Patents by Inventor Junichi Tabei

Junichi Tabei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for encapsulating semiconductor, semiconductor device, and mold releasing agent
    Patent number: 9040606
    Abstract: Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an ?-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.
    Type: Grant
    Filed: October 7, 2010
    Date of Patent: May 26, 2015
    Assignee: SUMITOMO BAKELITE CO., LTD.
    Inventor: Junichi Tabei
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND MOLD RELEASING AGENT
    Publication number: 20120199992
    Abstract: Disclosed is an epoxy resin composition used for encapsulation of a semiconductor containing an epoxy resin (A), a curing agent (B), an inorganic filler (C) and a mold releasing agent, in which the mold releasing agent contains a compound (D) having a copolymer of an ?-olefin having 28 to 60 carbon atoms and a maleic anhydride esterified with a long chain aliphatic alcohol having 10 to 25 carbon atoms.
    Type: Application
    Filed: October 7, 2010
    Publication date: August 9, 2012
    Inventor: Junichi Tabei