Abstract: A lead frame includes: a support portion having a through-hole formed in as end; a lead; and a heat dissipation plate welded with the support portion in one opening of the through-hole. A manufacturing method of a lead frame includes: shaping a frame member from a metal plate, the frame member including a support portion having a through-hole formed in an end, and a lead; and welding a heat dissipation plate with the support portion in one opening of the through hole.

Abstract: A circuit board includes a first metal layer; a second metal layer that is arranged on the first metal layer; and a sealing resin with which a space between the first metal layer and the second metal layer is filled, wherein the second metal layer includes an electrode that protrudes from an upper surface of the sealing resin and that has an end face on which an electronic part is mountable; and an interlayer connector whose upper surface is exposed in a position lower than the end face of the electrode from the upper surface of the sealing resin and that makes contact with the first metal layer.

Abstract: A lead frame includes a support portion that has one end on which a first part and a second part that has a smaller thickness than the first part are arranged, a lead, and a heat sink that is welded to the support portion in the second part. A method of manufacturing the lead frame includes forming, from a metal plate, a frame member that includes a support portion and a lead, where the support portion has one end on which a first part and a second part that has a smaller thickness than the first part are arranged, and welding a heat sink to the support portion in the second part.

Abstract: A lead frame includes a first frame member including a die pad; a second frame member that is layered on the first frame member and that includes a lead; and a resin with which a space around the die pad and the lead is filled, wherein the die pad includes a rising portion and a buried portion, the rising portion rises from the resin, the buried portion is buried in the resin and has a mount surface on which a semiconductor element is to be mounted and a side surface that is continuous to the mount surface, and the side surface is covered with the resin and has a constriction that is depressed in a direction parallel to the mount surface.

Abstract: A lead frame includes: a support portion having a through-hole formed in as end; a lead; and a heat dissipation plate welded with the support portion in one opening of the through-hole. A manufacturing method of a lead frame includes: shaping a frame member from a metal plate, the frame member including a support portion having a through-hole formed in an end, and a lead; and welding a heat dissipation plate with the support portion in one opening of the through hole.

Abstract: A circuit board includes a first metal layer; a second metal layer that is arranged on the first metal layer; and a sealing resin with which a space between the first metal layer and the second metal layer is filled, wherein the second metal layer includes an electrode that protrudes from an upper surface of the sealing resin and that has an end face on which an electronic part is mountable; and an interlayer connector whose upper surface is exposed in a position lower than the end face of the electrode from the upper surface of the sealing resin and that makes contact with the first metal layer.