Patents by Inventor Jun Hong Lee
Jun Hong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210378382Abstract: The present invention relates to a grinding cosmetic container, and grinds solid cosmetic contents by means of a grinding member so as to enable application of same as powdered cosmetic contents, thereby allowing cosmetic contents to be uniformly stuck to a puff and, simultaneously, allowing the cosmetic contents to be refilled and used.Type: ApplicationFiled: October 25, 2019Publication date: December 9, 2021Inventors: Jun Hong LEE, Kyung Chang LEE
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Patent number: 10145583Abstract: Heating apparatus includes an air inlet, a plurality of air outlets, an impeller, a motor for rotating the impeller to draw air through the air inlet, a user interface for allowing a user to select a rotational speed of the motor from a user selectable range of values, and a plurality of heater assemblies each comprising at least one positive temperature coefficient (PTC) heating element for heating air passing from the air inlet to a respective air outlet. The magnitude of a current drawn by the heater assemblies is detected, and the rotational speed of the motor is controlled independently from the rotational speed selected by the user depending on a characteristic of the current drawn by the heater assemblies.Type: GrantFiled: April 3, 2013Date of Patent: December 4, 2018Assignee: Dyson Technology LimitedInventors: Yuen Kee Leow, Jun Hong Lee, Ying Fang Tan, I Made Artha Yoga Ajnyana, John David Wallace
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Publication number: 20130272685Abstract: Heating apparatus includes an air inlet, a plurality of air outlets, an impeller, a motor for rotating the impeller to draw air through the air inlet, a user interface for allowing a user to select a rotational speed of the motor from a user selectable range of values, and a plurality of heater assemblies each comprising at least one positive temperature coefficient (PTC) heating element for heating air passing from the air inlet to a respective air outlet. The magnitude of a current drawn by the heater assemblies is detected, and the rotational speed of the motor is controlled independently from the rotational speed selected by the user depending on a characteristic of the current drawn by the heater assemblies.Type: ApplicationFiled: April 3, 2013Publication date: October 17, 2013Inventors: Yuen Kee LEOW, Jun Hong LEE, Ying Fang TAN, I Made Artha Yoga AJNYANA, John David WALLACE
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Patent number: 8369909Abstract: Disclosed are a sliding opening and closing device and a portable terminal having the same. According to the first embodiment of the present invention, a slide plate is linked to a main plate to be slidable in one direction. Also, the main plate supports an elastic part so as to generate an elasticity power in one direction. A power transformation member receives the elasticity power of the elastic member, and transmits the elasticity power to the slide plate in the direction of the opening or the closing according to the position of the slide plate.Type: GrantFiled: October 5, 2009Date of Patent: February 5, 2013Inventors: Jae-Young Park, Jun-Hong Lee, Chun-Soo Park
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Publication number: 20120051495Abstract: An apparatus configured to generate control data. The apparatus includes a counter unit configured to receive an input signal having a first state and a second state and counts the first state in the input signal, a delay unit configured to delay the count value for a predetermined time, and a data output unit configured to receive the delayed count value from the counter unit and then generate the control data based on the delayed count value.Type: ApplicationFiled: May 18, 2011Publication date: March 1, 2012Inventors: Jong-Tae HWANG, Min-Ho JUNG, Jun-Hong LEE, Seong-Joon PARK
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Patent number: 7869844Abstract: Disclosed is a sliding mechanism for opening and closing a cellular phone. The mechanism includes a main plate, a slider plate slidably connected to the main plate, a first block shaft-rotatably fixed to the main plate, one or more first rod member fixed to the first block, a first resilient member connected to the first block and generating expansion force, a second block shaft-rotatably fixed to the slider plate, one or more second rod member fixed to the second block, a second resilient member connected to the second rod member and generating expansion force, and a connection block placed in the central area of the first and second blocks and supporting the end portions of the first and second resilient members. The connection block slidably connects the first and second rod members with the first and second blocks in such a way that the end portion of the first rod member is directed towards the second block and the end portion of the second rod member is directed towards the first block.Type: GrantFiled: September 15, 2005Date of Patent: January 11, 2011Assignee: Laird Technologies, Inc.Inventors: Jun-Hong Lee, Hyung-Kyu Yoon
