Patents by Inventor Jun Hee Park

Jun Hee Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12103441
    Abstract: A vehicle seat includes first and second sub-seatbacks also provided as first and second seat cushions mounted on a main seatback to be rotatable in forward-rearward directions. A forward facing position in which an occupant is accommodated while viewing forward and a rearward facing position in which the occupant is accommodated while viewing rearward is easily realized, in response to forward and rearward rotation of the first sub-seatback and the second sub-seatback also provided as first and second seat cushions. Furthermore, a full-bed mode in which the seat is horizontally spread like a bed, a cushion tip-up mode in which the entirety of the seat is positioned upright for ensuring freight loading and an occupant entering and exiting passage, and the like are realized.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: October 1, 2024
    Assignees: Hyundai Motor Company, Kia Corporation, HYUNDAI TRANSYS INC.
    Inventors: Dong Woo Jeong, Eun Sue Kim, Dae Hee Lee, Myung Hoe Kim, Jun Sik Hwang, Gwon Hwa Bok, Hae Dong Kwak, Jae Sung Shin, Han Kyung Park, Jae Hoon Cho
  • Publication number: 20240317711
    Abstract: The present invention relates to a novel compound that induces selective degradation of AURKA, and specifically provides a bifunctional compound in which an AURKA binding moiety and an E3 ubiquitin ligase binding moiety are linked by a chemical linker, a method for preparing same, and a use thereof. In addition, the compound according to the present invention can be effectively used for the prevention or treatment of AURKA-related diseases.
    Type: Application
    Filed: June 24, 2022
    Publication date: September 26, 2024
    Inventors: Soo Hee RYU, Im Suk MIN, Chan Ho KIM, Jung Chul PARK, Seong Hoon KIM, Jun Kyu LEE, Ha Na JEONG, Seung Hyun JO
  • Patent number: 12086437
    Abstract: The present technology relates to an electronic device. According to the present technology, a memory controller may include an attribute determiner configured to determine an attribute of each of a plurality of pages included in a first external device to indicate one of a hot page and a cold page, based on an access interval which is an interval from a time at which data is stored in each of the pages to a time at which access to the data is requested, a page analyzer configured to determine a ratio of hot pages having a hot page attribute to the plurality of pages, and a memory allocator configured to control one of the first external device and the second external device to store therein externally provided data based on the ratio of hot pages.
    Type: Grant
    Filed: October 4, 2022
    Date of Patent: September 10, 2024
    Assignee: SK hynix Inc.
    Inventors: Jun Hee Ryu, Chang Hyun Park, Kwang Jin Ko, Young Pyo Joo
  • Publication number: 20240282952
    Abstract: A lithium secondary battery is disclosed. In some implementations, the lithium secondary battery includes a positive electrode including a positive electrode active material including lithium metal oxide including nickel (Ni) and a negative electrode including a negative electrode active material including a silicon-based active material, wherein the positive electrode active material includes 10 wt % or more of lithium metal oxide in the form of single particles based on a total weight of the positive electrode active material, and the negative electrode active material includes 1 to 15 wt % of the silicon-based active material based on a total weight of the negative electrode active material.
    Type: Application
    Filed: February 5, 2024
    Publication date: August 22, 2024
    Inventors: Seung Hyun YOOK, Moon Sung KIM, Sang Baek RYU, Da Hye PARK, Hwan Ho JANG, Jun Hee HAN, Hyo Mi KIM, Sang In BANG, Da Bin CHUNG
  • Publication number: 20240274827
    Abstract: An anode for a secondary battery includes an anode current collector, a first anode mixture layer on at least one surface of the anode current collector, and a second anode mixture layer on the first anode mixture layer. The first anode mixture layer includes a first silicon-based active material having a carbon coating layer formed on a surface, and a first conductive material, the second anode mixture layer includes a second silicon-based active material doped with a metal, and a second conductive material, and the anode for a secondary battery exhibits a Radial Breathing Mode (RBM) peak in a Raman spectrum obtained from a surface of the second anode mixture layer. An influence of volume expansion/contraction of a silicon-based active material during battery charging/discharging may be alleviated.
