Patents by Inventor Jun Jie Xu

Jun Jie Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9848129
    Abstract: The present disclosure is directed to a system that can incorporate information into captured images. The system includes a first encoder that can process image information captured from an image component and a second encoder that can process information collected from a sensor. The system further includes a synthesizer to combine the outputs from both the first encoder and the second encoder. The synthesizer can then generate an output and transmit it to a decoder, which decodes the generated output and then transmits the decoded output to a display. The display then visually presents the decoded output to a user. By this arrangement, the system enables a user to view information collected by the sensor and the captured image at the same time.
    Type: Grant
    Filed: July 5, 2016
    Date of Patent: December 19, 2017
    Assignee: Chengdu Sioeye Technology Co., Ltd.
    Inventors: Jun-jie Xu, Jian Ren
  • Publication number: 20170013202
    Abstract: The present disclosure is directed to a system that can incorporate information into captured images. The system includes a first encoder that can process image information captured from an image component and a second encoder that can process information collected from a sensor. The system further includes a synthesizer to combine the outputs from both the first encoder and the second encoder. The synthesizer can then generate an output and transmit it to a decoder, which decodes the generated output and then transmits the decoded output to a display. The display then visually presents the decoded output to a user. By this arrangement, the system enables a user to view information collected by the sensor and the captured image at the same time.
    Type: Application
    Filed: July 5, 2016
    Publication date: January 12, 2017
    Inventors: Jun-jie XU, Jian REN
  • Patent number: 8018039
    Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.
    Type: Grant
    Filed: March 6, 2008
    Date of Patent: September 13, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Jae Hak Yee, Frederick Cruz Santos, Yong Yong Xia, Jun Jie Xu
  • Publication number: 20090224389
    Abstract: An integrated circuit package system comprising: providing an integrated circuit die having an active side; forming a first internal stacked module and a second internal stacked module over the active side of the integrated circuit die; and coupling an electrical interconnect between the first internal stacked module or the second internal stacked module and the active side.
    Type: Application
    Filed: March 6, 2008
    Publication date: September 10, 2009
    Inventors: Jae Hak Yee, Frederick Cruz Santos, Yong Yong Xia, Jun Jie Xu