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Patent number: 7774033Abstract: Disclosed is a slider mechanism for slidably opening and closing a portable communication terminal. The slider mechanism includes a first plate and a second plate slidably combined with the first plate. The second plate has a cam profile formed along siding direction. A resilience unit is mounted on the first plate to exert resilient force perpendicularly to moving direction of the second plate. A roller is rotatably attached to an end of the resilience unit. The roller runs along the cam profile while the portable terminal opens or closes. Formed at a desired position of the cam profile is a depression on which the roller rests to hold the terminal in place at closed or opened state, or at any other desired position.Type: GrantFiled: November 29, 2006Date of Patent: August 10, 2010Assignee: Laird Technologies Korea YHInventor: Jun-Hong Lee
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Publication number: 20100029348Abstract: Disclosed are a sliding opening and closing device and a portable terminal having the same. According to the first embodiment of the present invention, a slide plate is linked to a main plate to be slidable in one direction. Also, the main plate supports an elastic part so as to generate an elasticity power in one direction. A power transformation member receives the elasticity power of the elastic member, and transmits the elasticity power to the slide plate in the direction of the opening or the closing according to the position of the slide plate.Type: ApplicationFiled: October 5, 2009Publication date: February 4, 2010Applicant: Laird Technologies Korea YHInventors: Jun-Hong Lee, Jae-Young Park, Chun-Soo Park
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Patent number: 7599723Abstract: Disclosed are a sliding opening and closing device and a portable terminal having the same. According to the first embodiment of the present invention, a slide plate is linked to a main plate to be slidable in one direction. Also, the main plate supports an elastic part so as to generate an elasticity power in one direction. A power transformation member receives the elasticity power of the elastic member, and transmits the elasticity power to the slide plate in the direction of the opening or the closing according to the position of the slide plate.Type: GrantFiled: August 25, 2004Date of Patent: October 6, 2009Assignee: Laird Technologies Korea YHInventors: Jun-Hong Lee, Jae-Young Park, Chun-Soo Park
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Publication number: 20080161075Abstract: Disclosed herein is a slide-up opening and closing apparatus for a communications terminal. The apparatus includes a slider unit, a slider assembly and an angular positioning member in order to open a slider body with respect to a main body. With the apparatus, the slider body can be opened with a desired inclination against the main body and after a certain degree of opening, automatically complete its opening operation without any further force or action, thereby providing a convenient use. In addition, the slider body can be opened with freedom without interference by the main body. Further, when the slider body is opened, most of the top face of the main body can be exposed, thereby providing a convenience of use.Type: ApplicationFiled: March 29, 2007Publication date: July 3, 2008Applicant: M2SYS CO., LTD.Inventors: Si-Wan Kim, Woong-Youl Kim, Jun-Hong Lee
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Publication number: 20080058039Abstract: Disclosed is a sliding mechanism for opening and closing a cellular phone. The mechanism includes a main plate, a slider plate slidably connected to the main plate, a first block shaft-rotatably fixed to the main plate, one or more first rod member fixed to the first block, a first resilient member connected to the first block and generating expansion force, a second block shaft-rotatably fixed to the slider plate, one or more second rod member fixed to the second block, a second resilient member connected to the second rod member and generating expansion force, and a connection block placed in the central area of the first and second blocks and supporting the end portions of the first and second resilient members. The connection block slidably connects the first and second rod members with the first and second blocks in such a way that the end portion of the first rod member is directed towards the second block and the end portion of the second rod member is directed towards the first block.Type: ApplicationFiled: September 15, 2005Publication date: March 6, 2008Inventors: Jun-Hong Lee, Chun-Soo Park
