Abstract: A liquid ejecting apparatus includes a liquid ejecting portion, a strip member, and a supply portion capable of supplying a reaction liquid having a component that cures ink to the strip member, the strip member being provided so as to be able to set a receiving region that receives any one of ink and reaction liquid discharged as waste liquid from a nozzle of the liquid ejecting portion and a contact region that comes into contact with the liquid ejecting portion when any one of ink and reaction liquid is collected, and the supply portion supplies the reaction liquid to a supply region set in the strip member between the contact region and a position farthest from the contact region in the receiving region.

Abstract: A liquid ejection device includes an ejection section having multiple nozzle surfaces aligned in one direction and configured to eject liquid from nozzles that are opened on each of the multiple nozzle surfaces, and a wiping section that wipes the multiple nozzle surfaces, wherein the wiping section further including an absorbing member that absorbs the liquid clinging to the multiple nozzle surfaces by contacting the multiple nozzle surfaces, multiple pressing members that press the absorbing member against the multiple nozzle surfaces, and multiple elastic members that press each of the multiple pressing members toward the ejection section.

Abstract: A liquid ejecting apparatus includes a liquid ejecting portion, a strip member, and a supply portion capable of supplying a reaction liquid having a component that cures ink to the strip member, the strip member being provided so as to be able to set a receiving region that receives any one of ink and reaction liquid discharged as waste liquid from a nozzle of the liquid ejecting portion and a contact region that comes into contact with the liquid ejecting portion when any one of ink and reaction liquid is collected, and the supply portion supplies the reaction liquid to a supply region set in the strip member between the contact region and a position farthest from the contact region in the receiving region.

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, said insulator outer surface and said copper layer outer surface are simultaneously subjected to a process (1) comprising treatment with an alkali metal hydroxide solution, a process (2) comprising treatment with an alkaline aqueous solution containing an aliphatic amine, a process (3) comprising treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, a process (4) comprising treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and a process (5) comprising copper electroplating, which are implemented sequentially.

Abstract: In a substrate like a printed circuit board comprising an insulator and a copper layer laminated on part of the insulator, the insulator outer surface and the copper layer outer surface are simultaneously subjected to (1) a process including treatment with an alkali metal hydroxide solution, (2) a process including treatment with an alkaline aqueous solution containing an aliphatic amine, (3) a process including treatment with an alkaline aqueous solution having a permanganate concentration of 0.3 to 3.5 wt % and a pH of 8 to 11, (4) a process including treatment with an acidic microemulsion aqueous solution containing a thiophene compound and an alkali metal salt of polystyrenesulphonic acid, and (5) a process including copper electroplating, which are implemented sequentially.

Abstract: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to the heterocyclic core by a spacer is disclosed. The method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

Abstract: A method for copper plating in a plating bath wherein the substrate is brought into contact with a leveller additive comprising a heterocyclic core having a thiol group and an amino group attached to said heterocyclic core by a spacer is disclosed. Said method is particularly suitable for filling recessed structures in the manufacture of printed circuit boards, IC substrates and semiconducting substrates.

Abstract: A navigation assistance system equipped with an environment-regulated-marine-zone detection device that includes a movement tracking device that tracks the movement of a ship based on input data; a first computation device that computes an arrival distance and a arrival time until arriving at an environment regulated marine zone or a departure distance and a departure time until departing from an environment regulated marine zone based on data transmitted from the movement tracking device, as well as data about the environment regulated marine zone in a built-in database of the first computation device or data about the environment regulated marine zone in a built-in database of another external device. The detection device also includes a display device that displays the arrival distance and the arrival time or the departure distance and the departure time based on the data transmitted from the first computation device.

Abstract: Provided is an engine-exhaust-gas energy recovery apparatus including a hybrid turbocharger having a turbine unit that is supplied with exhaust gas discharged from an engine, a compressor unit that pressure-feeds scavenging-air pressure to the engine, and a generator/motor unit that generates electricity when the turbine unit is driven; a bypass channel that allows the exhaust gas supplied toward the hybrid turbocharger to bypass the hybrid turbocharger; an engine-load detecting part; an engine-rotation-speed detecting part; a scavenging-air-pressure detecting part; and a control device having a database for calculating a scavenging-air pressure, at which the fuel consumption rate of the engine becomes lower than or equal to a predetermined value, from the detection values of the respective detecting parts. The control device controls an exhaust-gas bypass control valve so as to control the scavenging-air pressure of the engine.

Abstract: Providing an exhaust gas energy recovery device by which the optimal engine operating condition can be continuously maintained in a manner that the flow rate of the engine exhaust gas fed to the power turbine is regulated so that the scavenging air pressure becomes optimal in order that the engine performance (the fuel consumption rate) corresponding to the engine load and the engine speed becomes optima. The engine exhaust gas energy recovery device provided the engine load detecting sensor, the engine speed detecting sensor and the scavenging air pressure detecting sensor, the device regulating the flow rate of the exhaust gas streaming into the exhaust gas turbocharger via controlling the flow rate of the exhaust gas streaming into the power turbine of the exhaust gas energy recovery device, so that the scavenging air pressure is maintained at an arbitrarily ordered level and the engine is operated under a condition that the fuel consumption rate is minimal.