Patents by Inventor Jun-Ho Chen

Jun-Ho Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230420818
    Abstract: A multi-layered resonator circuit structure and a multi-layered filter circuit structure. The multi-layered resonator circuit structure includes a multi-layered substrate, a plurality of resonators and a plurality of conductive components. The multi-layered substrate has a top surface, a bottom surface, and a ground layer. The top surface and the bottom surface face away from each other. The ground layer is located between the top surface and the bottom surface. A part of the plurality of resonators is/are disposed on the top surface. Another part of the plurality of resonators is/are disposed on the bottom surface. The plurality of conductive components is located in the multi-layered substrate. The plurality of resonators is electrically connected to the ground layer, respectively, via the plurality of conductive components.
    Type: Application
    Filed: March 14, 2023
    Publication date: December 28, 2023
    Applicants: UNIMICRON TECHNOLOGY CORP., TUNGHAI UNIVERSITY
    Inventors: Chi-Feng CHEN, Po-Sheng YEN, Ruey-Beei WU, Ra-Min TAIN, Chin-Sheng WANG, Jun-Ho CHEN
  • Publication number: 20230335466
    Abstract: An electronic packaging structure including a first circuit structure, a second circuit structure and at least one electronic device is provided. The bottom side of the first circuit structure has at least one cavity. The first circuit structure is disposed on the second circuit structure. The first circuit structure and the second circuit structure are electrically connected to each other. The electronic device is disposed on the second circuit structure. The electronic device is disposed corresponding to the cavity of the first circuit structure.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 19, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Chih-Kai Chan, Jun-Ho Chen
  • Publication number: 20230268257
    Abstract: An electronic package structure and its manufacturing method are provided. The electronic package structure includes an interposer, a circuit board, a chip, and a circuit structure. The interposer includes an interposer substrate and a coaxial conductive element located in the interposer substrate. The interposer substrate includes a cavity. The coaxial conductive element includes a first conductive structure, a second conductive structure surrounding the first conductive structure, and a first insulation structure. The first insulation structure is disposed between the first and second conductive structures. The circuit board is disposed on a lower surface of the interposer substrate and electrically connected to the coaxial conductive element. The chip is disposed in the cavity and located on the circuit board, so as to be electrically connected to the circuit board.
    Type: Application
    Filed: September 5, 2022
    Publication date: August 24, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Wen-Yu Lin, Tse-Wei Wang, Jun-Ho Chen, Guang-Hwa Ma
  • Publication number: 20230268256
    Abstract: An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit board. The interposer has a through groove. The chip is disposed in the through groove and located on the circuit board to electrically connect with the circuit board. The circuit structure is disposed on the interposer. The coaxial conductive element penetrates the interposer to electrically connect the circuit structure and the circuit board. The coaxial conductive element includes a first conductive structure, a second conductive structure, and a first insulating structure. The second conductive structure surrounds the first conductive structure. The first insulating structure is disposed between the first conductive structure and the second conductive structure.
    Type: Application
    Filed: August 18, 2022
    Publication date: August 24, 2023
    Applicant: Unimicron Technology Corp.
    Inventors: Chin-Sheng Wang, Ra-Min Tain, Wen-Yu Lin, Tse-Wei Wang, Jun-Ho Chen, Guang-Hwa Ma
  • Publication number: 20150131026
    Abstract: A flat panel display includes a plastic rear cover, a supporting frame, a liquid crystal display (LCD) module, a light bar and a front cover. The plastic rear cover constructs a rear half portion of an appearance of the flat panel display. The supporting frame is connected to the plastic rear cover. The LCD module is connected to the supporting frame. The light bar is disposed aside the LCD module. The front cover is connected to the plastic rear cover, constructs a front half portion of the appearance of the flat panel display, and has an opening to expose the LCD module.
    Type: Application
    Filed: October 15, 2014
    Publication date: May 14, 2015
    Applicant: Young Lighting Technology Inc.
    Inventors: Ching-Hung Chen, Wen-Pin Yang, Chien-Tsai Chueh, Jun-Ho Chen, Ching-Tai Tseng