Patents by Inventor Jun Hyeon KIM
Jun Hyeon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240143114Abstract: A driving circuit includes: a display driver to generate a horizontal synchronization signal and a vertical synchronization signal according to a first clock signal of a first oscillator; a sensor driver to generate a touch signal according to a second clock signal of a second oscillator; and a determination circuit to detect a cycle of at least one of the horizontal synchronization signal or the vertical synchronization signal according to the second clock signal, and output a detection signal when the cycle is out of a range. The determination circuit is a part of the display driver or the sensor driver.Type: ApplicationFiled: June 26, 2023Publication date: May 2, 2024Inventors: Jun Young KO, Tae Hyeon YANG, Han Su CHO, Tae Joon KIM, Hyun Wook CHO, Jae Woo CHOI
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Publication number: 20240136430Abstract: A semiconductor device includes a first active pattern including a first lower pattern and first sheet patterns; a second active pattern including a second lower pattern and second sheet patterns, a height of the second lower pattern being smaller than a height of the first lower pattern; a first gate structure on the first lower pattern; a second gate structure on the second lower pattern; a first source/drain pattern on the first lower pattern and connected to the first sheet patterns; and a second source/drain pattern on the second lower pattern and connected to the second sheet patterns, wherein a width of an upper surface of the first lower pattern is different from a width of an upper surface of the second lower pattern, and wherein a number of first sheet patterns is different from a number of second sheet patterns.Type: ApplicationFiled: May 24, 2023Publication date: April 25, 2024Inventors: Jongmin SHIN, Wook Hyun KWON, Su-Hyeon KIM, Jun Mo PARK, Kyu Bong CHOI
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Patent number: 11967736Abstract: A battery module minimizes damage to internal configurations generated in an assembly process. The battery module includes a cell assembly provided with an electrode lead and a plurality of secondary batteries stacked; a bus bar assembly provided with a bus bar frame located on a front or rear of the cell assembly, and a bus bar mounted on an outer surface of the bus bar frame; and an inner cover provided with a plate portion located on an outer side of the cell assembly, formed in a plate shape and formed with a chamfer on an outer peripheral portion and a coupling portion coupled to one end portion of the body portion of the bus bar frame on a part of the outer peripheral portion of the plate portion.Type: GrantFiled: December 19, 2019Date of Patent: April 23, 2024Assignee: LG ENERGY SOLUTION, LTD.Inventors: Jeong-Hyeon Kim, Do-Hyun Park, Jun-Yeob Seong, Jong-Ha Jeong
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Patent number: 11951207Abstract: The present invention provides a stable liquid pharmaceutical formulation containing: an antibody or its antigen-binding fragment; a surfactant; a sugar or its derivative; and a buffer. The stable liquid pharmaceutical formulation according to the present invention has low viscosity while containing a high content of the antibody, has excellent long-term storage stability based on excellent stability under accelerated conditions and severe conditions, and may be administered subcutaneously.Type: GrantFiled: June 28, 2017Date of Patent: April 9, 2024Assignee: Celltrion Inc.Inventors: Joon Won Lee, Won Yong Han, Su Jung Kim, Jun Seok Oh, So Young Kim, Su Hyeon Hong, Yeon Kyeong Shin
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Patent number: 11941839Abstract: Provided is a 10-20 system-based position information providing method performed by a computer. The method comprises the steps of: obtaining a head image of a subject; receiving, from a user, an input of at least four reference points on the basis of the head image; calculating central coordinates in the head image on the basis of the at least four reference points; and providing 10-20 system-based position information on the basis of the central coordinates.Type: GrantFiled: July 23, 2021Date of Patent: March 26, 2024Assignee: NEUROPHET Inc.Inventors: Dae Gyu Min, Jun Kil Been, Dong Hyeon Kim
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Publication number: 20230402229Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: ApplicationFiled: August 30, 2023Publication date: December 14, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Patent number: 11784005Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: GrantFiled: June 9, 2022Date of Patent: October 10, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Patent number: 11735364Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.Type: GrantFiled: October 27, 2021Date of Patent: August 22, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
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Patent number: 11574773Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: GrantFiled: September 30, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo Yi, Soung Jin Kim, Kun Hoi Koo, Jun Hyeon Kim, Kyung Ryul Lee
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Patent number: 11562859Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: GrantFiled: October 19, 2021Date of Patent: January 24, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
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Publication number: 20220301783Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: ApplicationFiled: June 9, 2022Publication date: September 22, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Patent number: 11393633Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: GrantFiled: May 15, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Publication number: 20220189696Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: ApplicationFiled: September 30, 2021Publication date: June 16, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo YI, Soung Jin KIM, Kun Hoi KOO, Jun Hyeon KIM, Kyung Ryul LEE
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Publication number: 20220051853Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.Type: ApplicationFiled: October 27, 2021Publication date: February 17, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
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Publication number: 20220037087Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: ApplicationFiled: October 19, 2021Publication date: February 3, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok YI, Jung Min KIM, Chang Hak CHOI, Bon Seok KOO, Byung Woo KANG, Hae Sol KANG, San KYEONG, Jun Hyeon KIM
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Patent number: 11189424Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.Type: GrantFiled: March 31, 2020Date of Patent: November 30, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
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Patent number: 11183331Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.Type: GrantFiled: August 12, 2019Date of Patent: November 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
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Publication number: 20210065981Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.Type: ApplicationFiled: March 31, 2020Publication date: March 4, 2021Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
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Publication number: 20210057160Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.Type: ApplicationFiled: May 15, 2020Publication date: February 25, 2021Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
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Patent number: 10770230Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.Type: GrantFiled: May 7, 2018Date of Patent: September 8, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Bon Seok Koo, Jung Min Kim, Jun Hyeon Kim, Hae Sol Kang, Soung Jin Kim, Ji Hye Han, Byung Woo Kang, Chang Hak Choi