Patents by Inventor Jun-Jae Wu

Jun-Jae Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic-Copper Foil Bonding Method
    Publication number: 20090152237
    Abstract: A ceramic-copper foil bonding method includes wet-oxidizing a copper foil such that a surface of the copper foil is oxidized to a copper oxide layer, contacting the copper oxide layer with a surface of a ceramic substrate, and bonding the copper oxide layer of the copper foil to the surface of the ceramic substrate by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil so that the opposite surface is not oxidized during wet-oxidizing the copper foil.
    Type: Application
    Filed: December 16, 2008
    Publication date: June 18, 2009
    Applicant: High Conduction Scientific Co., Ltd.
    Inventors: Wen-Chung Chiang, Keng-Chung Wu, Jun-Jae Wu