Abstract: Provided is an apparatus and method for processing voice data. The voice data processing apparatus according to an embodiment of the present disclosure includes: a data receiver configured to receive voice data; a storage configured to store the received voice data in a buffer; a section classifier configured to divide the stored voice data into one or more sections, and to classify each of the one or more sections as a voice section or a silent section; and a voice outputter configured to drop voice data classified as the silent section, or to output the voice data classified as the silent section by accelerating a playback speed.

Abstract: Disclosed are a sound sharing apparatus and a sound sharing method. The sound sharing apparatus according to one embodiment of the present disclosure includes at least one processor configured to implement: a modifier configured to change a default audio render driver of a local machine from a first audio render driver to a second audio render driver; a capturer configured to capture audio data transmitted to the second audio render driver; and a mixer configured to mix the captured audio data: i) with first voice data to output first mixed data, wherein the first voice data is received from a remote machine connected to the local machine through a network, or ii) with second voice data to output second mixed data, wherein the second voice data is received input through a microphone of the local machine.

Abstract: Disclosed are an acoustic echo cancelling apparatus and an acoustic echo cancelling method. The acoustic echo cancelling apparatus comprises a first capturer configured to capture a remote audio signal received from a remote machine; a second capturer configured to capture a local audio signal that is input to a local microphone; an acoustic echo canceller (AEC) configured to cancel an acoustic echo of the local audio signal using the remote audio signal and output a local audio signal from which the acoustic echo is cancelled; and a transmitter configured to transmit an output signal of the AEC to the remote machine.

Abstract: Disclosed are a sound sharing apparatus and a sound sharing method. The sound sharing apparatus according to one embodiment of the present disclosure includes at least one processor configured to implement: a modifier configured to change a default audio render driver of a local machine from a first audio render driver to a second audio render driver; a capturer configured to capture audio data transmitted to the second audio render driver; and a mixer configured to mix the captured audio data: i) with first voice data to output first mixed data, wherein the first voice data is received from a remote machine connected to the local machine through a network, or ii) with second voice data to output second mixed data, wherein the second voice data is received input through a microphone of the local machine.

Abstract: A modular PIM analyzer includes: a first signal amplification module provided with a first signal generator for generating a first frequency signal under control of a first MCU, and a first power amplifier for generating a first amplified frequency signal through the amplification of the first frequency signal under control of a first ALC circuit; a second signal amplification module provided with a second signal generator for generating a second frequency signal under control of a second MCU, and a second power amplifier for generating a second amplified frequency signal through the amplification of the second frequency signal under control of a second ALC circuit; and a triplexer module for extracting a test frequency signal using the first amplified frequency signal and the second amplified frequency signal, transmitting the test frequency signal to a device under test, and receiving a PIM signal being reflected from the device under test

Abstract: A modular PIM analyzer includes: a first signal amplification module provided with a first signal generator for generating a first frequency signal under control of a first MCU, and a first power amplifier for generating a first amplified frequency signal through the amplification of the first frequency signal under control of a first ALC circuit; a second signal amplification module provided with a second signal generator for generating a second frequency signal under control of a second MCU, and a second power amplifier for generating a second amplified frequency signal through the amplification of the second frequency signal under control of a second ALC circuit; and a triplexer module for extracting a test frequency signal using the first amplified frequency signal and the second amplified frequency signal, transmitting the test frequency signal to a device under test, and receiving a PIM signal being reflected from the device under test.

Abstract: Provided is a method for a packet transmission apparatus to transmit a packet in real time, the method comprises determining, by the packet transmission apparatus, whether a buffer occupancy (an occupancy of a buffer) is a threshold value or more, in response to the buffer occupancy is greater than or equal to the threshold value, extracting, by the packet transmission apparatus, a degree of influence of the packet on quality of experience (QoE) and in response to the degree of influence of the packet on QoE is less than or equal to a predetermined value, dropping, by the packet transmission apparatus, the packet before the packet is transmitted to a network.

Abstract: A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.

Abstract: Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.

Abstract: A flexible printed circuit board and a method of manufacturing the same are disclosed. A flexible printed circuit board having a flexible region and a rigid region includes an inner board layer, an outer board layer laminated on the inner board layer and having a cavity formed in the rigid region, and a laminate exposing a pad in the cavity and laminated on the inner board layer in the rigid region where the pad is formed. The laminate includes a coverlay layer and a copper foil layer arranged so that the coverlay layer faces the inner board layer.

Abstract: Disclosed herein are a copper clad laminate, a printed circuit board, and a method of manufacturing the same. The copper clad laminate includes: an insulating layer having one surface and the other surface; and first and second copper foil layers having one surface, which is a smooth surface, and the other surface, which is a rough surface having a roughness larger than that of the smooth surface, respectively, wherein one surface of the insulating layer contacts the rough surface of the first copper foil layer and the other surface of the insulating layer contacts the smooth surface of the second copper foil layer.