Abstract: An insulating film, provided above a first yoke portion, supports a thin film coil and has an inclined portion in an air bearing surface side. A second pole portion of a second magnetic film is opposed to a first pole portion via gap film. A second yoke portion, provided on the insulating film, continues to the second pole portion and its rear portion is joined with the first yoke portion. A top thin film coil 27 has a coil winding body portion with small thickness H1 nearest the air bearing surface and a coil winding body portion with larger thickness H3 than the thickness H3.

Abstract: A first magnetic member including a first pole portion and a first yoke portion is formed so as to be supported by a substrate, and a write gap film is formed so as to cover the first magnetic member. A thin film is formed so as to be supported by an insulating film, and thereafter, an antireflection film is formed on the surface of the insulating film including an inclined portion rising on the write gap film. The antireflection film is patterned by a photolithography process so that the patterned antireflection film can remain only on the inclined portion. Then, a photoresist is applied so as to cover the antireflection film and the insulating film, and is processed by a photolithography process for a second magnetic member to form a resistframe having a given enclosed pattern.

Abstract: A solution to be optically treated including a cyclopentanone solvent, polymethylglutarimide and a light absorption dye is applied onto a body to be plated 100 including an inclined portion 200, and thereafter, is thermally treated to form an antireflection film 300. Then, a photoresist 400 is applied so as to cover the antireflection film. Subsequently, a photolithography process to form a plate-pattern on the body to be plated is carried out for the photoresist 400 and the antireflection film 300.

Abstract: A solution to be optically treated including a cyclopentanone solvent, polymethylglutarimide and a light absorption dye is applied onto a body to be plated 100 including an inclined portion 200, and thereafter, is thermally treated to form an antireflection film 300. Then, a photoresist 400 is applied so as to cover the antireflection film. Subsequently, a photolithography process to form a plate-pattern on the body to be plated is carried out for the photoresist 400 and the antireflection film 300.

Abstract: In forming a second pole portion and a second yoke portion independently, after a first magnetic film, a gap film, a coil film, an insulating film and a second pole portion are formed, a plate underfilm M1 is formed on their exposed surfaces. Then, a negative type resistfilm is applied on the plate underfilm M1, and exposed and developed to fabricate a resistframe ton define a pattern for a second yoke portion. Then, a plate film to constitute a second yoke portion is formed.