Abstract: An operation method of a relay node may include: receiving, from a first communication node, first data composed of n bits; receiving, from a second communication node, second data composed of m bits; in response to determining that n is greater than m, generating first T-data of m bits excluding (n-m) bits from the n-bits of the first data and first R-data of (n-m) bits; generating third data by performing a network coding operation on the first T-data and the second data; transmitting the third data to the first communication node; and transmitting the third data and the first R-data to the second communication node.

Abstract: A method for manufacturing a vehicle wheel includes: a casting process of manufacturing the wheel in a one-piece body having a forming end and a temporary flange protruding at inner and outer sides of the wheel, respectively, wherein the one-piece body further includes a resonance chamber forming groove; a primary shape machining process of forming a stepped part at an outer circumferential side of the resonance chamber forming groove; a flow forming process of bending the forming end to be seated on the stepped part; a friction stir welding process of integrally bonding a portion where the forming end and the stepped part are in close contact with each other; a fine machining process of removing the temporary flange; and a sound-absorbing hole machining process of forming a sound-absorbing hole for communicating between the resonance chamber and an interior space of a tire in the forming end.

Abstract: Provided is a chip on film (COF) type semiconductor package. The COF type semiconductor device includes a flexible film, an electrode pattern formed on the flexible film, a semiconductor device disposed on the electrode pattern, a conductive pad disposed between the electrode pattern and the semiconductor device to electrically connect the semiconductor device with the electrode pattern, and a first protective layer which seals the conductive pad and the semiconductor device and is formed on a portion of the electrode pattern and the semiconductor device. The first protective layer includes a heat conductive material for dissipating heat generated from the semiconductor device.

Abstract: Provided are an apparatus and method of packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and on which packaging areas are defined along the extending direction thereof. The flexible substrate is transferred through a packaging module. An empty area, on which a semiconductor device is not mounted, is detected by a camera from among the packaging areas. Heat dissipation paint composition is applied on at least one semiconductor device located in a processing region of the packaging module by a screen printing process. Thus, a heat dissipation layer configured to package the semiconductor device is formed. Here, operations of the packaging module are controlled by a control unit so that the packaging process is omitted with respect to the empty area.

Abstract: Provided is a method of packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and including packaging areas arranged along the extending direction thereof. An empty area, on which a semiconductor device is not mounted, is detected from among the packaging areas. When the empty area is detected, a heat dissipation paint composition is applied on the semiconductor devices mounted on the remaining packaging areas except for the empty area to form first heat dissipation layers. When the empty is not detected, the heat dissipation paint composition is applied on the semiconductor devices mounted on the packaging areas to form second heat dissipation layers. Here, the first dissipation layers are formed by a potting process, and the second heat dissipation layers are formed by a screen printing process.

Abstract: Provided are a method and an apparatus for packaging semiconductor devices mounted on a flexible substrate having a longitudinally extending tape shape and defining packaging areas in a longitudinally extending direction along the flexible substrate. The flexible substrate is transferred through a packaging module. An empty area on which a semiconductor device is not mounted is detected from among the packaging areas, and a heat dissipation layer is formed on at least one semiconductor device located in a processing region of the packaging module so as to package the semiconductor device. The heat dissipation layer is formed by coating the semiconductor device with a heat dissipation paint composition, and operations of the packaging module are controlled by a controller to omit a packaging process on the empty area.

Abstract: Disclosed are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a flexible substrate provided with signal lines, a semiconductor device bonded on the flexible substrate and configured to be connected to the signal lines through at least one of gold bumps or solder bumps, and a heat dissipation layer formed on at least a portion of the flexible substrate and at least a portion of the semiconductor device. The heat dissipation layer is formed by coating a heat dissipation paint composition and curing the heat dissipation paint composition. The heat dissipation paint composition includes an epichlorohydrin bisphenol A resin, a modified epoxy resin, a curing agent, a curing accelerator and a heat dissipation filler.

Abstract: Provided is a chip on film (COF) type semiconductor package. The COF type semiconductor device includes a flexible film, an electrode pattern formed on the flexible film, a semiconductor device disposed on the electrode pattern, a conductive pad disposed between the electrode pattern and the semiconductor device to electrically connect the semiconductor device with the electrode pattern, and a first protective layer which seals the conductive pad and the semiconductor device and is formed on a portion of the electrode pattern and the semiconductor device. The first protective layer includes a heat conductive material for dissipating heat generated from the semiconductor device.

Abstract: A method of encrypting a motion picture file and a method of digital rights management using the same, wherein encryption method includes: extracting information on the location of at least one video sample, which is a real-time streaming unit, from meta-data of the motion picture file; extracting the video samples based on the location information; encrypting the extracted video samples, excluding a start code within a video sample header of each extracted video sample, based on predetermined encryption information; and producing an encrypted motion picture file by recombining the encrypted video samples. Since the file is encrypted in units of video object planes (VOPs) while maintaining an MEPG-4 file format, the encryption method can be easily applied to a completed file format and streaming service is also possible.

Abstract: A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material.

Abstract: A heat releasing semiconductor package, a method for manufacturing the same, and a display apparatus including the same. The heat releasing semiconductor package includes a film, an electrode pattern formed over the film, a semiconductor device mounted over the electrode pattern, and a first heat releasing layer formed over the semiconductor device including the electrode pattern, the first heat releasing layer including a first adhesive and a first heat releasing material.

Abstract: A method of encrypting a motion picture file and a method of digital rights management using the same, wherein encryption method includes: extracting information on the location of at least one video sample, which is a real-time streaming unit, from meta-data of the motion picture file; extracting the video samples based on the location information; encrypting the extracted video samples, excluding a start code within a video sample header of each extracted video sample, based on predetermined encryption information; and producing an encrypted motion picture file by recombining the encrypted video samples. Since the file is encrypted in units of video object planes (VOPs) while maintaining an MEPG-4 file format, the encryption method can be easily applied to a completed file format and streaming service is also possible.