Patents by Inventor Jun Hou
Jun Hou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12293248Abstract: The present disclosure provides a map information acquisition method and a map acquisition apparatus and a non-transitory computer-readable storage medium. The method comprises: acquiring and constructing, by a map acquisition apparatus, map data, and acquiring, by the map acquisition apparatus, shelf identity information of each of shelves, wherein the shelf identity information is in one-to-one correspondence with the shelves, wherein the map acquisition apparatus comprises: a shopping cart component provided with a map construction system and a radio frequency identification reader; and marking, by the map acquisition apparatus, the map data according to each of the shelf identity information, and generating, by the map acquisition apparatus, map information marked with multiple pieces of shelf identity information.Type: GrantFiled: January 18, 2024Date of Patent: May 6, 2025Assignee: HANSHOW TECHNOLOGY CO., LTD.Inventors: Shiguo Hou, Min Liang, Jun Chen, Qi Jiang, Yang Zhao
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Patent number: 12293740Abstract: An electronic device may include a lenticular display. The lenticular display may have a lenticular lens film formed over an array of pixels. A plurality of lenticular lenses may extend across the length of the display. The lenticular lenses may be configured to enable stereoscopic viewing of the display such that a viewer perceives three-dimensional images. Crosstalk between viewing zones and disparity between images received from different viewing zones may result in disparity-caused shifts in images perceived by viewer of the lenticular display. To mitigate these disparity-caused shifts, compensation circuitry may be included in the display pipeline circuitry. The compensation circuitry may include stored disparity-caused shift calibration information that is used for the compensation. The stored disparity-caused shift calibration information may be a polynomial function that outputs a magnitude of disparity-caused shift for a given pixel location.Type: GrantFiled: November 30, 2022Date of Patent: May 6, 2025Assignee: Apple Inc.Inventors: Ping-Yen Chou, ByoungSuk Kim, Fu-Chung Huang, Hao Chen, Juan He, Jun Qi, Mingming Wang, Sheng Zhang, Yang Li, Yi Huang, Yi-Pai Huang, Yunhui Hou
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Publication number: 20250140666Abstract: A semiconductor package includes a RDL interposer having a first surface and a second surface; fanout pads and peripheral pads on the second surface; a first semiconductor die on the first surface and electrically connected to the fanout pads; a molding compound surrounding the first semiconductor die and the first surface of the RDL interposer; through mold vias in the molding compound around the first semiconductor die; peripheral solder bumps within the through mold vias and directly disposed on the peripheral pads; through silicon via pads on the rear surface of the first semiconductor die; a second semiconductor die bonded to the through silicon via pads of the first semiconductor die and the peripheral solder bumps within the through mold vias.Type: ApplicationFiled: December 14, 2023Publication date: May 1, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Da-Jun Lin, Bin-Siang Tsai, Fu-Yu Tsai, Tai-Cheng Hou
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Publication number: 20250142958Abstract: A semiconductor structure includes a SOI substrate having a device layer and a buried oxide layer contiguous with the device layer; a transistor disposed on the device layer; a dielectric layer surrounding the transistor; an interconnect structure disposed on the dielectric layer and electrically connected to a gate of the transistor; a charge trapping layer contiguous with the buried oxide layer; a capping layer contiguous with the charge trapping layer; and a conductive via penetrating through the capping layer, the charge trapping layer, the buried oxide layer, the device layer, and the dielectric layer. The conductive via is electrically connected to the interconnect structure.Type: ApplicationFiled: December 11, 2023Publication date: May 1, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Tai-Cheng Hou, Da-Jun Lin, Bin-Siang Tsai, Fu-Yu Tsai
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Publication number: 20250099525Abstract: The present disclosure relates to the technical field of traditional Chinese herbal composition, and in particular to a traditional Chinese herbal composition for the treatment of bacterial vaginosis and a preparation method thereof. The traditional Chinese herbal composition for the treatment of bacterial vaginosis provided by the present disclosure is prepared from the following components in parts by weight: 40-50 parts of Zingiberis Rhizoma Recens, 35-45 parts of Schisandrae Chinensis Fructus, 30-40 parts of Cinnamomi Cortex, 30-40 parts of Artemisiae Argyi Folium, 25-35 parts of Codonopsis Radix, 25-35 parts of a compound traditional Chinese herbal fermentation broth, 20-30 parts of Pulsatillae Radix, 20-25 parts of Lonicerae Japonicae Flos, 15-20 parts of Taraxaci Herba, 15-20 parts of Akebiae Caulis, 10-15 parts of Polygoni Cuspidati Rhizoma et Radix, and 5-10 parts of Atractylodis Macrocephalae Rhizoma.Type: ApplicationFiled: December 6, 2024Publication date: March 27, 2025Applicant: The third people’s hospital of chengduInventors: Jun HOU, Xudong WEN, Tian YUE, Yuan YUAN, Xiao LIU, Jiali YANG, Jian HE, Yue TANG
