Abstract: A secondary battery includes: a can having an accommodation space therein; an electrode assembly accommodated in the accommodation space in the can; and a cap assembly sealed with the can. The can has a beading part recessed into a side wall of the can at a region below where the cap assembly is accommodated, and the beading part has an acute angle with respect to the side wall of the can.

Abstract: A connector assembly comprises a housing assembly including a housing shell and a center pin disposed on an inner side of the housing shell, and a head assembly including a head shell detachable from the housing shell, a head body fixed to an inner side of the head shell, and a socket mounted on the head body. The socket includes at least four contact members disposed around a central axis of the head body in a circumferential direction. Each of the contact members has a shape bent toward the central axis of the head body.

Abstract: A connector assembly comprises a housing assembly including a housing shell and a center pin disposed on an inner side of the housing shell, and a head assembly including a head shell detachable from the housing shell, a head body fixed to an inner side of the head shell, and a socket mounted on the head body. The socket includes at least four contact members disposed around a central axis of the head body in a circumferential direction. Each of the contact members has a shape bent toward the central axis of the head body.

Abstract: A floor panel having an adhesive applied sheet, including: a tile; an adhesive sheet laminated on the tile, the adhesive sheet having an adhesive applied face exposed in an L-shaped form at the edge of the tile; and an adhesive layer interposed between contact faces of the tile and the adhesive sheet, where the adhesive sheet includes: a sheet made of one of PVC, PLA, PET, PE, and PP; an acryl-based adhesive adhered on one side of the sheet; and a protective film adhered on the adhesive applied face exposed in the L-shaped form.

Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.

Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.

Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.

Abstract: Disclosed therein is a floor panel having an adhesive applied sheet, which can be constructed without carrying out an adhesive applying process because the adhesive applied sheet is adhered on a rear side of the floor panel in the process of manufacturing the floor panel, which is easy to be removed and recycled because an adhesive is not applied to the floor during construction, and which can enhance consumers' satisfaction because it uses environment-friendly materials.

Abstract: Disclosed is a flooring material in which edge portions of a base layer and a surface layer of the flooring material are formed to be rounded when press forming the base layer and the surface layer, thereby providing its fine appearance, and which can provide construction joints between tiles through a dry construction method using an adhesive.

Abstract: The present invention relates to PVC resin flooring in which a tile is molded out of PVC, that is, vinyl chloride resin, and the four-sided edges of the tile are molded into curved surfaces. The PVC resin flooring constructed in a floor includes a resin tile configured to include a base layer and a surface layer, wherein the surface layer comprises a dimension stabilization layer, a balance layer, a printing layer, a transparent layer, and a protection layer sequentially stacked on a top surface of the base layer, the base layer and the surface layer are made of PVC resin and jointed, and the four-sided edges of the resin tile are molded into curved surfaces; and a grouting constructed in a gap between the resin tiles, wherein the resin tile is constructed by coating an adhesive on a construction floor, the resin tiles are spaced apart from one another at intervals, and construction is finished by filling the gap between the resin tiles with the grouting.

Abstract: Disclosed herein is a chip inlaid flooring material using a PLA resin. The chip inlaid flooring material includes a chip inlaid layer, a dimension stabilizing layer, and a base layer, from the top of the flooring material, wherein at least one of the chip inlaid layer and the base layer includes polylactic acid (PLA) resin as a binder.

Abstract: Disclosed is a flooring material using an environment-friendly PLA resin. According to the present invention, the flooring material using the PLA resin comprises: a base layer; a print layer which is formed on top of the base layer, and has a print pattern on an upper side thereof; and a transparent layer which is formed on top of the print layer, wherein one or more of the base layer, the print layer, and the transparent layer include polylactic acid (PLA) resin.

Abstract: The present invention relates to a board complex having a polylactic acid (PLA) cover. The board complex includes: a cover member having at least one layer containing a PLA resin; and a board formed beneath the cover member, wherein the material for the board is selected from medium-density fiberboard (MDF), plywood, asbestos-free cellulose fiber reinforced cement board, magnesium board, glued laminated timber, high density fiberboard (HDF), particle board, ceramic tile, porcelain tile, ceramic board, and click-fastened board.

Abstract: Disclosed is a chip through flooring material using a PLA resin, which is environmentally friendly by using the PLA resin and can realize the texture of natural wood and the unique fragrance of trees. According to the present invention, the chip through flooring material using the PLA resin includes: a chip through layer; and a surface treatment layer which is formed on a surface of the chip through layer, wherein the chip through layer includes the PLA resin.