Abstract: A light emitting element includes: a light emitting stack pattern including a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially stacked along one direction; and an insulating film surrounding an outer surface of at least one of the first semiconductor layer, the active layer, and the second semiconductor layer. The insulating film including a zinc oxide (ZnO) thin film layer.

Abstract: A display device includes: a pixel defining layer defining openings arranged in first and second directions, the openings forming emission areas in which light emitting elements are disposed to emit light of different colors; a light blocking layer disposed on the pixel defining layer, and defining holes, each overlapping the opening and having a larger diameter than the opening; and color filters disposed on the light blocking layer to overlap the holes and overlap the emission areas. The opening has an opening interval, which is defined as a difference in diameter between the overlapping hole and the opening, in the openings, among homogeneous openings in which the light emitting elements for emitting light of the same color are disposed, the homogeneous openings adjacent in the first or second direction have different opening intervals, and among the homogeneous openings, openings having different opening intervals are at least three types.

Abstract: Systems and methods for executing instructions for executing a virtual reality (VR)-based fire response simulation method for secondary battery production are disclosed. One method includes receiving a gaze direction and gaze location of a user identified from a head mounted display (HMD). Fire response content associated with a secondary battery production apparatus corresponding to the received gaze direction and gaze location is displayed on an area of a display of the HMD. The fire response content includes a plurality of fire response scenarios. User behavior information indicating a motion of the user determined from at least one of the HMD or a controller associated with the HMD is obtained. The fire response content associated with the secondary battery production apparatus is executed based on the obtained user behavior information.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: An automated cash receiving apparatus is provided. The automated cash receiving apparatus includes: a deposit device configured to receive and count a bill; a front case and a rear case configured to surround a front portion and a rear portion of the deposit device, respectively; a storage disposed under the deposit device to store the bill, and comprising a dropping slot to allow the bill dropping down from the deposit device to pass therethrough; a sliding frame disposed between the deposit device and the storage; and a blocking plate disposed between the sliding frame and the storage.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: An underwater environmental monitoring system using an amphibious drone is disclosed. In one aspect, the amphibious drone is configured to generate a measurement data by detecting an underwater environment while moving back and forth between air and water. The underwater environmental monitoring system includes a base station located on the ground and configured to receive the measurement data through radio communication with the amphibious drone.

Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.

Abstract: The printing system includes a computer with a print setup program displaying a print command window on a monitor screen and at least one printer, each with two or more paper source cassettes, connected to the computer, wherein the print setup program detects all the printers connected to the computer and all the paper source cassettes provided to each printer and provides a number of print command execution buttons corresponding to the detected cassettes in the print command window, to let a user to select any button among the print command execution buttons, so that a user can print out from a desired cassette.

Abstract: A nonvolatile memory device includes a first electrode and a second electrode, and a variable resistor interposed between the first and second electrodes. The variable resistor has a critical voltage, and a resistance-voltage characteristic of the variable resistor is switched at a voltage higher than the critical voltage, so that a resistance of the variable resistor is higher at a read voltage applied after the switching of the resistance-voltage curve than at a read voltage applied before the switching of the resistance-voltage curve. Methods of operating a nonvolatile memory device include setting a plurality of write voltages higher than an initial critical voltage, assigning respective data values to states in which a resistance-voltage characteristic is switched at the write voltages, setting a read voltage lower than the initial critical voltage, and reading the data values by measuring current flowing through the variable resistor in response to the read voltage.

Abstract: A photosensitive drum for a printer cartridge, which can be easily mounted on a printer cartridge of which the positions of drum connectors are fixed, is disclosed. The photosensitive drum for a printer cartridge comprises a cylindrical drum having a photosensitive layer on a cylindrical surface thereof; and a pair of rotation shafts which is respectively mounted on the sides of the cylindrical drum for rotating and supporting the cylindrical drum, wherein at least one of the rotation shafts is insert-fitted to the side of the cylindrical drum.

Abstract: A nonvolatile memory device includes a first electrode and a second electrode, and a variable resistor interposed between the first and second electrodes. The variable resistor has a critical voltage, and a resistance-voltage characteristic of the variable resistor is switched at a voltage higher than the critical voltage, so that a resistance of the variable resistor is higher at a read voltage applied after the switching of the resistance-voltage curve than at a read voltage applied before the switching of the resistance-voltage curve. Methods of operating a nonvolatile memory device include setting a plurality of write voltages higher than an initial critical voltage, assigning respective data values to states in which a resistance-voltage characteristic is switched at the write voltages, setting a read voltage lower than the initial critical voltage, and reading the data values by measuring current flowing through the variable resistor in response to the read voltage.

Abstract: A photosensitive drum for a printer cartridge, which can be easily mounted on a printer cartridge of which the positions of drum connectors are fixed, is disclosed. The photosensitive drum for a printer cartridge comprises a cylindrical drum having a photosensitive layer on a cylindrical surface thereof; and a pair of rotation shafts which is respectively mounted on the sides of the cylindrical drum for rotating and supporting the cylindrical drum, wherein at least one of the rotation shafts is insert-fitted to the side of the cylindrical drum.

Abstract: The printing system in accordance with the present invention includes a computer with a print setup program displaying a print command window on a monitor screen and at least one printer, each with two or more paper source cassettes, connected to the computer, wherein the print setup program detects all the printers connected to the computer and all the paper source cassettes provided to each printer and provides a number of print command execution buttons corresponding to the detected cassettes in the print command window, to let a user to select any button among the print command execution buttons, so that a user can print out from a desired cassette.