    Type: Application
    Filed: February 5, 2024
    Publication date: August 15, 2024
    Inventors: Hyo Mi KIM, Seong Cho KWON, Moon Sung KIM, Sang Baek RYU, Da Hye PARK, Sang Won PARK, Sang In BANG, Seung Hyun YOOK, Hyun Ji LEE, Hwan Ho JANG, Da Bin CHUNG, Jun Hee HAN
  • Publication number: 20240274800
    Abstract: An anode for a secondary battery is disclosed. In some implementations, the anode includes an anode current collector, a first anode mixture layer on at least one surface of the anode current collector, and a second anode mixture layer on the first anode mixture layer. The first anode mixture layer includes a first silicon-based active material including a carbon coating layer formed on a surface thereof, and a first conductive material. The second anode mixture layer includes a second silicon-based active material doped with a metal, and a second conductive material. The first conductive material has a Raman R value, greater than or equal to a Raman R value of the second conductive material. According to some implementations, volume expansion/contraction of a silicon-based active material may be alleviated during battery charging/discharging.
    Type: Application
    Filed: February 2, 2024
    Publication date: August 15, 2024
    Inventors: Hyo Mi KIM, Moon Sung KIM, Sang Baek RYU, Seung Hyun YOOK, Hwan Ho JANG, Da Bin CHUNG, Jun Hee HAN, Da Hye PARK, Sang In BANG
  • Patent number: 12058899
    Abstract: In a method of manufacturing a transparent display device, a substrate including a pixel region and a transmission region may be provided. A first electrode may be formed on the substrate in the pixel region, and a display layer may be formed on the first electrode. A second electrode facing the first electrode may be formed on the display layer, and a capping structure including a first capping layer and a second capping layer may be formed on the second electrode. The first capping layer may be formed on the second electrode in the pixel region and a first region of the transmission region by using a mask that has an opening, the mask may be shifted, and the second capping layer may be formed on the second electrode in the pixel region and a second region of the transmission region by using the shifted mask.
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: August 6, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jin-Koo Chung, Jeong-Woo Moon, Byoung-Hee Park, Jun-Ho Choi
  • Publication number: 20240240815
    Abstract: An air purifier is disclosed.
    Type: Application
    Filed: January 8, 2024
    Publication date: July 18, 2024
    Applicant: COWAY Co., Ltd.
    Inventors: Jae Hoon KIM, Young Choon PARK, Seon Ho LEE, Jun Hyoung BAE, Dong Hee JANG
  • Publication number: 20240234327
    Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
    Type: Application
    Filed: April 13, 2023
    Publication date: July 11, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Sung Taek HWANG, So Eun JEONG, Jun Hee PARK, Nam Sik KONG
  • Publication number: 20240222225
    Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.
    Type: Application
    Filed: July 5, 2023
    Publication date: July 4, 2024
    Inventors: Suk Hyun Lim, Hyun Koo Lee, Sang Hun Lee, Se Heun Kwon, Ki Young Jang, Jun Hee Park
  • Publication number: 20240186217
    Abstract: A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate, and a second side thereof facing the first side along a first direction and connected to the semiconductor chip.
    Type: Application
    Filed: May 8, 2023
    Publication date: June 6, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Suk Hyun LIM, Jun Hee PARK
  • Publication number: 20240186272
    Abstract: A power module is provided. In the power module, electrical connection to the outside is enabled through a FPCB made to be flexible and deformable, and as terminals for signal transmission and wire bonding for connecting terminals are eliminated, insulation is ensured and the overall size is reduced.
    Type: Application
    Filed: July 6, 2023
    Publication date: June 6, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Myung III YOU, Jun Hee PARK
  • Publication number: 20240136296
    Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.
    Type: Application
    Filed: April 12, 2023
    Publication date: April 25, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Sung Taek HWANG, So Eun JEONG, Jun Hee PARK, Nam Sik KONG
  • Publication number: 20240105573
    Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.
    Type: Application
    Filed: July 10, 2023
    Publication date: March 28, 2024
    Inventors: Jun Hee PARK, Sung Taek Hwang, Nam Sik Kong, Myung III You
  • Publication number: 20240096737
    Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Myung Ill YOU, Jun Hee PARK
  • Patent number: 11935814
    Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.
    Type: Grant
    Filed: August 20, 2021
    Date of Patent: March 19, 2024
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Hyun Koo Lee, Jun Hee Park, Sang Cheol Shin, Kang Ho Jeong
  • Publication number: 20240088009
    Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.
    Type: Application
    Filed: April 21, 2023
    Publication date: March 14, 2024
    Applicants: Hyundai Motor Company, Kia Corporation
    Inventors: Jun Hee PARK, Sung Taek HWANG, Nam Sik KONG, Myung III YOU
  • Patent number: 11862530
    Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: January 2, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Myung Ill You, Jun Hee Park
  • Patent number: 11862537
    Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: January 2, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Jun Hee Park, Nam Sik Kong, Hyun Koo Lee
  • Publication number: 20230397336
    Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.
    Type: Application
    Filed: October 26, 2022
    Publication date: December 7, 2023
    Inventors: Nam Sik Kong, Jun Hee Park