Patents by Inventor Jun Hee Park
Jun Hee Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12103441Abstract: A vehicle seat includes first and second sub-seatbacks also provided as first and second seat cushions mounted on a main seatback to be rotatable in forward-rearward directions. A forward facing position in which an occupant is accommodated while viewing forward and a rearward facing position in which the occupant is accommodated while viewing rearward is easily realized, in response to forward and rearward rotation of the first sub-seatback and the second sub-seatback also provided as first and second seat cushions. Furthermore, a full-bed mode in which the seat is horizontally spread like a bed, a cushion tip-up mode in which the entirety of the seat is positioned upright for ensuring freight loading and an occupant entering and exiting passage, and the like are realized.Type: GrantFiled: November 23, 2022Date of Patent: October 1, 2024Assignees: Hyundai Motor Company, Kia Corporation, HYUNDAI TRANSYS INC.Inventors: Dong Woo Jeong, Eun Sue Kim, Dae Hee Lee, Myung Hoe Kim, Jun Sik Hwang, Gwon Hwa Bok, Hae Dong Kwak, Jae Sung Shin, Han Kyung Park, Jae Hoon Cho
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Publication number: 20240317711Abstract: The present invention relates to a novel compound that induces selective degradation of AURKA, and specifically provides a bifunctional compound in which an AURKA binding moiety and an E3 ubiquitin ligase binding moiety are linked by a chemical linker, a method for preparing same, and a use thereof. In addition, the compound according to the present invention can be effectively used for the prevention or treatment of AURKA-related diseases.Type: ApplicationFiled: June 24, 2022Publication date: September 26, 2024Inventors: Soo Hee RYU, Im Suk MIN, Chan Ho KIM, Jung Chul PARK, Seong Hoon KIM, Jun Kyu LEE, Ha Na JEONG, Seung Hyun JO
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Patent number: 12086437Abstract: The present technology relates to an electronic device. According to the present technology, a memory controller may include an attribute determiner configured to determine an attribute of each of a plurality of pages included in a first external device to indicate one of a hot page and a cold page, based on an access interval which is an interval from a time at which data is stored in each of the pages to a time at which access to the data is requested, a page analyzer configured to determine a ratio of hot pages having a hot page attribute to the plurality of pages, and a memory allocator configured to control one of the first external device and the second external device to store therein externally provided data based on the ratio of hot pages.Type: GrantFiled: October 4, 2022Date of Patent: September 10, 2024Assignee: SK hynix Inc.Inventors: Jun Hee Ryu, Chang Hyun Park, Kwang Jin Ko, Young Pyo Joo
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Publication number: 20240282952Abstract: A lithium secondary battery is disclosed. In some implementations, the lithium secondary battery includes a positive electrode including a positive electrode active material including lithium metal oxide including nickel (Ni) and a negative electrode including a negative electrode active material including a silicon-based active material, wherein the positive electrode active material includes 10 wt % or more of lithium metal oxide in the form of single particles based on a total weight of the positive electrode active material, and the negative electrode active material includes 1 to 15 wt % of the silicon-based active material based on a total weight of the negative electrode active material.Type: ApplicationFiled: February 5, 2024Publication date: August 22, 2024Inventors: Seung Hyun YOOK, Moon Sung KIM, Sang Baek RYU, Da Hye PARK, Hwan Ho JANG, Jun Hee HAN, Hyo Mi KIM, Sang In BANG, Da Bin CHUNG
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Publication number: 20240274827Abstract: An anode for a secondary battery includes an anode current collector, a first anode mixture layer on at least one surface of the anode current collector, and a second anode mixture layer on the first anode mixture layer. The first anode mixture layer includes a first silicon-based active material having a carbon coating layer formed on a surface, and a first conductive material, the second anode mixture layer includes a second silicon-based active material doped with a metal, and a second conductive material, and the anode for a secondary battery exhibits a Radial Breathing Mode (RBM) peak in a Raman spectrum obtained from a surface of the second anode mixture layer. An influence of volume expansion/contraction of a silicon-based active material during battery charging/discharging may be alleviated.Type: ApplicationFiled: February 5, 2024Publication date: August 15, 2024Inventors: Hyo Mi KIM, Seong Cho KWON, Moon Sung KIM, Sang Baek RYU, Da Hye PARK, Sang Won PARK, Sang In BANG, Seung Hyun YOOK, Hyun Ji LEE, Hwan Ho JANG, Da Bin CHUNG, Jun Hee HAN
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Publication number: 20240274800Abstract: An anode for a secondary battery is disclosed. In some implementations, the anode includes an anode current collector, a first anode mixture layer on at least one surface of the anode current collector, and a second anode mixture layer on the first anode mixture layer. The first anode mixture layer includes a first silicon-based active material including a carbon coating layer formed on a surface thereof, and a first conductive material. The second anode mixture layer includes a second silicon-based active material doped with a metal, and a second conductive material. The first conductive material has a Raman R value, greater than or equal to a Raman R value of the second conductive material. According to some implementations, volume expansion/contraction of a silicon-based active material may be alleviated during battery charging/discharging.Type: ApplicationFiled: February 2, 2024Publication date: August 15, 2024Inventors: Hyo Mi KIM, Moon Sung KIM, Sang Baek RYU, Seung Hyun YOOK, Hwan Ho JANG, Da Bin CHUNG, Jun Hee HAN, Da Hye PARK, Sang In BANG
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Patent number: 12058899Abstract: In a method of manufacturing a transparent display device, a substrate including a pixel region and a transmission region may be provided. A first electrode may be formed on the substrate in the pixel region, and a display layer may be formed on the first electrode. A second electrode facing the first electrode may be formed on the display layer, and a capping structure including a first capping layer and a second capping layer may be formed on the second electrode. The first capping layer may be formed on the second electrode in the pixel region and a first region of the transmission region by using a mask that has an opening, the mask may be shifted, and the second capping layer may be formed on the second electrode in the pixel region and a second region of the transmission region by using the shifted mask.Type: GrantFiled: February 23, 2021Date of Patent: August 6, 2024Assignee: Samsung Display Co., Ltd.Inventors: Jin-Koo Chung, Jeong-Woo Moon, Byoung-Hee Park, Jun-Ho Choi
