Patents by Inventor Jun-Hyuk Kwon
Jun-Hyuk Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240356181Abstract: A secondary battery includes: an electrode assembly; a can having a lower surface and a side surface and accommodating the electrode assembly; a cap plate coupled to an upper end of the can; a terminal on the lower surface of the can; and an insulator having a plate-shaped portion and an extending portion extending upwardly from a circumference of the plate-shaped portion. The plate-shaped portion is between the electrode assembly and the lower surface of the can, and the extending portion has an upper end contacting a lower portion of the electrode assembly.Type: ApplicationFiled: October 24, 2023Publication date: October 24, 2024Inventors: Woo Hyuk CHOI, Jun Ho YANG, Jun Hwan KWON, Hyun Suk PARK, Tae Yoon LEE, Young Ho KIM
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Publication number: 20240356150Abstract: Embodiments of the present disclosure relate to a cylindrical secondary battery that facilitates gas discharge by causing a bent shape of a cap plate to be deformed and broken if a temperature of a cell increases, such as due to an event. In one or more embodiments, a secondary battery includes: an electrode assembly; a case including a top end open to accommodate the electrode assembly; and a cap plate coupled to the top end of the case, and the cap plate includes a central region, an edge region, a bent portion between the central region and the edge region, and a vent portion including a notch configured to be broken by a certain pressure.Type: ApplicationFiled: February 15, 2024Publication date: October 24, 2024Inventors: Woo Hyuk CHOI, Joung Ku KIM, Jun Ho YANG, Jun Hwan KWON, Hyun Suk PARK, Tae Yoon LEE
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Publication number: 20240342861Abstract: A diamond tool is combined with a processing apparatus to process a workpiece. The diamond tool includes a shank, a segment, and an abrasion preventing part. The shank has a throughhole through which grinding powder generated during processing the workpiece by the processing apparatus is discharged outside. The segment is bonded to an end portion of the shank. The segment contacts and processes the workpiece. The abrasion preventing part is disposed on an adjacent portion among an outer surface of the shank adjacent to the throughhole to prevent abrasion of the outer surface during the processing of the workpiece.Type: ApplicationFiled: January 30, 2024Publication date: October 17, 2024Applicant: SHINHAN DIAMOND INDUSTRIAL CO., LTD.Inventors: Shin Kyung KIM, Sung Gyu KIM, Eung Kwan KWON, Jun Hyuk HWANG
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Publication number: 20240276747Abstract: An organic light emitting diode (OLED) and an organic light emitting device comprising the OLED (e.g., a display device or a lighting device) are described. The OLED can include a first blue emitting material layer including a first host, and a second blue emitting material layer including a second host, disposed between two electrodes. The OLED includes two blue emitting material layers so that an exciton recombination zone is distributed within the blue emitting material layers irrespective of current density or gradation. As the amount of non-emitting excitons accumulated outside of the emitting material layers is minimized, the driving voltage of the OLED can be lowered, and the luminous efficiency and the luminous lifespan of the OLED can be improved.Type: ApplicationFiled: August 30, 2023Publication date: August 15, 2024Applicant: LG Display Co., Ltd.Inventors: Jun-Su HA, Shin-Young JEONG, Yu-Jeong LEE, Hyun-Jin CHO, Eun-Jung PARK, Ju-Hyuk KWON, Jang-Dae YOUN
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Publication number: 20240276762Abstract: An organic light emitting diode (OLED) and an organic light emitting device (e.g., a display device or a lighting device) thereof are described. The OLED comprises a first electrode, a second electrode, a first emitting part (including a first hole transporting layer (HTL) and a first emitting material layer (EML), positioned between the first and second electrodes); and a second emitting part (including a second EML and positioned between the first emitting part and the second electrode). The first EML is a blue EML, and the second EML includes at least one of a red EML and a blue EML. The first hole HTL includes a high refractive layer having a first refractive index, and a low refractive layer having a second refractive index, positioned between the high refractive layer and the first EML, where the second refractive index is smaller than the first refractive index.Type: ApplicationFiled: December 28, 2023Publication date: August 15, 2024Applicant: LG Display Co., Ltd.Inventors: Ju-Hyuk KWON, Eun-Jung PARK, Jang-Dae YOUN, Yu-Jeong LEE, Hyun-Jin CHO, Jun-Su HA