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Patent number: 12257279Abstract: The present disclosure relates to the technical field of traditional Chinese herbal composition, and in particular to a traditional Chinese herbal composition for the treatment of bacterial vaginosis and a preparation method thereof. The traditional Chinese herbal composition for the treatment of bacterial vaginosis provided by the present disclosure is prepared from the following components in parts by weight: 40-50 parts of Zingiberis Rhizoma Recens, 35-45 parts of Schisandrae Chinensis Fructus, 30-40 parts of Cinnamomi Cortex, 30-40 parts of Artemisiae Argyi Folium, 25-35 parts of Codonopsis Radix, 25-35 parts of a compound traditional Chinese herbal fermentation broth, 20-30 parts of Pulsatillae Radix, 20-25 parts of Lonicerae Japonicae Flos, 15-20 parts of Taraxaci Herba, 15-20 parts of Akebiae Caulis, 10-15 parts of Polygoni Cuspidati Rhizoma et Radix, and 5-10 parts of Atractylodis Macrocephalae Rhizoma.Type: GrantFiled: December 6, 2024Date of Patent: March 25, 2025Assignee: The third people's hospital of chengduInventors: Jun Hou, Xudong Wen, Tian Yue, Yuan Yuan, Xiao Liu, Jiali Yang, Jian He, Yue Tang
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Publication number: 20250094673Abstract: The present disclosure provides a real-time dynamic prediction system and method of a three-dimensional shape of a high-pressure jet grouting pile.Type: ApplicationFiled: June 6, 2023Publication date: March 20, 2025Inventors: Ruixue CAO, Leilei GUO, Zaixing XU, Jinhua HE, Yixian WANG, Bao XU, Panpan GUO, Yuan GAO, Yongli LIU, Jun NIE, Feifei WU, Ruowang YANG, Lianbiao HOU, Dongfang YAO
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Publication number: 20250092099Abstract: Compositions and methods for editing an endogenous NAC genes in plants are provided, for the improvement of traits of agronomic or commercial importance. Modifications of expression and activity of NAC genes are described, including editing endogenous NAC gene functional motifs and knocking out NAC gene function.Type: ApplicationFiled: November 20, 2024Publication date: March 20, 2025Applicant: PIONEER HI-BRED INTERNATIONAL, INC.Inventors: ZHENGLIN HOU, MARY A RUPE, BO SHEN, ROBERT W WILLIAMS, WEIQING ZENG, JUN ZHANG
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Publication number: 20250089196Abstract: A power equipment is disclosed. The power equipment includes an installation cabinet and a plurality of power modules. The installation cabinet includes a top. The plurality of power modules includes a first set of power modules and a second set of power modules. The first set of power modules is electrically connected to the installation cabinet, arranged adjacent to each other, and detachably disposed on the on the top of the installation cabinet to form a first array. The second set of power modules is electrically connected to the installation cabinet, arranged adjacent to each other, and detachably disposed on the on the top of the installation cabinet to form a second array. The power modules in the first array and the power modules in the second array are arranged back-to-back.Type: ApplicationFiled: September 5, 2024Publication date: March 13, 2025Inventors: Yansong Lu, Jun Chen, Wei Wang, Shisheng Hou
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Publication number: 20250085765Abstract: Systems and methods are disclosed for allocating and distributing power management budgets for subsystems of a computer system. For each of a plurality of subsystems, a power management system may generate a long-term power budget and a closed-loop power budget, and then determine a final power budget to provide to the subsystem, e.g., by applying a min function, a weighted sum, or some other function to the long-term power budget and the closed-loop power budget. The closed-loop power budget is determined based on observations of power draw over a past period of time, and therefore cannot respond immediately to large changes in power. The long-term power budget is generated based on a prediction of battery capability over an upcoming window of time, and may therefore provide a power cap before the system is under duress.Type: ApplicationFiled: September 12, 2023Publication date: March 13, 2025Inventors: Chee Lim Nge, Peter Hyungrok Sung, Douglas A. MacKay, Diwakar N. Tundlam, Jun Hou, Tu Le, Vishal Gupta, Ning Tian, Daniele Perretta, Bo Zhou, Michael Eng
