Patents by Inventor Jun ITABASHI

Jun ITABASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermocouple structure, heat treatment apparatus, and method of manufacturing thermocouple structure
    Patent number: 11815407
    Abstract: A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: November 14, 2023
    Assignees: Tokyo Electron Limited, Furüya Metal Co., Ltd.
    Inventors: Hisashi Inoue, Masahiro Kobayashi, Yasuaki Kikuchi, Tatsuya Yamaguchi, Koji Yoshii, Kensuke Morita, Jun Itabashi
  • THERMOCOUPLE STRUCTURE, HEAT TREATMENT APPARATUS, AND METHOD OF MANUFACTURING THERMOCOUPLE STRUCTURE
    Publication number: 20210063247
    Abstract: A thermocouple structure according to one aspect of the present disclosure includes a first element wire, second element wires formed of a material different from the first element wire, an insulating covering member covering at least one of the first element wire and the second element wires, and a protective tube accommodating the first element wire and the second element wire. Each of the second element wires is bonded to a different position on the first element wire.
    Type: Application
    Filed: August 31, 2020
    Publication date: March 4, 2021
    Inventors: Hisashi INOUE, Masahiro KOBAYASHI, Yasuaki KIKUCHI, Tatsuya YAMAGUCHI, Koji YOSHII, Kensuke MORITA, Jun ITABASHI