Patents by Inventor Jun Kang NG

Jun Kang NG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11953312
    Abstract: The invention includes a system and method for obtaining high-resolution 3D images of objects. The system includes three cameras and three light sources that have different wavelengths (e.g. a red light source, a blue light source and a green light source). Each camera simultaneously captures a color image of the object. A processor separates each of the red light images, the blue light images and the green light images into separate monochrome images using each of the red light source, blue light source and green light source. The quality of the images are not subject to limited resolution of conventional RBG images. Because three different wavelengths of light are used, the surface can be accurately imaged, regardless of its characteristics (e.g. reflectivity and transparency). The system is well suited for industrial uses that require a high volume of objects, particularly those of mixed material, to be rapidly inspected for defects as small as a few microns.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: April 9, 2024
    Assignee: MIT SEMICONDUCTOR (TIAN JIN) CO., LTD
    Inventors: Kok Weng Wong, Albert Archmawety, Jun Kang Ng, Chee Chye Lee
  • Patent number: 11825211
    Abstract: The present invention includes a system and method for obtaining high-resolution images of objects such as electrical components. The system includes a monochrome camera and three light sources of different wavelengths (e.g. a red light source, a blue light source and a green light source). The camera successively captures a red light image, a blue light image and a green light image of the object. A processor combines the red light image, the blue light image and the green light image into a single high-resolution true color image. Because each image is obtained from an independent light source, the resolution is not limited by the Bayer (RGB) color model. The system is well suited for materials composed of different materials that may react differently to light sources based on its wavelength.
    Type: Grant
    Filed: March 21, 2019
    Date of Patent: November 21, 2023
    Assignee: MIT SEMICONDUCTOR (TIAN JIN) CO., LTD
    Inventors: Kok Weng Wong, Albert Archwamety, Jun Kang Ng, Chee Chye Lee
  • Publication number: 20220159182
    Abstract: The present invention includes a system and method for obtaining high-resolution images of objects such as electrical components. The system includes a monochrome camera and three light sources of different wavelengths (e.g. a red light source, a blue light source and a green light source). The camera successively captures a red light image, a blue light image and a green light image of the object. A processor combines the red light image, the blue light image and the green light image into a single high-resolution true color image. Because each image is obtained from an independent light source, the resolution is not limited by the Bayer (RGB) color model. The system is well suited for materials composed of different materials that may react differently to light sources based on its wavelength.
    Type: Application
    Filed: March 21, 2019
    Publication date: May 19, 2022
    Inventors: Kok Weng WONG, Albert ARCHWAMETY, Jun Kang NG, Chee Chye LEE
  • Publication number: 20220107174
    Abstract: The invention includes a system and method for obtaining high-resolution 3D images of objects. The system includes three cameras and three light sources that have different wavelengths (e.g. a red light source, a blue light source and a green light source). Each camera simultaneously captures a color image of the object. A processor separates each of the red light images, the blue light images and the green light images into separate monochrome images using each of the red light source, blue light source and green light source. The quality of the images are not subject to limited resolution of conventional RBG images. Because three different wavelengths of light are used, the surface can be accurately imaged, regardless of its characteristics (e.g. reflectivity and transparency). The system is well suited for industrial uses that require a high volume of objects, particularly those of mixed material, to be rapidly inspected for defects as small as a few microns.
    Type: Application
    Filed: February 1, 2019
    Publication date: April 7, 2022
    Inventors: Kok Weng WONG, Albert ARCHWAMETY, Jun Kang NG, Chee Chye LEE