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Publication number: 20250079293Abstract: A semiconductor device and a method of fabricating the same, includes at least one dielectric layer, a conductive structure, and a first insulator. The at least one dielectric layer includes a stacked structure having a low-k dielectric layer, an etching stop layer, and a conductive layer between the low-k dielectric layer and the etching stop layer. The conductive structure is disposed in the first dielectric layer. The first insulator is disposed between the conductive layer and the conductive structure.Type: ApplicationFiled: October 13, 2023Publication date: March 6, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Tai-Cheng Hou, Da-Jun Lin, Fu-Yu Tsai, Bin-Siang Tsai
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Publication number: 20250067840Abstract: The present disclosure provides a method, system and apparatus for correcting satellite observation data. By acquiring microwave radiometer (MWR) movement observation data of a radiosonde observation limited sounding area, correcting the MWR movement observation data based on corresponding radiosonde observation data, and correcting satellite observation data based on the radiosonde observation data and corrected MWR movement observation data, the present disclosure corrects the satellite observation data of the radiosonde observation limited detection area, reduces an error of the satellite observation data, and makes the satellite observation data more accurate.Type: ApplicationFiled: December 27, 2023Publication date: February 27, 2025Applicant: CHINESE ACADEMY OF METEOROLOGICAL SCIENCESInventors: Xiangde XU, Yi WANG, Le WANG, Ruixia LIU, Runze ZHAO, Weihao GU, Duanyang LIU, Shengjun ZHANG, Wenyue CAI, Haiduo SUN, Kai ZHANG, Jun HOU
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Publication number: 20250068183Abstract: The present application relates to a service decision method and a service decision device. The method includes: receiving a task request sent by a terminal, the task request including a terminal identifier, terminal location information and task information of the terminal; determining that the terminal is currently in an overlapping coverage area, generating a decision-making instruction according to the task request and a target decision network, and sending the decision-making instruction to the terminal according to the terminal identifier, the decision-making instruction being used to indicate whether a target unmanned aerial vehicle server provides to the terminal a service corresponding to the task request, and the target decision-making instruction being used by the terminal to select one server from among the target unmanned aerial vehicle server and the other unmanned aerial vehicle servers to provide the service. Using the present method can improve resource utilization.Type: ApplicationFiled: August 20, 2024Publication date: February 27, 2025Applicants: Tsinghua University, Technology Innovation Institute - Sole Proprietorship LLCInventors: Jun DU, Hualei ZHANG, Yu TIAN, Jintao WANG, Bingqing JIANG, Xiangwang HOU, Zhaoyue XIA, Ahmed AL HAMMADI, Aymen FAKHREDDINE
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Patent number: 12237470Abstract: The invention belongs to the technical field of batteries, and discloses a phosphate-based flame-retardant electrolyte and a lithium-metal battery, and the phosphate-based flame-retardant electrolyte consists of a lithium salt, a phosphate solvent and a diluent. According to the invention, dimethyl (2-methoxyethoxy)methylphosphonate or diethyl (2-methoxyethoxy)methylphosphonate is used as a novel phosphate solvent, an electrolyte system with local high salt concentration is adopted, most phosphate solvent molecules are complexed with Li+ at the local high salt concentration by adjusting dosages of the lithium salt, the phosphate solvent and the diluent, so almost none of free solvent molecules exist, thus inhibiting irreversible decomposition of phosphate molecules on a surface of a li-anode, and meanwhile, the flame retardancy of the phosphate solvent greatly improves the safety of the lithium-metal battery.Type: GrantFiled: July 20, 2023Date of Patent: February 25, 2025Assignee: Nankai UniversityInventors: Jun Chen, Chunyu Zheng, Yuankun Wang, Yunpeng Hou, Zhenhua Yan, Haixia Li, Qing Zhao
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Publication number: 20250062222Abstract: The present disclosure is related to a semiconductor device and a fabricating method thereof, and the semiconductor device includes a first dielectric layer and a first conductive structure. The first dielectric layer includes a stacked structure including a low-k dielectric layer, an etching stop layer, and a carbon-rich dielectric layer between the low-k dielectric layer and the etching stop layer, wherein a carbon concentration within the carbon-rich dielectric layer is above 15%. The first conductive structure is disposed in the first dielectric layer.Type: ApplicationFiled: October 13, 2023Publication date: February 20, 2025Applicant: UNITED MICROELECTRONICS CORP.Inventors: Tai-Cheng Hou, Da-Jun Lin, Fu-Yu Tsai, Bin-Siang Tsai
