Patents by Inventor Jun-Hwan Woo

Jun-Hwan Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240177844
    Abstract: An operating room allocation apparatus may be provided. The apparatus according to an embodiment of the present disclosure may include: an information obtaining unit configured to obtain information about patient's entry and exit times in each operating room; a first calculation unit configured to calculate a utilization rate of the operating room for each certain time period based on the patient's entry and exit times; and a second calculation unit configured to receive certain time information from a user and calculate an average utilization rate by time period in the received time information.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 30, 2024
    Inventors: Jung Hwan MOON, Ji Hye WOO, Jun Young CHOI, Ho Jun SEOL, Jae Kyun CHOI, Seok Doo JEONG, Chae Yeon PARK, Mi Ja JU, Ihn Seon LEE, Do Hoon LIM
  • Patent number: 5787580
    Abstract: A method for making a RF module by a ball grid array package includes: perforating a feed-through hole which penetrates top and bottom surfaces of a terminal position of a chip populated on a substrate; forming a conductive line connecting top and bottom surfaces of said substrate into said feed-through hole; coating a part excepting a ball grid array pad on said conductive line with an insulator, by using emulsion mesh on said top surface of said substrate; making a stencil mask which provides a predetermined-sized aperture on a top surface of said ball grid array pad by using a metal mesh, and printing a solder paste on said ball grid array pad by using said stencil mask; and forming a ball grid array package solder ball through a reflow soldering of the solder paste in a nitrogen atmosphere. This method accuratly and easily forms a desired RF module without a solder printing process about a minute terminal pattern, thereby reducing a cost of production and preventing a poor product.
    Type: Grant
    Filed: November 19, 1996
    Date of Patent: August 4, 1998
    Assignee: LG Information & Communications, Ltd.
    Inventor: Jun-Hwan Woo