture may be different from the horizontal cross-section of the core reflective layer.

Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.

Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.

Abstract: A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate, and a second side thereof facing the first side along a first direction and connected to the semiconductor chip.

Abstract: A power module is provided. In the power module, electrical connection to the outside is enabled through a FPCB made to be flexible and deformable, and as terminals for signal transmission and wire bonding for connecting terminals are eliminated, insulation is ensured and the overall size is reduced.

Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.

Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.

Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.

Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.