Patents by Inventor Jun Hyeon KIM

Jun Hyeon KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240179932
    Abstract: The present disclosure relates to an organic light emitting diode and an organic light emitting device including the same. The organic light emitting diode includes a first electrode; a second electrode facing the first electrode; and a first blue emitting material layer including a first compound and a second compound and positioned between the first and second electrodes, wherein the first compound is represented by Formula 1, and the second compound is represented by Formula 3. According to an aspect of the present disclosure, it is allowed to provide an OLED and an organic light emitting device having high emitting efficiency and/or improved lifespan.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 30, 2024
    Applicants: LG DISPLAY CO., LTD., LT Materials Co.,Ltd
    Inventors: Ji-Seon JANG, Chi-Ho LEE, Suk-Young BAE, Han-Jin AHN, Jun-Yun KIM, Dae-Hyuk CHOI, Dong-Jun KIM, Yong-Woo KIM, Yong-Geun JUNG, Jin-Hwan SHIN, Seok-Hyeon YU
  • Patent number: 11986319
    Abstract: The present disclosure relates to a patch guide method, including at least: acquiring a matched model of a 3D scan model and a 3D brain MM model; capturing an image of the head of the object by using a depth camera; matching one location of the captured image and one location on the matched model; and determining a patch location on the head of the object, by using a 3D brain map. In the method, physical characteristics of areas included in the brain MRI image are acquired and used to generate the 3D brain map of the object. In the method, a target stimulus point, to which an electrical stimulus is to be applied in a brain of the object, is acquired and used in a simulation of a delivery process of the electrical stimulus to the target stimulus point from candidate stimulus positions, to determine the patch location.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: May 21, 2024
    Assignee: NEUROPHET Inc.
    Inventors: Dong Hyeon Kim, Jun Kil Been
  • Publication number: 20240143114
    Abstract: A driving circuit includes: a display driver to generate a horizontal synchronization signal and a vertical synchronization signal according to a first clock signal of a first oscillator; a sensor driver to generate a touch signal according to a second clock signal of a second oscillator; and a determination circuit to detect a cycle of at least one of the horizontal synchronization signal or the vertical synchronization signal according to the second clock signal, and output a detection signal when the cycle is out of a range. The determination circuit is a part of the display driver or the sensor driver.
    Type: Application
    Filed: June 26, 2023
    Publication date: May 2, 2024
    Inventors: Jun Young KO, Tae Hyeon YANG, Han Su CHO, Tae Joon KIM, Hyun Wook CHO, Jae Woo CHOI
  • Publication number: 20240136430
    Abstract: A semiconductor device includes a first active pattern including a first lower pattern and first sheet patterns; a second active pattern including a second lower pattern and second sheet patterns, a height of the second lower pattern being smaller than a height of the first lower pattern; a first gate structure on the first lower pattern; a second gate structure on the second lower pattern; a first source/drain pattern on the first lower pattern and connected to the first sheet patterns; and a second source/drain pattern on the second lower pattern and connected to the second sheet patterns, wherein a width of an upper surface of the first lower pattern is different from a width of an upper surface of the second lower pattern, and wherein a number of first sheet patterns is different from a number of second sheet patterns.
    Type: Application
    Filed: May 24, 2023
    Publication date: April 25, 2024
    Inventors: Jongmin SHIN, Wook Hyun KWON, Su-Hyeon KIM, Jun Mo PARK, Kyu Bong CHOI
  • Patent number: 11967736
    Abstract: A battery module minimizes damage to internal configurations generated in an assembly process. The battery module includes a cell assembly provided with an electrode lead and a plurality of secondary batteries stacked; a bus bar assembly provided with a bus bar frame located on a front or rear of the cell assembly, and a bus bar mounted on an outer surface of the bus bar frame; and an inner cover provided with a plate portion located on an outer side of the cell assembly, formed in a plate shape and formed with a chamfer on an outer peripheral portion and a coupling portion coupled to one end portion of the body portion of the bus bar frame on a part of the outer peripheral portion of the plate portion.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: April 23, 2024
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Jeong-Hyeon Kim, Do-Hyun Park, Jun-Yeob Seong, Jong-Ha Jeong
  • Patent number: 11951207
    Abstract: The present invention provides a stable liquid pharmaceutical formulation containing: an antibody or its antigen-binding fragment; a surfactant; a sugar or its derivative; and a buffer. The stable liquid pharmaceutical formulation according to the present invention has low viscosity while containing a high content of the antibody, has excellent long-term storage stability based on excellent stability under accelerated conditions and severe conditions, and may be administered subcutaneously.
