Patents by Inventor JUN JIANT

JUN JIANT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER GROUNDING METHODOLOGY
    Publication number: 20100103583
    Abstract: An apparatus for increasing electric conductivity to a wafer substrate, when exposed to electron beam irradiation, is disclosed. More specifically, a methodology to breakdown the insulating layer on wafer backside is provided to significantly reduce the damage on the wafer backside while proceeding with the grounding process.
    Type: Application
    Filed: October 27, 2008
    Publication date: April 29, 2010
    Applicant: HERMES-MICROVISION, INC.
    Inventors: YI XIANG WANG, JUYING DOU, JUN JIANT, ZHENG FAN, QINGYU MENG