Abstract: Embodiments of a multi-stage spring system are provided herein. In some embodiments, a multi-stage spring system includes a spring assembly having at least one resilient element, wherein the spring assembly has a first spring constant when deflected up to a first distance, a greater, second spring constant when deflected beyond the first distance and up to a second distance, and a greater, third spring constant when deflected beyond the second distance and up to a third distance, and wherein the spring assembly stores mechanical energy when deflected towards a contact surface that biases the spring assembly away from the contact surface when released.

Abstract: Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.

Abstract: Methods and apparatus for switching electrical signals are provided herein. In some embodiments a smart switch is provided, the smart switch may include a switch having a wipe capability; a monitor coupled to the switch for monitoring a performance characteristic thereof; and a controller configured to provide a stepped change in wipe applied by the switch between closing cycles thereof in response to the monitored performance characteristic. In some embodiments, an electronic device may be provided having a smart switch disposed therein.

Abstract: Embodiments of the present invention provide microelectromechanical systems (MEMS) switching methods and apparatus having improved performance and lifetime as compared to conventional MEMS switches. In some embodiments, a MEMS switch may include a resilient contact element comprising a beam and a tip configured to wipe a contact surface; and a MEMS actuator having an open position that maintains the tip and the contact surface in a spaced apart relation and a closed position that brings the tip into contact with the contact surface, wherein the resilient contact element and the MEMS actuator are disposed on a substrate and are movable in a plane substantially parallel to the substrate. In some embodiments, various contact elements are provided for the MEMS switch. In some embodiments, various actuators are provided for control of the operation of the MEMS switch.

Abstract: Embodiments of a multi-stage spring system are provided herein. In some embodiments, a multi-stage spring system includes a spring assembly having at least one resilient element, wherein the spring assembly has a first spring constant when deflected up to a first distance, a greater, second spring constant when deflected beyond the first distance and up to a second distance, and a greater, third spring constant when deflected beyond the second distance and up to a third distance, and wherein the spring assembly stores mechanical energy when deflected towards a contact surface that biases the spring assembly away from the contact surface when released.

Abstract: Methods and apparatus for switching electrical signals are provided herein. In some embodiments a smart switch is provided, the smart switch may include a switch having a wipe capability; a monitor coupled to the switch for monitoring a performance characteristic thereof; and a controller configured to provide a stepped change in wipe applied by the switch between closing cycles thereof in response to the monitored performance characteristic. In some embodiments, an electronic device may be provided having a smart switch disposed therein.

Abstract: A shielded through-via that reduces the effect of parasitic capacitance between the through-via and surrounding wafer while providing high isolation from neighboring signals. A shield electrode is formed in the insulating region and spaced apart from the through-via. A coupling element couples at least the time-varying portion of the signal carried on the through-via to the shield electrode. This reduces the effect of any parasitic capacitance between the through-via and the shield electrode, hence the surrounding wafer.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A method is provided for sensing and measuring an electrical current. The current to be measured is applied to a deflectable member in a sensing module in the presence of a magnetic field. Deflection of the member is detected as an indication of the current. A nulling current may be applied to one or more additional deflectable members mechanically linked to the deflectable member. Feedback or readout signals indicative of deflection of the members are monitored. The nulling current is modulated to drive the feedback signals to a desired level. The nulling current value is converted to a value representative of the current to be measured.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member, Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A current sensor includes a deflectable member disposed in a magnetic field. Nulling or compensating members may be mechanically coupled to the deflectable member. Feedback or readout devices coupled to the structure provide signals indicative of deflection of the deflectable member under the influence of applied current and the magnetic field. Nulling current applied to the nulling members tends to oppose deflection of the deflectable member. The nulling current may be modulated to drive the feedback signal to a desired level and is used as a basis for calculating the current to be measured. The current may be measured directly upon calibration of feedback devices coupled to the deflectable member or to the nulling members. Arrays of sensors may be coupled to common busses for applying measured and nulling currents to sensors of the arrays and for detecting feedback signals.

Abstract: A method is provided for sensing and measuring an electrical current. The current to be measured is applied to a deflectable member in a sensing module in the presence of a magnetic field. Deflection of the member is detected as an indication of the current. A nulling current may be applied to one or more additional deflectable members mechanically linked to the deflectable member. Feedback or readout signals indicative of deflection of the members are monitored. The nulling current is modulated to drive the feedback signals to a desired level. The nulling current value is converted to a value representative of the current to be measured.