    Type: Grant
    Filed: June 28, 2017
    Date of Patent: April 9, 2024
    Assignee: Celltrion Inc.
    Inventors: Joon Won Lee, Won Yong Han, Su Jung Kim, Jun Seok Oh, So Young Kim, Su Hyeon Hong, Yeon Kyeong Shin
  • Patent number: 11941839
    Abstract: Provided is a 10-20 system-based position information providing method performed by a computer. The method comprises the steps of: obtaining a head image of a subject; receiving, from a user, an input of at least four reference points on the basis of the head image; calculating central coordinates in the head image on the basis of the at least four reference points; and providing 10-20 system-based position information on the basis of the central coordinates.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: March 26, 2024
    Assignee: NEUROPHET Inc.
    Inventors: Dae Gyu Min, Jun Kil Been, Dong Hyeon Kim
  • Publication number: 20230402229
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
    Type: Application
    Filed: August 30, 2023
    Publication date: December 14, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
  • Patent number: 11784005
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
    Type: Grant
    Filed: June 9, 2022
    Date of Patent: October 10, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
  • Patent number: 11735364
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: August 22, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
  • Patent number: 11574773
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: February 7, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Soo Yi, Soung Jin Kim, Kun Hoi Koo, Jun Hyeon Kim, Kyung Ryul Lee
  • Patent number: 11562859
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Grant
    Filed: October 19, 2021
    Date of Patent: January 24, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
  • Publication number: 20220301783
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
    Type: Application
    Filed: June 9, 2022
    Publication date: September 22, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
  • Patent number: 11393633
    Abstract: A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and external electrodes disposed on both ends of the capacitor body and connected to exposed portions of the plurality of internal electrodes, respectively. Each of the external electrodes includes a conductive layer disposed on the capacitor body to be connected to one or more of the plurality of internal electrodes, a conductive resin layer covering the conductive layer, and including a plurality of metal particles, a plurality of elastic fine powder particles each having an elastic powder particle and a metal film plated on a surface of the elastic powder particle, and a conductive resin surrounding the plurality of metal particles and the plurality of elastic fine powder particles and contacting the conductive layer, and a plating layer covering the conductive resin layer.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: San Kyeong, Chang Hak Choi, Jae Seok Yi, Bon Seok Koo, Jung Min Kim, Hae Sol Kang, Jun Hyeon Kim
  • Publication number: 20220189696
    Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.
    Type: Application
    Filed: September 30, 2021
    Publication date: June 16, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Soo YI, Soung Jin KIM, Kun Hoi KOO, Jun Hyeon KIM, Kyung Ryul LEE
  • Publication number: 20220051853
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
    Type: Application
    Filed: October 27, 2021
    Publication date: February 17, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
  • Publication number: 20220037087
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Application
    Filed: October 19, 2021
    Publication date: February 3, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok YI, Jung Min KIM, Chang Hak CHOI, Bon Seok KOO, Byung Woo KANG, Hae Sol KANG, San KYEONG, Jun Hyeon KIM
  • Patent number: 11189424
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: November 30, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim
  • Patent number: 11183331
    Abstract: A multilayered capacitor includes a shock absorbing layer disposed between an upper layer of a capacitor body and a conductive resin layer of an external electrode and between a lower layer of the capacitor body and the conductive resin layer of the external electrode. A length of the shock absorbing layer is longer than that of the conductive resin layer, thereby improving warpage strength characteristics of the capacitor body.
    Type: Grant
    Filed: August 12, 2019
    Date of Patent: November 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jae Seok Yi, Jung Min Kim, Chang Hak Choi, Bon Seok Koo, Byung Woo Kang, Hae Sol Kang, San Kyeong, Jun Hyeon Kim
  • Publication number: 20210065981
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode including an electrode layer disposed on the body and connected to the internal electrode and a conductive resin layer disposed on the electrode layer, and the conductive resin layer includes a metal wire, a conductive metal, and a base resin.
    Type: Application
    Filed: March 31, 2020
    Publication date: March 4, 2021
    Inventors: Jun Hyeon Kim, Hae Sol Kang, Bon Seok Koo, San Kyeong, Chang Hak Choi, Jung Min Kim