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Publication number: 20240260293Abstract: An organic light emitting diode (OLED) and an organic light emitting device comprising the OLED (e.g., a display device or a lighting device) are described. The OLED can include a blue emitting material layer including plural hosts with adjusted energy levels. A HOMO energy barrier between the at least one blue emitting material layer and at least one hole transport layer and/or electron blocking layer can be minimized. Holes generated at an anode or a P-type charge generation layer can be injected rapidly into the at least one blue emitting material layer without accumulating at an interface between the hole transport layer and/or the electron blocking layer, and the at least one blue emitting material layer. As the amount of non-emitting holes is minimized, the driving voltage of the OLED can be lowered, and the luminous efficiency and the luminous lifespan of the OLED can be improved.Type: ApplicationFiled: July 11, 2023Publication date: August 1, 2024Applicant: LG Display Co., Ltd.Inventors: Yu-Jeong LEE, Hyun-Jin CHO, Eun-Jung PARK, Ju-Hyuk KWON, Jang-Dae YOUN, Shin-Young JEONG, Jun-Su HA
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Publication number: 20240244969Abstract: An organic light emitting diode (OLED) and an organic light emitting device comprising the OLED are described. The OLED can comprise a first electrode; a second electrode facing the first electrode; and a first emitting part (including a first blue emitting layer and a second blue emitting layer), which is positioned between the first and second electrode. The second blue emitting layer is positioned between the first blue emitting layer and the second electrode and contacting the first blue emitting layer. The first blue emitting layer includes a first host and a first dopant, and the second blue emitting layer includes a second host and a second dopant, wherein the first host is a pyrene derivative, and the second host is an anthracene derivative. An organic light emitting device can include the OLED, and can be a display device or a lighting device.Type: ApplicationFiled: August 8, 2023Publication date: July 18, 2024Applicant: LG Display Co., Ltd.Inventors: Ju-Hyuk KWON, Chun-Ki KIM, Yu-Jeong LEE, Eun-Jung PARK, Jang-Dae YOUN, Hyun-Jin CHO, Jun-Su HA
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Patent number: 10840642Abstract: A connector assembly comprises a housing assembly including a housing shell and a center pin disposed on an inner side of the housing shell, and a head assembly including a head shell detachable from the housing shell, a head body fixed to an inner side of the head shell, and a socket mounted on the head body. The socket includes at least four contact members disposed around a central axis of the head body in a circumferential direction. Each of the contact members has a shape bent toward the central axis of the head body.Type: GrantFiled: December 18, 2018Date of Patent: November 17, 2020Assignee: Tyco Electronics AMP Korea Co. Ltd.Inventors: Gi Chan Kwon, Sung Jun Choi, Jun Hyuk Kwon, Hoon Jae Kim, Jong Jun Lee
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Publication number: 20190190206Abstract: A connector assembly comprises a housing assembly including a housing shell and a center pin disposed on an inner side of the housing shell, and a head assembly including a head shell detachable from the housing shell, a head body fixed to an inner side of the head shell, and a socket mounted on the head body. The socket includes at least four contact members disposed around a central axis of the head body in a circumferential direction. Each of the contact members has a shape bent toward the central axis of the head body.Type: ApplicationFiled: December 18, 2018Publication date: June 20, 2019Applicant: Tyco Electronics AMP Korea Co. LtdInventors: Gi Chan Kwon, Sung Jun Choi, Jun Hyuk Kwon, Hoon Jae Kim, Jong Jun Lee
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Patent number: 9657482Abstract: A floor panel having an adhesive applied sheet, including: a tile; an adhesive sheet laminated on the tile, the adhesive sheet having an adhesive applied face exposed in an L-shaped form at the edge of the tile; and an adhesive layer interposed between contact faces of the tile and the adhesive sheet, where the adhesive sheet includes: a sheet made of one of PVC, PLA, PET, PE, and PP; an acryl-based adhesive adhered on one side of the sheet; and a protective film adhered on the adhesive applied face exposed in the L-shaped form.Type: GrantFiled: March 4, 2013Date of Patent: May 23, 2017Assignee: LG Hausys, Ltd.Inventors: Hae Seung Ko, Jun Hyuk Kwon, Sang Sun Park