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Publication number: 20070128904Abstract: Disclosed is a slider mechanism for slidably opening and closing a portable communication terminal. The slider mechanism includes a first plate and a second plate slidably combined with the first plate. The second plate has a cam profile formed along siding direction. A resilience unit is mounted on the first plate to exert resilient force perpendicularly to moving direction of the second plate. A roller is rotatably attached to an end of the resilience unit. The roller runs along the cam profile while the portable terminal opens or closes. Formed at a desired position of the cam profile is a depression on which the roller rests to hold the terminal in place at closed or opened state, or at any other desired position.Type: ApplicationFiled: November 29, 2006Publication date: June 7, 2007Inventors: Kyung-Seok Kang, Jun-Hong Lee, Soon-Wook Kwon, Si-Wan Kim, Ho-Seong Ko
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Patent number: 7205658Abstract: A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.Type: GrantFiled: June 29, 2004Date of Patent: April 17, 2007Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Jun Hong Lee, Hyung Jun Park, Hyeong No Kim, Kun A Kang
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Publication number: 20070032278Abstract: Disclosed are a sliding opening and closing device and a portable terminal having the same. According to the first embodiment of the present invention, a slide plate is linked to a main plate to be slidable in one direction. Also, the main plate supports an elastic part so as to generate an elasticity power in one direction. A power transformation member receives the elasticity power of the elastic member, and transmits the elasticity power to the slide plate in the direction of the opening or the closing according to the position of the slide plate.Type: ApplicationFiled: August 25, 2004Publication date: February 8, 2007Inventors: Jun-Hong Lee, Jae-Young Park, Chun-Soo Park
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Publication number: 20060016973Abstract: A multi-chip image sensor package module includes a substrate having an opening, an IC chip, an image sensor chip and a glass cover. The IC chip includes a plurality of bumps on its mounting surface to mount on the lower surface of the substrate. The glass cover is disposed above the upper surface of the substrate. The image sensor chip is disposed between the mounting surface of the IC chip and the upper surface of the substrate by chip-to-chip attachment or flip-chip connection in a manner that the sensing region of the image sensor chip is aligned with the glass cover or a lens through the opening. Thus the multi-chip image sensor package module can have a thinner profile with lower assemble cost.Type: ApplicationFiled: July 21, 2004Publication date: January 26, 2006Inventors: Jun-Young Yang, Jong-Ho Han, Jun-Hong Lee
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Patent number: 6773961Abstract: A singulation method used in leadless packaging process is disclosed. An array of molded products on an upper surface of a lead frame is utilized in the singulation method. The lead frame has a plurality of dambars between the molded products. The lower surface of the lead frame is attached with a tape. Each of the molded products includes a semiconductor chip encapsulated in a package body and electrically coupled to the upper surface of the lead frame. The singulation method is accomplished by etching the upper surface of the lead frame with the package bodies as mask until each dambar is etched away.Type: GrantFiled: August 15, 2003Date of Patent: August 10, 2004Assignee: Advanced Semiconductor Engineering INC.Inventors: Jun Hong Lee, Hyung Jun Park, Hyeong No Kim, Kun A Kang
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Patent number: 6242284Abstract: A method for packaging a semiconductor chip, generally comprising the following steps of: (a) forming a plurality of openings on the top surface of the conducting substrate, wherein the upper portions of the openings are formed larger than the lower portions of the openings; (b) forming insulating sections in the conducting substrate by filling an insulating material in the openings; (c) forming a plurality of leads insulated by the insulating sections by planarizing the bottom surface of the conducting substrate to expose and form planarized bottom surfaces of the insulating sections; (d) mounting a semiconductor chip on the bottom surface of the conducting substrate; (e) providing a plurality of conducting wires to electrically connect the semiconductor chip to the leads; and (f) encapsulating the semiconductor chip and the conducting wires.Type: GrantFiled: May 5, 2000Date of Patent: June 5, 2001Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Kun-A Kang, Kyujin Jung, Hyung Jun Park, Jun Hong Lee