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Publication number: 20240240815Abstract: An air purifier is disclosed.Type: ApplicationFiled: January 8, 2024Publication date: July 18, 2024Applicant: COWAY Co., Ltd.Inventors: Jae Hoon KIM, Young Choon PARK, Seon Ho LEE, Jun Hyoung BAE, Dong Hee JANG
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Publication number: 20240234327Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.Type: ApplicationFiled: April 13, 2023Publication date: July 11, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Sung Taek HWANG, So Eun JEONG, Jun Hee PARK, Nam Sik KONG
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Publication number: 20240222225Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.Type: ApplicationFiled: July 5, 2023Publication date: July 4, 2024Inventors: Suk Hyun Lim, Hyun Koo Lee, Sang Hun Lee, Se Heun Kwon, Ki Young Jang, Jun Hee Park
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Publication number: 20240186217Abstract: A power module include at least one substrate including an insulating layer and a metal circuit disposed on a first side of the insulating layer, a semiconductor chip, and at least one vapor chamber including a fluid flowing therein and disposed between the semiconductor chip and one of the at least one substrate, wherein each of the at least one vapor chamber includes a first side thereof including a plane area greater than or equal to a plane area of the semiconductor chip and connected to the metal circuit of the one of the at least one substrate, and a second side thereof facing the first side along a first direction and connected to the semiconductor chip.Type: ApplicationFiled: May 8, 2023Publication date: June 6, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Suk Hyun LIM, Jun Hee PARK
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Publication number: 20240186272Abstract: A power module is provided. In the power module, electrical connection to the outside is enabled through a FPCB made to be flexible and deformable, and as terminals for signal transmission and wire bonding for connecting terminals are eliminated, insulation is ensured and the overall size is reduced.Type: ApplicationFiled: July 6, 2023Publication date: June 6, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Myung III YOU, Jun Hee PARK
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Publication number: 20240136296Abstract: A power module includes an upper substrate and a lower substrate, an upper chip, a lower chip, and a circuit board disposed across a space between the upper substrate and the lower chip and a space between the lower substrate and the upper chip so that the upper substrate and the lower substrate are vertically spaced from each other. The circuit board electrically connects the upper chip to the lower substrate while electrically connecting the lower chip to the upper substrate.Type: ApplicationFiled: April 12, 2023Publication date: April 25, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Sung Taek HWANG, So Eun JEONG, Jun Hee PARK, Nam Sik KONG
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Publication number: 20240105573Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate, the first spacer and the second spacer extending toward each other.Type: ApplicationFiled: July 10, 2023Publication date: March 28, 2024Inventors: Jun Hee PARK, Sung Taek Hwang, Nam Sik Kong, Myung III You
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Publication number: 20240096737Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.Type: ApplicationFiled: November 20, 2023Publication date: March 21, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Myung Ill YOU, Jun Hee PARK
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Patent number: 11935814Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.Type: GrantFiled: August 20, 2021Date of Patent: March 19, 2024Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATIONInventors: Hyun Koo Lee, Jun Hee Park, Sang Cheol Shin, Kang Ho Jeong
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Publication number: 20240088009Abstract: A power module for a vehicle, includes: a first substrate including a first metal circuit disposed on a 1-1st surface, and a first spacer extending from the first metal circuit in a first direction; a second substrate spaced from and facing the first substrate in a second direction, and including a second metal circuit disposed on a 2-1st surface facing the 1-1st surface, and a second spacer extending from the second metal circuit in the second direction; and a semiconductor chip disposed between the first substrate and the second substrate and including a power pad and a signal pad, the first spacer and the second spacer extending toward each other, and the second spacer including a 2-1st spacer connected to the power pad and a 2-2nd spacer connected to the signal pad.Type: ApplicationFiled: April 21, 2023Publication date: March 14, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Jun Hee PARK, Sung Taek HWANG, Nam Sik KONG, Myung III YOU
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Patent number: 11862530Abstract: A multi-layered spacer of which a thermal expansion coefficient and a thermal conductivity are controllable and a double-sided cooling power module including the multi-layered spacer, is provided between a semiconductor chip and a substrate in a double-sided cooling power module. The multi-spacer includes first metal layers made of a first metal and provided as at least respective outermost layers, and a second metal layer made of a second metal having a thermal expansion coefficient lower than a thermal expansion coefficient of the first metal and disposed between the first metal layers provided as the outermost layers.Type: GrantFiled: September 24, 2020Date of Patent: January 2, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Myung Ill You, Jun Hee Park
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Patent number: 11862537Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.Type: GrantFiled: July 13, 2021Date of Patent: January 2, 2024Assignees: Hyundai Motor Company, Kia CorporationInventors: Jun Hee Park, Nam Sik Kong, Hyun Koo Lee
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Publication number: 20230397336Abstract: Provided is a power module capable of preventing an overflow situation of solder and a movement of the solder when a chip and a spacer are bonded to each substrate by a soldering process, thereby being capable of increasing bonding quality between components through the soldering process.Type: ApplicationFiled: October 26, 2022Publication date: December 7, 2023Inventors: Nam Sik Kong, Jun Hee Park