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Patent number: 9623635Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.Type: GrantFiled: March 7, 2011Date of Patent: April 18, 2017Assignee: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Patent number: 9517612Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.Type: GrantFiled: March 15, 2011Date of Patent: December 13, 2016Assignee: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Patent number: 9422729Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.Type: GrantFiled: June 13, 2011Date of Patent: August 23, 2016Assignee: LG HAUSYS, LTD.Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng-Zhe Huang
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Publication number: 20150044409Abstract: Disclosed therein is a floor panel having an adhesive applied sheet, which can be constructed without carrying out an adhesive applying process because the adhesive applied sheet is adhered on a rear side of the floor panel in the process of manufacturing the floor panel, which is easy to be removed and recycled because an adhesive is not applied to the floor during construction, and which can enhance consumers' satisfaction because it uses environment-friendly materials.Type: ApplicationFiled: March 4, 2013Publication date: February 12, 2015Inventors: Hae Seung Ko, Jun Hyuk Kwon, Sang Sun Park
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Publication number: 20140370225Abstract: Disclosed is a flooring material in which edge portions of a base layer and a surface layer of the flooring material are formed to be rounded when press forming the base layer and the surface layer, thereby providing its fine appearance, and which can provide construction joints between tiles through a dry construction method using an adhesive.Type: ApplicationFiled: December 28, 2012Publication date: December 18, 2014Inventors: Hae Seung Ko, Jun Hyuk Kwon, Sang Sun Park
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Publication number: 20140360117Abstract: The present invention relates to PVC resin flooring in which a tile is molded out of PVC, that is, vinyl chloride resin, and the four-sided edges of the tile are molded into curved surfaces. The PVC resin flooring constructed in a floor includes a resin tile configured to include a base layer and a surface layer, wherein the surface layer comprises a dimension stabilization layer, a balance layer, a printing layer, a transparent layer, and a protection layer sequentially stacked on a top surface of the base layer, the base layer and the surface layer are made of PVC resin and jointed, and the four-sided edges of the resin tile are molded into curved surfaces; and a grouting constructed in a gap between the resin tiles, wherein the resin tile is constructed by coating an adhesive on a construction floor, the resin tiles are spaced apart from one another at intervals, and construction is finished by filling the gap between the resin tiles with the grouting.Type: ApplicationFiled: January 4, 2013Publication date: December 11, 2014Applicant: LG Hausys, Ltd.Inventors: Hae Seung Ko, Jun Hyuk Kwon, Sang Sun Park
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Publication number: 20130302577Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.Type: ApplicationFiled: June 13, 2011Publication date: November 14, 2013Applicant: LG Hausys, Ltd.Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng-Zhe Huang
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Publication number: 20130004703Abstract: The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board.Type: ApplicationFiled: March 30, 2011Publication date: January 3, 2013Applicant: LG HAUSYS, LTD.Inventors: Hyun-Jong Kwon, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee, Cheng Zhe Huang
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Publication number: 20130004751Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.Type: ApplicationFiled: March 15, 2011Publication date: January 3, 2013Applicant: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee
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Publication number: 20120231256Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.Type: ApplicationFiled: March 7, 2011Publication date: September 13, 2012Applicant: LG HAUSYS, LTD.Inventors: Cheng-Zhe Huang, Ji-Young Kim, Ki-Bong Park, Chang-Won Kang, Jun-Hyuk Kwon, Hyun-Jong Kwon, Sang-Sun Park, Jang-Ki Kim, Gyeong-Min Lee