Abstract: A bonding pad with high bonding strength to a solder ball and a bump includes a carrier, a wiring layer formed on the carrier, a protection layer formed on top of the wiring layer and a solder mask layer surrounded around the protection layer and the wiring layer to form a bonding pad opening. The protection layer is extended outside the bonding pad opening such that when solder are extended into the bonding pad opening, the solder balls engage with side faces defining the bump pad opening as well as the protection layer outside the bump pad opening and a bonding strength between the bonding pad and the solder performance is increased.

Abstract: A process for electroplating a metal layer without the plating lines after the solder masking process is provided, which is characterized in that a ball pad which is on one side of the carrier board is connected to a anchor clamp of an electroplating device via a temporary conductor layer after the solder masking process so that the electric current can flow from the temporary conductor layer to the object to be plated on another side of the circuit board, so as to form the electroplated protective layers on both sides of the carrier board. Then, the temporary conductor layer is removed after electroplating. As a result, no plating lines will occupy the circuit layout area.