Patents by Inventor Jun-Kai Bai

Jun-Kai Bai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame with conductive clip for mounting a semiconductor die with reduced clip shifting
    Patent number: 10163762
    Abstract: A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: December 25, 2018
    Assignee: VISHAY GENERAL SEMICONDUCTOR LLC
    Inventors: Hui-Ying Ding, Pengnian Wang, Tao Yu, Jun-Feng Liu, Jun-Kai Bai, Chih-Ping Peng
  • LEAD FRAME WITH CONDUCTIVE CLIP FOR MOUNTING A SEMICONDUCTOR DIE WITH REDUCED CLIP SHIFTING
    Publication number: 20160365305
    Abstract: A semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts. A lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die. An upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die. A lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member. The surface portion of the lead terminal and/or the second portion of the conductive member has a series of grooves disposed therein. Packaging material encapsulates the semiconductor die, at least a portion of the lead frame, at least a portion of the upper conducive member and at least a portion of the lead terminal.
    Type: Application
    Filed: June 10, 2015
    Publication date: December 15, 2016
    Inventors: Hui-Ying Ding, Pengnian Wang, Tao Yu, Jun-Feng Liu, Jun-Kai Bai, Chih-Ping Peng