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Publication number: 20250053980Abstract: A biometric payment processing method includes: obtaining image data, the image data comprising a plurality of images of an organism that are successively acquired; detecting a target part in an image in the image data, the target part being a part to which a biometric payment function is bound in the organism; determining, in response to that the target part is detected from the plurality of images, a movement speed corresponding to the target part in the plurality of images; and performing a payment operation based on the target part in response to that the movement speed is less than a speed threshold.Type: ApplicationFiled: October 27, 2024Publication date: February 13, 2025Inventors: Jun WANG, Jinkun HOU, Runzeng GUO, Shaoming WANG, Hang ZHOU, Xiaojie CHEN
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Publication number: 20250037499Abstract: A method includes obtaining a current image for a target object, recognizing a target image region from the current image, determining an imaging size of the target object based on the target image region, obtaining a reference parameter determined according to a reference size of the target object and a reference distance between aperture and image sensor of camera, determining first distance between the target object and the camera when the current image is collected based on the reference parameter and the imaging size, obtaining second distance between the target object and the camera when historical image is collected, determining collection time difference between the current and historical images, determining movement speed of the target object based on the first and second distances, and the collection time difference, and determining, according to the current image, target image when the movement speed satisfies identity recognition image condition.Type: ApplicationFiled: October 17, 2024Publication date: January 30, 2025Inventors: Jun WANG, Jinkun HOU, Runzeng GUO, Shaoming WANG, Hang ZHOU, Xiaojie CHEN, Ruixin ZHANG, Yingyi ZHANG
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Patent number: 12211315Abstract: The present disclosure relates to a method and apparatus for association detection for a human face and a human hand, an electronic apparatus and a storage medium. The method comprises: acquiring a first image, the first image being an image of a human object; performing feature extraction on the first image to obtain a first feature map of multiple dimensions; performing a feature fusion processing on the first feature map of multiple dimensions to obtain a second feature map of multiple dimensions, the dimensions of the second feature map corresponding to the dimensions of the first feature map in a one-to-one manner; detecting, on the basis of the obtained second feature map of multiple dimensions, a human face position and a human hand position associated with the same human object in the first image. The embodiment of the present disclosure enables easy and convenient association detection for human face and human hand.Type: GrantFiled: June 29, 2021Date of Patent: January 28, 2025Assignee: Beijing Sensetime Technology Development Co., LtdInventors: Kunlin Yang, Kun Yan, Jun Hou, Shuai Yi
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Publication number: 20250031436Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first fin structure and a second fin structure. Each of the first fin structure and the second fin structure has multiple sacrificial layers and multiple semiconductor layers laid out in an alternating manner, and the first fin structure is substantially as wide as the second fin structure. The method also includes forming a gate stack wrapped around the first fin structure and the second fin structure. The method further includes simultaneously removing the sacrificial layers of the first fin structure and the second fin structure. Remaining portions of the semiconductor layers of the first fin structure form multiple first semiconductor nanostructures, and remaining portions of the semiconductor layers of the second fin structure form multiple second semiconductor nanostructures. Each of the first semiconductor nanostructures is thicker than each of the second semiconductor nanostructures.Type: ApplicationFiled: July 20, 2023Publication date: January 23, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wei-Chih HOU, Feng-Ming CHANG, Chun-Jun LIN, Kao-Ting LAI, Jhon-Jhy LIAW
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Publication number: 20250022309Abstract: A palm image processing method is performed by a computer device. The method includes: obtaining a palm image, and performing feature extraction on the palm image, to obtain image features at a plurality of scales; fusing the image features at the plurality of scales, to obtain an image fusion feature; determining, based on the image fusion feature, a palm part frame identifying a palm part in the palm image as a palm part image; performing image encryption on the palm part image, to obtain encrypted palm part image data; and transmitting the encrypted palm part image data to a server, and the server performing identity recognition based on the encrypted palm part image data.Type: ApplicationFiled: September 26, 2024Publication date: January 16, 2025Inventors: Weiming YANG, Runzeng GUO, Shaoming WANG, Jinkun HOU, Jun WANG